BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P2020NSE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4	Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
PRIXP425ABD	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES				1.3,3.3	GRID ARRAY	BGA492,26X26,50		70 Cel		0 Cel		BOTTOM										CMOS				Microprocessors	1.27 mm		S-PBGA-B492		Not Qualified
CD8069504448701SRGZ9	Intel	MICROPROCESSOR		NO LEAD	3647	BGA	RECTANGULAR	UNSPECIFIED	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-XBGA-N3647			2200 rpm	NO
FJ8066201931104SR2EU	Intel	MICROPROCESSOR		BALL	1356	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1356			2300 rpm	NO
HW8076502639602SR38B	Intel	MICROPROCESSOR		BALL	1310	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1310			2200 rpm	NO
MPC860DEZQ50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860ENCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
NHPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V	26	32		GRID ARRAY		1.3775 V				TIN SILVER COPPER	BOTTOM				YES	32	3.6864 MHz				CMOS		1.45 V				FIXED POINT	S-PBGA-B360		Not Qualified	520 rpm	YES	e1
PR80321M400SL84R	Intel	MICROPROCESSOR		BALL	544	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V	64			GRID ARRAY		1.235 V					BOTTOM	2.59 mm	35 mm		YES	64	133 MHz			35 mm	CMOS		1.3 V			1.27 mm	FIXED POINT	S-PBGA-B544		Not Qualified	400 rpm	YES
XPC850DSLZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS		3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC860ENCZP50C1	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.05 mm	25 mm			32	50 MHz			25 mm	CMOS		3.3 V		Other Microprocessor ICs	1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
AF82801JIR	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES				1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM										CMOS				Other Microprocessor ICs	1 mm		S-PBGA-B676		Not Qualified
AU80610004392AA/SLBLA	Intel	MICROPROCESSOR, RISC		BALL	559	BGA		PLASTIC/EPOXY		YES			64	1,1.5	GRID ARRAY	BGA559(UNSPEC)					TIN SILVER COPPER	BOTTOM										CMOS	10800 mA			Microprocessors					Not Qualified	1660 rpm		e1
AU80610004653AA/SLBMG	Intel	MICROPROCESSOR		BALL	559	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.175 V	15	64	0.8/1.175,1.5,1.8	GRID ARRAY	BGA559(UNSPEC)	.8 V					BOTTOM	2.35 mm	22 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	22 mm	CMOS	5770 mA			Microprocessors		FIXED POINT	S-PBGA-B559		Not Qualified	1660 rpm	YES
AV80576SH0516MSLGAF	Intel	MICROPROCESSOR		BALL	956	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	32	64	1.2	GRID ARRAY	BGA956,44X44,20	1.05 V					BOTTOM				YES	64	2260 MHz				CMOS	37000 mA	1.1 V		Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B956		Not Qualified	1066 rpm	YES
AV8062701082300SR0C6	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1023			1400 rpm
CL8064701483902SR17M	Intel	MICROPROCESSOR		BALL	1364	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1364			2700 rpm	NO
CL8066201939103SR2DT	Intel	MICROPROCESSOR		BALL	1440	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES		0			GRID ARRAY							BOTTOM				NO	0					CMOS						FIXED POINT	R-PBGA-B1440			3500 rpm	NO
CM80616003060AESLBTD	Intel	MICROPROCESSOR	INDUSTRIAL	BUTT	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	0	64		GRID ARRAY		1.045 V	85 Cel		-40 Cel		BOTTOM				YES	0	133 MHz				CMOS		1.1 V				FLOATING POINT	S-PBGA-B1156		Not Qualified	133 rpm	YES
CM8068403362607SR3XE	Intel	MICROPROCESSOR		NO LEAD	1151	BGA	SQUARE	UNSPECIFIED	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED-POINT	S-XBGA-N1151			4100 rpm	NO
EWIXP420ABBT	Intel	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES				1.3,3.3	GRID ARRAY	BGA492,26X26,50		85 Cel		-40 Cel		BOTTOM										CMOS				Microprocessors	1.27 mm		S-PBGA-B492	1	Not Qualified
FH8065301487717	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES		16	64		GRID ARRAY							BOTTOM				YES	64					CMOS						FIXED POINT	R-XBGA-B1170			1910 rpm	YES
FH8065503553601SR3H1	Intel	MICROPROCESSOR		BALL	1283	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM							NOT SPECIFIED	NOT SPECIFIED		CMOS							R-PBGA-B1283			1700 rpm
FH8066501715928SR2KP	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1170			2240 rpm	NO
FJ8067702739633SR340	Intel	MICROPROCESSOR		BALL	1356	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1356			3500 rpm	NO
FWPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V	26	32		GRID ARRAY		1.2825 V					BOTTOM				YES	32	3.6864 MHz				CMOS		1.35 V				FIXED POINT	S-PBGA-B360	1	Not Qualified	416 rpm	YES
FWPXA270C5E416	Intel	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V	26	32		GRID ARRAY		1.2825 V	85 Cel		-40 Cel		BOTTOM				YES	32	3.6864 MHz				CMOS		1.35 V				FIXED POINT	S-PBGA-B360	1	Not Qualified	416 rpm	YES
GD80960JA33	Intel	MICROPROCESSOR, RISC		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V	32	32	3.3,3.3/5	GRID ARRAY	BGA196(UNSPEC)	3.15 V					BOTTOM				YES	32	33.3 MHz				CMOS	320 mA	3.3 V		Microprocessors		FIXED POINT	S-PBGA-B196		Not Qualified	33 rpm	YES
GDS1110BD	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel		0 Cel		BOTTOM										CMOS				Microprocessors	1 mm		S-PBGA-B256		Not Qualified	206 rpm
HE8066201930521SR2EN	Intel	MICROPROCESSOR		BALL	1515	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					GRID ARRAY							BOTTOM				NO						CMOS						FIXED POINT	R-PBGA-B1515			2200 rpm	NO
KMPC880VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
KMPC885CVR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
LE80536GC0332MSLJ8Z	Intel	MICROPROCESSOR		BALL	479	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		28	32		GRID ARRAY							BOTTOM	2.85 mm	35 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.34 V			1.27 mm	FLOATING POINT	S-PBGA-B479			1800 rpm	YES
LUPXA255A0E400	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.64 V	26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm	17 mm		YES	32	3.6864 MHz	40	250	17 mm	CMOS		1.3 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MCF53016CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel		-40 Cel		BOTTOM				YES	32	48 MHz				CMOS						FIXED POINT	S-PBGA-B256			240 rpm	YES
MPC8347VRAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e1
MPC8543VUAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1000 rpm	YES	e2
MPC8545EVUATG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1200 rpm	YES	e2
NU80579ED009C	Intel	MICROPROCESSOR	COMMERCIAL	BALL	1088	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	25	32	1.2,1.8,2.5,3.3,5	GRID ARRAY	BGA1088,33X33,43	1.14 V	70 Cel		0 Cel		BOTTOM	5.635 mm	37.5 mm		YES	16	1200 MHz	NOT SPECIFIED	NOT SPECIFIED	37.5 mm	CMOS	12000 mA	1.2 V		Microprocessors	1.09 mm	FLOATING POINT	S-PBGA-B1088		Not Qualified	1200 rpm	YES
PRIXP420ABB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES				1.3,3.3	GRID ARRAY	BGA492,26X26,50		70 Cel		0 Cel		BOTTOM										CMOS				Microprocessors	1.27 mm		S-PBGA-B492		Not Qualified
PRIXP420BB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V	32	32		GRID ARRAY		1.235 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.59 mm	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.33 MHz			35 mm	CMOS		1.3 V			1.27 mm	FIXED POINT	S-PBGA-B492		Not Qualified	533 rpm	NO	e1
PRIXP425BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V	32	32		GRID ARRAY		1.235 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.59 mm	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.33 MHz			35 mm	CMOS		1.3 V			1.27 mm	FIXED POINT	S-PBGA-B492		Not Qualified	533 rpm	NO	e1
RTPXA270C5C312	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.375 V	26	32		GRID ARRAY		1.1875 V					BOTTOM				YES	32	3.6864 MHz	30	240		CMOS		1.25 V				FIXED POINT	S-PBGA-B356		Not Qualified	312 rpm	YES
RTPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V	26	32		GRID ARRAY		1.2825 V					BOTTOM				YES	32	3.6864 MHz	30	240		CMOS		1.35 V				FIXED POINT	S-PBGA-B356		Not Qualified	416 rpm	YES
TMPR4937XBG-300	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	20	64	1.5,3.3	GRID ARRAY	BGA484,26X26,50	1.4 V	70 Cel		0 Cel		BOTTOM	2.46 mm	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.5 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B484		Not Qualified	300 rpm	YES
XPC755BRX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V				GRID ARRAY		1.9 V					BOTTOM				YES						CMOS		2 V				FIXED POINT	R-CBGA-B360			300 rpm	NO
XPC823ZT66B2	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM												3.3 V		Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	66 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.