BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC860TCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860TCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860TZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
DF8064101211300/SR0VY	Intel	MICROPROCESSOR, RISC		BALL	559	BGA		PLASTIC/EPOXY		YES				64	1,1.5	GRID ARRAY	BGA559(UNSPEC)						BOTTOM										CMOS	6700 mA				Microprocessors					Not Qualified	1860 rpm
FH8066802980002SR2YB	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY							BOTTOM				NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
FH8066802980002SR2Z7	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY							BOTTOM				NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
KMPC8347EVRAGDB	Freescale Semiconductor	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V				Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC885VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		40	260	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MC7448HX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448HX1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS		1.1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1250 rpm	YES	e0
MC7448HX1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES	e0
MC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	600 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	600 rpm	YES	e0
MC7448THX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448TVU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360	1		1000 rpm	YES
MC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES
MC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.25 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1600 rpm	YES
MCF5272CVM66	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		23	32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm	15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MPC860TVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
T2080NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM				NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3		1533 rpm	NO	e1
FH8065301567313SR3UZ	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM				NO						CMOS							FIXED POINT	R-PBGA-B1170			1330 rpm
KMC7448VU1267ND	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V		36	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz	40	260	25 mm	CMOS		1.1 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES
KMPC8270CZQMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V				Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
P2041NXE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
P2041NXN7NNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780	3		1333 rpm	YES	e1
PPC440GX-3CF667C	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	552	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.6 V		64	32	1.5	GRID ARRAY	BGA552,24X24,40	1.5 V	85 Cel		-40 Cel		BOTTOM	3.977 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83 MHz	NOT SPECIFIED	NOT SPECIFIED	25 mm	CMOS	2200 mA	1.55 V			Microprocessors	1 mm	FIXED POINT	S-CBGA-B552		Not Qualified	667 rpm	NO
T4240NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
AM3358BGCZA80EP	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V		28	32		GRID ARRAY		1.056 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM				YES	16		20	220		CMOS		1.1 V					FIXED POINT	S-PBGA-B324	3		800 rpm	YES	e0
LX2160SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
LX2160XN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MPC8547ECHXAUJ	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1333 rpm	YES	e0
MPC860ENVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880CZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm	25 mm		YES	32	66.67 MHz	30	245	25 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES
MPC880VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC880VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC880ZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880ZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
P1011NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	32		40	260	31 mm	CMOS		1 V	4			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO	e2
PPC460EX-SUB1000T	M/a-com Technology Solutions	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V		32			GRID ARRAY		1.2 V	85 Cel		-40 Cel		BOTTOM	2.65 mm	35 mm		YES	32	100 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.25 V				1 mm	FLOATING POINT	S-PBGA-B728			1000 rpm	YES
SPC5125YVN400	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES		AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM							40	260							Microprocessors	1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
AV8063801116903SR0T5	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY	BGA1023(UNSPEC)						BOTTOM							NOT SPECIFIED	NOT SPECIFIED		CMOS					Microprocessors			R-PBGA-B1023		Not Qualified	3200 rpm
AV8063801149402SR0T6	Intel	MICROPROCESSOR		BALL	1023	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY	BGA1023(UNSPEC)						BOTTOM				NO						CMOS					Microprocessors		FIXED POINT	R-PBGA-B1023		Not Qualified	2800 rpm	NO
FH8065301567313	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM				NO						CMOS							FIXED POINT	R-PBGA-B1170			1330 rpm
KMPC8275CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V				TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8343CVRAGDB	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LX2160XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.