BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC8641HX1000HC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz			33 mm	CMOS	1.05 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	1	Not Qualified	166.66 rpm	YES
MPC8248ZQPIEX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V					BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8567ECVTANGG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM													Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	800 rpm
MPC8378ECVRAGGA	NXP Semiconductors	MICROPROCESSOR		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V					BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	400 rpm	YES
P1020NSE2DFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		12			BOTTOM	2.46 mm	31 mm		YES	32				31 mm	CMOS	1 V	4		1 mm	FIXED POINT	S-PBGA-B689			533 rpm	NO
MC8640TVU1000HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
MPC8533VTARFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	.4 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1067 rpm	YES	e2
MPC8270CVRKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MPC8555ECPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8378ECVRAJDA	NXP Semiconductors	MICROPROCESSOR		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V					BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	266 rpm	YES
MPC8541EPXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC5543EVUANG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM										CMOS			Microprocessors	1 mm		S-PBGA-B783		Not Qualified	800 rpm
MPC850SRVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC8271CZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8541EPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MC8641DHX1333JE	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1 V				Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	1333 MHz	30	245	33 mm	CMOS	1.05 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	166.66 rpm	YES	e0
MPC860DPVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC8568CVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm	33 mm		YES	0	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
MPC8543CVJANGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8543ECPXAQGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e0
P1021SXN2FFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689			667 rpm	YES	e2
MPC8347EZQALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES	e0
MPC8547EVJAUJD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM							40	260		CMOS			Microprocessors	1 mm		S-PBGA-B783	3	Not Qualified	1333 rpm
MC8641HX1333NB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MPC8347ZQAGFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	400 rpm	YES
MPC8271CVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8248VRTMFX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V					BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8271ZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V					BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8280CZQFX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	133 rpm	NO
MPC8541EVTALDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
P1021SSE2FFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689			667 rpm	YES	e2
MPC8347CZQADDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8547CVJAUJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e2
P1021NSE2DFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689			533 rpm	YES	e2
MPC8555EVTALF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V					BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES
MPC860DPVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC8541PXAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
P1011SSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7			BOTTOM	2.46 mm	31 mm		YES	32				31 mm	CMOS	1 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
MPC8536CVJANG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1,1.5/1.8,1.8/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM										CMOS			Microprocessors	1 mm		S-PBGA-B783		Not Qualified	800 rpm
P1013NXN2LFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689			1067 rpm	YES	e2
MPC8347CVRAJF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES	e1
MPC862PZP80B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel		0 Cel		BOTTOM											3.3 V		Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	80 rpm
MPC860TCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC8555ECPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
P1021SSE2DFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689			533 rpm	YES	e2
P1020SSN2HFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		12			BOTTOM	2.46 mm	31 mm		YES	32				31 mm	CMOS	1 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
P2041NXN1PNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS	1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
MC7447AVU867NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V					BOTTOM	2.8 mm	25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS	1.3 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	867 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.