BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
SPC5200CVR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
P2010NXN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2
MPC8270CZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V				TIN LEAD SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V		Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
AV8063801149203/SR0ND	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY	BGA1023(UNSPEC)						BOTTOM					NO						CMOS				Microprocessors		FIXED POINT	R-PBGA-B1023		Not Qualified	2100 rpm	YES
MC7448TVU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			0			GRID ARRAY		1 V					BOTTOM	2.4 mm		25 mm		YES	0	200 MHz	40	260	25 mm	CMOS		1.05 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1		1267 rpm	YES
P2010NXN2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16	32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
MPC860SRCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
RTPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V			26	32		GRID ARRAY		1.3775 V					BOTTOM					YES	32	3.6864 MHz	30	240		CMOS		1.45 V				FIXED POINT	S-PBGA-B356		Not Qualified	520 rpm	YES
P1020NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32	1	GRID ARRAY	BGA689,29X29,40	.95 V		12		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4	Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	800 rpm	NO	e2
MC7455ARX933LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V		Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	933 rpm	YES
MPC885VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
P1022NXE2LFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MC7448HX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS		1.15 V		Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MC7455ARX867LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V		Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	867 rpm	YES
MPC880CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
AM3517AZER	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
CL8064701483802SR17L	Intel	MICROPROCESSOR		BALL	1364	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM											CMOS							R-PBGA-B1364			3400 rpm
FH8065301567313SR1X9	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS						FIXED POINT	R-PBGA-B1170			1330 rpm
MCF5373LCVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY	BGA196,14X14,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260		CMOS				Microprocessors	1 mm		S-PBGA-B196	3	Not Qualified	240 rpm
MPC8347EVRAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC860DEVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
P1011NSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7			BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4		1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO
P1021NSE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
MPC5121YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			0	32		GRID ARRAY		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0		40	260	27 mm	CMOS		1.4 V			1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8323ECVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
P3041NXN7NNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1333 rpm	YES	e1
MC8641VJ1500KE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V			16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-CBGA-B1023	3		1500 rpm	YES	e2
MCF53281CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260						Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MPC8323ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8343CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MCF54452CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54455CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC8347ECVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
PPC440EP-3JC400C	Applied Micro Circuits	MICROPROCESSOR, RISC		BALL	456	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,2.5,3.3	GRID ARRAY	BGA456,26X26,50	1.4 V					BOTTOM	2.65 mm		35 mm	ALSO REQUIRES 2.5 AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS	2200 mA	1.5 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B456		Not Qualified	400 rpm	YES
SPC5200CBV400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
XPC860TZP50D4	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel		BOTTOM	2.05 mm		25 mm		YES	32	50 MHz			25 mm	CMOS		3.3 V		Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
IBM25PPC750FX-GB0133T	Ibm Microelectronics	MICROPROCESSOR, RISC		BALL	292	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.5 V			32	32	1.45,1.8/3.3	GRID ARRAY	BGA292,20X20,40	1.4 V					BOTTOM	3.087 mm		21.02 mm		YES	64	200 MHz			21.02 mm	CMOS		1.45 V		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B292		Not Qualified	600 rpm	YES
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32		GRID ARRAY		1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V			1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
FH8065301487918SR1X7	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES				16	64		GRID ARRAY							BOTTOM					YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS						FIXED POINT	R-XBGA-B1170			1750 rpm	YES
FH8065801974816SR267	Intel	MICROPROCESSOR		BALL	1168	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS						FIXED POINT	R-PBGA-B1168			3200 rpm	NO
MC7455ARX733LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V		Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	733 rpm	YES
RJ80530UY750512	Intel	MICROPROCESSOR, RISC		BALL	479	BGA	SQUARE	CERAMIC		YES					32	1.15,1.25	GRID ARRAY	BGA479,26X26,50					Tin/Lead (Sn/Pb)	BOTTOM											CMOS				Microprocessors	1.27 mm		S-XBGA-B479		Not Qualified	750 rpm		e0
MPC860PCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860PZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC860SRVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.