BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8270CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
OSD3358-512M-ICB	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				16			GRID ARRAY			85 Cel		-40 Cel		BOTTOM	2.6 mm		27 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	8			245	27 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-PBGA-B400	4		1000 rpm	YES
MPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			13			GRID ARRAY		1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272	3		400 rpm	YES	e1
MCF5372LCVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	80 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
OSD3358-512M-ISM	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES							GRID ARRAY			85 Cel		-40 Cel		BOTTOM	3.08 mm		21 mm	GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE	YES				245	21 mm	CMOS						1.27 mm		S-PBGA-B256	4		1000 rpm
OSD3358-512M-BSM	Octavo Systems	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	NO	YES							GRID ARRAY	BGA256, 16X16,50		85 Cel		0 Cel		BOTTOM	3.08 mm		21 mm	GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE	YES				245	21 mm	CMOS	2000 mA	1.1 V				1.27 mm	FIXED POINT	S-PBGA-B256	4		1000 rpm	NO
MCF5372LCVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY	BGA196,14X14,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260		CMOS					Microprocessors	1 mm		S-PBGA-B196	3	Not Qualified	240 rpm
MCF54415CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES	e2
MPC5200CVR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32			GRID ARRAY		1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC8270CVRMIBA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32		GRID ARRAY		1.45 V					BOTTOM	2.55 mm		27 mm		YES	64	266 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516			66.67 rpm	NO
OSD3358-512M-BCB	Octavo Systems	MICROPROCESSOR, RISC	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				16			GRID ARRAY			85 Cel		0 Cel		BOTTOM	2.6 mm		27 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	YES	8			245	27 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-PBGA-B400	4		1000 rpm	YES
AM3505AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1400 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MCF5329CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MC7448THX1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.05 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e0
OSD3358-512M-IND	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		8		28			GRID ARRAY	BGA400,20X20,50		85 Cel	1	-40 Cel		BOTTOM	2.6 mm	65536	27 mm	64kbytes shared l3 ram also available	YES	16			245	27 mm	CMOS	2000 mA	1.1 V				1.27 mm	FIXED POINT	S-PBGA-B400	4		1000 rpm	NO
MCF5272VM66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MCF54418CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MCF5485CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
KMPC8270CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32		GRID ARRAY		1.45 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MCF5474VR266	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8		32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
AM3505AZERAC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz	30	260	23 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MCF5485CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
AM3505AZER	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1400 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MCF5272VM66R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32	3.3	GRID ARRAY	BGA196,14X14,40	3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
P3041NSN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA1295,36X36,40	.95 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133 MHz	30	245	37.5 mm	CMOS		1 V	8	8		1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
ATSAMA5D27C-LD2G-CUR22	Microchip Technology	MICROPROCESSOR, RISC		BALL	361	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY		1.1 V	85 Cel	1	-40 Cel		BOTTOM		131072			YES	16	24 MHz				CMOS		1.2 V	51	7			FLOATING POINT	S-PBGA-B361			500 rpm	YES
ATSAMA5D27C-LD2G-CU22	Microchip Technology	MICROPROCESSOR, RISC		BALL	361	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY		1.1 V	85 Cel	1	-40 Cel		BOTTOM		131072			YES	16	24 MHz				CMOS		1.2 V	51	7			FLOATING POINT	S-PBGA-B361			500 rpm	YES
SPC5125YVN400R	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
MCF5484CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
SPC5200CBV400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC8321ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
P1022NSN2MHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V				32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FIXED POINT	S-PBGA-B689	3		1200 rpm	YES	e2
AM3517AZERC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MCF54417CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC8270VRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8321VRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
P4080NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
MPC8313CVRAFFC	NXP Semiconductors	MICROPROCESSOR		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			32	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3		333 rpm	YES	e2
AM3517AZERAC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz	30	260	23 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
P1021NXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
MC7455ARX1000LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	1000 rpm	YES
KMPC866TZP133A	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32	32		GRID ARRAY							BOTTOM	2.52 mm		25 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	32	133 MHz			25 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	133 rpm	YES
MCF54416CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC852TVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
AM3505AZERC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz	30	260	23 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AM3517AZERA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MPC8321VRADDC	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
SPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.