BGA Microprocessors 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC8640DTHX1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e0
MCF5327CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm	15 mm		YES	32	80 MHz	40	260	15 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MPC8270ZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V		Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8313VRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8343VRADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC8347ECZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
MPC860PCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC880ZP80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
NHPXA270C5C312	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.375 V	26	32		GRID ARRAY		1.1875 V				TIN SILVER COPPER	BOTTOM				YES	32	3.6864 MHz				CMOS		1.25 V				FIXED POINT	S-PBGA-B360		Not Qualified	312 rpm	YES	e1
P1011NSN2DFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7			BOTTOM	2.46 mm	31 mm		YES	32		40	260	31 mm	CMOS		1 V	4		1 mm	FIXED POINT	S-PBGA-B689	3		533 rpm	NO
P1013NXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P1021NXE2FFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		667 rpm	YES	e2
PPC460EX-SUA1000T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	32			GRID ARRAY		1.2 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	35 mm		YES	32	100 MHz			35 mm	CMOS		1.25 V			1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	1000 rpm	YES	e1
AU80586GE025D/SLB73	Intel	MICROPROCESSOR, RISC		BALL	437	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1/1.5	GRID ARRAY	BGA437,21X21,40						BOTTOM										CMOS	3000 mA			Microprocessors	1 mm		S-PBGA-B437		Not Qualified	1600 rpm
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LE80537GF0484MSLGFV	Intel	MICROPROCESSOR		BALL	479	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	YES		0	64		GRID ARRAY							BOTTOM				NO	0					CMOS						FIXED POINT	X-PBGA-B479			2160 rpm	YES
MCF5475ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	NICKEL GOLD	BOTTOM	2.55 mm	27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e4
MPC5200VR400B	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32	32		GRID ARRAY		1.42 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC5200VR400BR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	13			GRID ARRAY		1.42 V	70 Cel		0 Cel		BOTTOM	2.65 mm	27 mm		YES	32	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B272			400 rpm	YES
MPC8241LVR266D	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V				TIN SILVER COPPER	BOTTOM	2.56 mm	25 mm		YES	64	66 MHz	30	245	25 mm	CMOS		1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	266 rpm	YES	e1
MPC8275CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V				TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V		Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
P2020NSE2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4	Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
P2020NXN2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4	Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
PPC460EX-SUA600T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	32			GRID ARRAY		1.2 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	35 mm		YES	32	100 MHz			35 mm	CMOS		1.25 V			1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	600 rpm	YES	e1
X66AK2H06AAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	24			GRID ARRAY		.95 V	85 Cel		0 Cel		BOTTOM	3.75 mm	40 mm	ALSO OPERATES AT 1200 GHZ	YES	16	156.25 MHz			40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517			1400 rpm	YES
MPC8343ZQADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
FWIXP420BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V	32	32	1.3,3.3	GRID ARRAY	BGA492,26X26,50	1.235 V	70 Cel		0 Cel		BOTTOM	2.59 mm	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.33 MHz			35 mm	CMOS		1.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B492	1	Not Qualified	400 rpm	NO
MCF5484CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V			1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF53721CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm	15 mm		YES	32	80 MHz	40	260	15 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MPC5200CBV266	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32			GRID ARRAY		1.42 V	85 Cel		-40 Cel		BOTTOM	2.65 mm	27 mm		YES	32	35 MHz			27 mm	CMOS		1.5 V			1.27 mm	FIXED POINT	S-PBGA-B272		Not Qualified	266 rpm	YES
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V		Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
P1022NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES		133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P2010NXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16	32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P3041NXN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.04 V	0			GRID ARRAY		.96 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
AF82801JIRSLB8S	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES				1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM										CMOS				Other uPs/uCs/Peripheral ICs	1 mm		S-PBGA-B676		Not Qualified
LUPXA255A0C400	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.43 V	26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm	17 mm		YES	32	3.6864 MHz	40	250	17 mm	CMOS		1.3 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC860DEZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
XPC860SRZP50C1	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.05 mm	25 mm			32	50 MHz			25 mm	CMOS		3.3 V		Other Microprocessor ICs	1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
FH8065301487715SR1RE	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES		16	64		GRID ARRAY							BOTTOM				YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS						FIXED POINT	R-XBGA-B1170			1910 rpm	YES
FH8065301487717SR1X6	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES		16	64		GRID ARRAY							BOTTOM				YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS						FIXED POINT	R-XBGA-B1170			1910 rpm	YES
GG8067402570801SR2M5	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1667	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	64		GRID ARRAY			85 Cel		-40 Cel		BOTTOM				NO	0					CMOS						FIXED POINT	S-PBGA-B1667			1500 rpm	NO
LUPXA255A0C200	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	26	32	1,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2 mm	17 mm		YES	32	3.6864 MHz			17 mm	CMOS		1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	200 rpm	YES	e1
MCF54452VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC8321EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC860ENCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.