BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P1013SSE2MHA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	0	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			1200 rpm	YES	e2
MPC850SRCVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MC8640TVJ1067NC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	.95 V			1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	YES
MPC8555EVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC857DSLZQ50B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B357	3		50 rpm	YES	e0
MC8640DVJ1067NC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	.95 V			1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	YES
MPC860PVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC8343EVRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8567EVTAQGGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm	33 mm		YES	0	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1000 rpm	YES	e2
MPC8540VTAQFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC866PCZP100A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32		30	220	25 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e0
MC7457VG1000NC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V				NICKEL GOLD	BOTTOM	3.2 mm	29 mm		YES	64	167 MHz	40	260	29 mm	CMOS	1.3 V			1.27 mm	FLOATING POINT	S-CBGA-B483	1	Not Qualified	1000 rpm	YES	e4
MPC8275VRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8347CZQAJD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES	e0
MPC8555PXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8545EPXANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e0
MC8641DHX1333KC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MPC860SRVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz			25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC852TCVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS	1.8 V		Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MPC8378EVRAGGA	NXP Semiconductors	MICROPROCESSOR		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V					BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	400 rpm	YES
MC8610VT800GZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.7 mm	29 mm		YES	64				29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
P1020SXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		12			BOTTOM	2.46 mm	31 mm		YES	32				31 mm	CMOS	1 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
MPC862PCZQ80B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B357	3		80 rpm	YES	e0
MC8641DVJ1000GE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	YES
MPC860ENZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
P1020NXE2DFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		12			BOTTOM	2.46 mm	31 mm		YES	32				31 mm	CMOS	1 V	4		1 mm	FIXED POINT	S-PBGA-B689			533 rpm	NO
MPC8377EVRALG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS	1 V	4		1 mm		S-PBGA-B689
MPC8533VTALGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	.4 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES	e2
MPC8280VRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8280CVRFX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	133 rpm	NO
MPC8545ECVTATGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V					BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES
MPC8540CVT667LC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC860ENVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MC8641VU1333KB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MPC8555CPXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8260ACZUPJD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50				-40 Cel		BOTTOM										CMOS			Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	300 rpm
MPC8560VT667FB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC860DEVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz			25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC8270CZQKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MPC8541EPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8347EVRAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
P1021NXE2FFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689			667 rpm	YES	e2
MPC8543VTANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V					BOTTOM	3.38 mm	29 mm		YES	64	133 MHz	NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8541CPXAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8568ECVTAUGJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V					BOTTOM	2.75 mm	33 mm		YES	64	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023			1333 rpm	YES
MPC8347ECZQAGFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40		105 Cel		-40 Cel		BOTTOM										CMOS			Microprocessors	1 mm		S-PBGA-B620		Not Qualified	400 rpm
P2041NXE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS	1.8 V	4		.8 mm	FIXED POINT	S-PBGA-B780			1200 rpm	YES
MC8640DTVJ1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.