BGA Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-21469KBCZ-X

Analog Devices

MICROPROCESSOR

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

24

32

GRID ARRAY

1.05 V

70 Cel

0 Cel

BOTTOM

1.8 mm

19 mm

YES

8

19 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

450 rpm

NO

ADSP-21469BBCZ-X

Analog Devices

MICROPROCESSOR

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

24

32

GRID ARRAY

1.05 V

85 Cel

-40 Cel

BOTTOM

1.8 mm

19 mm

YES

8

19 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

450 rpm

NO

ADSP-21462BBCZ-ENG

Analog Devices

MICROPROCESSOR

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

1.8 mm

19 mm

YES

16

19 mm

CMOS

1 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

NO

ADSP-21469KBCZ-ENG

Analog Devices

MICROPROCESSOR

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

16

GRID ARRAY

1.05 V

70 Cel

0 Cel

BOTTOM

1.8 mm

19 mm

YES

16

19 mm

CMOS

1 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

450 rpm

NO

ADSP-21467KBCZ-ENG

Analog Devices

MICROPROCESSOR

COMMERCIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

70 Cel

0 Cel

BOTTOM

1.8 mm

19 mm

YES

16

19 mm

CMOS

1 mm

FLOATING POINT

S-PBGA-B324

Not Qualified

450 rpm

NO

ST40RA150XHA

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

1.8,3.3

GRID ARRAY

BGA372,20X20,50

1.65 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.6 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

27 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B372

Not Qualified

150 rpm

YES

e0

STPCC0110BTC3

STMicroelectronics

MICROPROCESSOR

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

12

64

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

NO

64

14.3 MHz

35 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B388

Not Qualified

100 rpm

YES

e0

STLS2F02-LP

STMicroelectronics

MICROPROCESSOR

INDUSTRIAL

BALL

452

BGA

SQUARE

PLASTIC/EPOXY

YES

64

1.26,1.8,3.3

GRID ARRAY

BGA452,26X26,40

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

1 mm

S-PBGA-B452

Not Qualified

800 rpm

ST40RA200XH6

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

1.8,3.3

GRID ARRAY

BGA372,20X20,50

1.8 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.6 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

27 mm

CMOS

1.87 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B372

Not Qualified

200 rpm

YES

e0

STPCI0175BTC3

STMicroelectronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA388,26X26,50

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

3.3 V

Microprocessors

1.27 mm

S-PBGA-B388

Not Qualified

75 rpm

e0

ST40RA150XH6

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

GRID ARRAY

1.65 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

YES

32

27 MHz

CMOS

1.8 V

FLOATING POINT

S-PBGA-B372

Not Qualified

150 rpm

YES

e0

STPCI0112BTC3

STMicroelectronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA388,26X26,50

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

3.3 V

Microprocessors

1.27 mm

S-PBGA-B388

Not Qualified

120 rpm

e0

ST40RA166XH6E

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

GRID ARRAY

1.65 V

85 Cel

-40 Cel

BOTTOM

2.6 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

27 mm

CMOS

1.8 V

1.27 mm

FLOATING POINT

S-PBGA-B372

Not Qualified

166 rpm

YES

STPCD0113BTC3

STMicroelectronics

MICROPROCESSOR

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

NO

64

133 MHz

35 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B388

Not Qualified

133 rpm

YES

e0

STPCC0112BTC3

STMicroelectronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA388,26X26,50

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

3.3 V

Microprocessors

1.27 mm

S-PBGA-B388

Not Qualified

120 rpm

e0

ST40RA166XH1

STMicroelectronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

1.8,3.3

GRID ARRAY

BGA372,20X20,50

1.65 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.6 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

27 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B372

Not Qualified

166 rpm

YES

e0

STPCC0175BTI3

STMicroelectronics

MICROPROCESSOR

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

32

32

GRID ARRAY

3 V

BOTTOM

2.38 mm

35 mm

NO

32

14.3 MHz

35 mm

CMOS

3.3 V

1.27 mm

FLOATING POINT

S-PBGA-B388

Not Qualified

75 rpm

YES

STPCD0110BTC3

STMicroelectronics

MICROPROCESSOR

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

NO

64

100 MHz

35 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B388

Not Qualified

100 rpm

YES

e0

ST40RA200XH6E

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

GRID ARRAY

1.8 V

85 Cel

-40 Cel

BOTTOM

2.6 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

27 mm

CMOS

1.87 V

1.27 mm

FLOATING POINT

S-PBGA-B372

Not Qualified

200 rpm

YES

STPCI0110BTC3

STMicroelectronics

MICROPROCESSOR, RISC

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA388,26X26,50

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

3.3 V

Microprocessors

1.27 mm

S-PBGA-B388

Not Qualified

100 rpm

e0

ST40RA166XH6

STMicroelectronics

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

372

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

1.8,3.3

GRID ARRAY

BGA372,20X20,50

1.65 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.6 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

27 MHz

27 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B372

Not Qualified

166 rpm

YES

e0

STPCC0175BTC3

STMicroelectronics

MICROPROCESSOR

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

NO

32

14.3 MHz

35 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B388

Not Qualified

75 rpm

YES

e0

STPCD0112BTC3

STMicroelectronics

MICROPROCESSOR

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

NO

64

120 MHz

35 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B388

Not Qualified

120 rpm

YES

e0

P2020NXE2KFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1000 rpm

NO

P2020NSE2NFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

e2

T4241NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY

.995 V

TIN SILVER COPPER

BOTTOM

3.33 mm

45 mm

YES

64

133.3 MHz

30

250

45 mm

CMOS

1.025 V

1 mm

FIXED POINT

S-PBGA-B1932

3

1500 rpm

YES

e1

P5021NXE7VNB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

P2020PXE2MFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1200 rpm

NO

P2020NSN2MHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

40

260

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1200 rpm

NO

e2

P2020NXN2NHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

e2

XPC862PZP66B

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

GRID ARRAY

3.135 V

BOTTOM

2.05 mm

25 mm

YES

32

25 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B357

66 rpm

YES

XPC850DEZT80BU

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

26

32

GRID ARRAY

3.135 V

95 Cel

0 Cel

BOTTOM

2.35 mm

23 mm

YES

32

23 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B256

80 rpm

YES

P5021NXE1VNB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

P2020NXE2NFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

-40 Cel

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

XPC850CZT50BU

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

26

32

GRID ARRAY

3.135 V

95 Cel

-40 Cel

BOTTOM

2.35 mm

23 mm

YES

32

23 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B256

50 rpm

YES

XPC7455RX933PC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

483

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.6 V

36

32

1.3,1.5/2.5,1.8/2.5

GRID ARRAY

BGA483,22X22,50

1.52 V

Tin/Lead (Sn/Pb)

BOTTOM

3.2 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.57 V

Microprocessors

1.27 mm

FLOATING POINT

S-CBGA-B483

Not Qualified

933 rpm

YES

e0

P5021PSN7VNB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

XPC7445RX800LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.65 V

36

32

GRID ARRAY

BGA360,19X19,50

1.55 V

105 Cel

0 Cel

BOTTOM

3.2 mm

25 mm

YES

64

133 MHz

25 mm

CMOS

1.6 V

1.27 mm

FLOATING POINT

S-CBGA-B360

800 rpm

YES

PPC7457RX867NB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

CMOS

1.1 V

X-PBGA-B

867 rpm

P2020NXE2HHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

NO

P2020PXN2NFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

P2020PXE2MHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1200 rpm

NO

XPC755BRX400LE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

2.1 V

32

32

GRID ARRAY

BGA360,19X19,50

1.9 V

105 Cel

0 Cel

BOTTOM

3.2 mm

25 mm

YES

64

100 MHz

25 mm

CMOS

2 V

1.27 mm

FLOATING POINT

S-CBGA-B360

400 rpm

YES

P2020PSN2HHC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

NO

P3041NSE7PNC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.04 V

0

GRID ARRAY

.96 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

0

133 MHz

30

245

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1500 rpm

YES

e1

P2020PSN2KHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1000 rpm

NO

P2020PSE2MHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1200 rpm

NO

P5021NSE1TMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

0

64

GRID ARRAY

BGA1295,36X36,40

1.05 V

105 Cel

12

0 Cel

BOTTOM

3.53 mm

37.5 mm

YES

0

37.5 mm

CMOS

1.1 V

8

2

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.