Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Motorola |
MICROPROCESSOR, RISC |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA357,19X19,50 |
3.135 V |
-40 Cel |
BOTTOM |
2.05 mm |
25 mm |
YES |
32 |
50 MHz |
25 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
FIXED POINT |
S-PBGA-B357 |
Not Qualified |
50 rpm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
689 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
16 |
GRID ARRAY |
1 V |
TIN SILVER |
BOTTOM |
2.46 mm |
31 mm |
YES |
64 |
100 MHz |
40 |
260 |
31 mm |
CMOS |
1.05 V |
1 mm |
FLOATING POINT |
S-PBGA-B689 |
3 |
1200 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.89 V |
16 |
GRID ARRAY |
BGA780,28X28,32 |
1.71 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.51 mm |
23 mm |
ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY |
YES |
64 |
30 |
245 |
23 mm |
CMOS |
1.8 V |
4 |
.8 mm |
FIXED POINT |
S-PBGA-B780 |
3 |
1500 rpm |
YES |
e1 |
|||||||||||||||||||||||||||
|
Ibm Microelectronics |
MICROPROCESSOR, RISC |
BALL |
575 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.75 V |
0 |
64 |
GRID ARRAY |
BGA576,24X24,40 |
2.65 V |
BOTTOM |
2.23 mm |
25 mm |
YES |
0 |
700 MHz |
25 mm |
CMOS |
2.7 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-CBGA-B575 |
Not Qualified |
1800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
360 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.35 V |
36 |
32 |
GRID ARRAY |
1.25 V |
TIN LEAD |
BOTTOM |
3.24 mm |
25 mm |
ALSO REQUIRES 1.8V OR 2.5V SUPPLY |
YES |
64 |
167 MHz |
40 |
260 |
25 mm |
CMOS |
1.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-B360 |
1 |
Not Qualified |
1167 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
360 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.35 V |
36 |
32 |
GRID ARRAY |
1.25 V |
TIN LEAD |
BOTTOM |
3.24 mm |
25 mm |
ALSO REQUIRES 1.8V OR 2.5V SUPPLY |
YES |
64 |
167 MHz |
40 |
260 |
25 mm |
CMOS |
1.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-B360 |
1 |
Not Qualified |
1167 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
360 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.35 V |
36 |
32 |
GRID ARRAY |
1.25 V |
BOTTOM |
2.8 mm |
25 mm |
ALSO REQUIRES 1.8V OR 2.5V SUPPLY |
YES |
64 |
167 MHz |
25 mm |
CMOS |
1.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-B360 |
1 |
Not Qualified |
1267 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
360 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.32 V |
36 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
1.25 V |
105 Cel |
0 Cel |
BOTTOM |
2.4 mm |
25 mm |
YES |
64 |
200 MHz |
40 |
260 |
25 mm |
CMOS |
1.3 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-CBGA-B360 |
1 |
Not Qualified |
1700 rpm |
YES |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1023 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.1 V |
16 |
32 |
GRID ARRAY |
1 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.77 mm |
33 mm |
YES |
64 |
30 |
245 |
33 mm |
CMOS |
1.05 V |
1 mm |
FLOATING POINT |
S-CBGA-B1023 |
3 |
1333 rpm |
YES |
e2 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
0 |
GRID ARRAY |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
YES |
0 |
CMOS |
1.2 V |
FIXED POINT |
S-PBGA-B196 |
250 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
8 |
32 |
32 |
GRID ARRAY |
BGA388,26X26,40 |
1.43 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
32768 |
27 mm |
YES |
32 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
16 |
4 |
1 mm |
FLOATING POINT |
S-PBGA-B388 |
3 |
YES |
e1 |
||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
32 |
32 |
GRID ARRAY |
1.43 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
66.66 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B388 |
3 |
Not Qualified |
266.66 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
32 |
32 |
GRID ARRAY |
1.43 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
66.66 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B388 |
3 |
Not Qualified |
266.66 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
0 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
620 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY |
BGA620,28X28,40 |
1.14 V |
105 Cel |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
2.46 mm |
29 mm |
ALSO REQUIRES 2.5V AND 3.3V SUPPLY |
YES |
32 |
66 MHz |
40 |
260 |
29 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B620 |
3 |
Not Qualified |
266 rpm |
YES |
e0 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
783 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
64 |
32 |
GRID ARRAY |
1.14 V |
BOTTOM |
3.75 mm |
29 mm |
YES |
64 |
166 MHz |
40 |
260 |
29 mm |
CMOS |
1.2 V |
1 mm |
FLOATING POINT |
S-PBGA-B783 |
3 |
Not Qualified |
833 rpm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA357,19X19,50 |
3.135 V |
TIN SILVER COPPER |
BOTTOM |
2.52 mm |
25 mm |
YES |
32 |
50 MHz |
30 |
245 |
25 mm |
CMOS |
3.3 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B357 |
3 |
Not Qualified |
50 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
BALL |
360 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.485 V |
26 |
32 |
GRID ARRAY |
1.2825 V |
TIN SILVER COPPER |
BOTTOM |
YES |
32 |
3.6864 MHz |
CMOS |
1.35 V |
FIXED POINT |
S-PBGA-B360 |
Not Qualified |
416 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
689 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
16 |
GRID ARRAY |
1 V |
TIN SILVER |
BOTTOM |
2.46 mm |
31 mm |
YES |
64 |
100 MHz |
40 |
260 |
31 mm |
CMOS |
1.05 V |
1 mm |
FLOATING POINT |
S-PBGA-B689 |
3 |
1000 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
689 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
16 |
1.05 |
GRID ARRAY |
BGA689,29X29,40 |
1 V |
7 |
TIN SILVER |
BOTTOM |
2.46 mm |
31 mm |
YES |
64 |
40 |
260 |
31 mm |
CMOS |
1.05 V |
4 |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B689 |
3 |
Not Qualified |
1000 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
689 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
16 |
1.05 |
GRID ARRAY |
BGA689,29X29,40 |
1 V |
7 |
TIN SILVER |
BOTTOM |
2.46 mm |
31 mm |
YES |
64 |
40 |
260 |
31 mm |
CMOS |
1.05 V |
4 |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B689 |
3 |
Not Qualified |
1200 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.89 V |
16 |
GRID ARRAY |
BGA780,28X28,32 |
1.71 V |
105 Cel |
12 |
0 Cel |
BOTTOM |
2.51 mm |
23 mm |
ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY |
YES |
64 |
23 mm |
CMOS |
1.8 V |
4 |
.8 mm |
FIXED POINT |
S-PBGA-B780 |
1500 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.89 V |
16 |
GRID ARRAY |
BGA780,28X28,32 |
1.71 V |
105 Cel |
12 |
-40 Cel |
BOTTOM |
2.51 mm |
23 mm |
ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY |
YES |
64 |
23 mm |
CMOS |
1.8 V |
4 |
.8 mm |
FIXED POINT |
S-PBGA-B780 |
1500 rpm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
GRID ARRAY |
.95 V |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
16 |
133.3 MHz |
30 |
245 |
37.5 mm |
CMOS |
1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
3 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||||
Teledyne E2v (Uk) |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
360 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.1 V |
36 |
32 |
1.05,1.5/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
1 V |
125 Cel |
-40 Cel |
BOTTOM |
2.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.05 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-CBGA-B360 |
Not Qualified |
1267 rpm |
NO |
|||||||||||||||||||||||||||||||
Atmel |
MICROPROCESSOR, RISC |
BALL |
360 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.1 V |
32 |
32 |
GRID ARRAY |
1.8 V |
BOTTOM |
2.77 mm |
25 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
100 MHz |
25 mm |
CMOS |
2 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B360 |
Not Qualified |
350 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Applied Micro Circuits |
MICROPROCESSOR, RISC |
BALL |
675 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
32 |
32 |
1.5,1.8,2.5,3.3 |
GRID ARRAY |
BGA675,26X26,40 |
1.425 V |
BOTTOM |
3.22 mm |
27 mm |
YES |
64 |
66.66 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
5400 mA |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B675 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
320 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
26 |
32 |
GRID ARRAY |
1.14 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
CMOS |
1.2 V |
FLOATING POINT |
S-PBGA-B320 |
3 |
450 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.055 V |
16 |
GRID ARRAY |
.995 V |
TIN SILVER COPPER |
BOTTOM |
3.33 mm |
45 mm |
YES |
64 |
133.3 MHz |
30 |
250 |
45 mm |
CMOS |
1.025 V |
1 mm |
FIXED POINT |
S-PBGA-B1932 |
3 |
1800 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
BOTTOM |
3.75 mm |
40 mm |
ALSO OPERATES AT 1200 GHZ |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1400 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.575 V |
24 |
32 |
GRID ARRAY |
1.425 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
2.49 mm |
23 mm |
YES |
32 |
35 MHz |
20 |
220 |
23 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B324 |
4 |
Not Qualified |
165 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.62 mm |
40 mm |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
R-PBGA-B1517 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
625 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
NO |
YES |
1.2 V |
AEC-Q100 |
16 |
32 |
GRID ARRAY |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
38.4 MHz |
CMOS |
1.15 V |
FLOATING POINT |
X-PBGA-B625 |
1176 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
13 |
32 |
1.2,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
17 mm |
YES |
32 |
50 MHz |
30 |
260 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
375 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
ALSO OPERATES AT 1200 GHZ |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
BOTTOM |
3.75 mm |
40 mm |
ALSO OPERATES AT 1200 GHZ |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1400 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.