BGA Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MPC8272CVRPIEX

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.575 V

32

32

GRID ARRAY

1.425 V

105 Cel

-40 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

300 rpm

NO

MPC8568VTAUJJA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

1333 rpm

YES

e2

MPC8541EPXALEX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

70 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

MC8641HX1333NC

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1333 rpm

YES

MPC8250ACZQIHBX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

GRID ARRAY

1.7 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66.66 MHz

27 mm

CMOS

1.8 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

200 rpm

NO

MPC8347CZQAGF

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

400 rpm

YES

e0

MPC8275CZQTPEX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

NO

MPC857DSLVR50B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

GRID ARRAY

3.135 V

105 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.52 mm

25 mm

YES

32

30

245

25 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B357

3

50 rpm

YES

e1

MPC8248CVRMIBA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.575 V

32

32

1.5,3.3

GRID ARRAY

BGA516,26X26,40

1.425 V

TIN SILVER

BOTTOM

2.55 mm

27 mm

ALSO OPERTAES AT 3.3 V

YES

64

66.67 MHz

30

245

27 mm

CMOS

1.5 V

Other uPs/uCs/Peripheral ICs

1 mm

FLOATING POINT

S-PBGA-B516

3

Not Qualified

266 rpm

YES

e2

MPC8313VRAFFC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

1,1.8/2.5,3.3

GRID ARRAY

BGA516,26X26,40

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.55 mm

27 mm

YES

0

133 MHz

40

260

27 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B516

3

Not Qualified

333 rpm

YES

e2

MPC8535AVJAQG

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.76 mm

29 mm

YES

64

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1000 rpm

YES

MPC8536BVJAUL

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1,1.5/1.8,1.8/3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

CMOS

Microprocessors

1 mm

S-PBGA-B783

Not Qualified

1333 rpm

MPC8347VRAGF

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

400 rpm

YES

MPC8547ECVJAQGD

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

40

260

CMOS

Microprocessors

1 mm

S-PBGA-B783

3

Not Qualified

1000 rpm

MPC8270ZQMHBX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66.67 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

266 rpm

NO

MPC8347CVRALFB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

667 rpm

YES

MPC8347VRADF

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

266 rpm

YES

MPC850CVR66BU

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

26

32

3.3

GRID ARRAY

BGA256,16X16,50

3 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.54 mm

23 mm

YES

32

23 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

66 rpm

YES

e1

MPC8567VTAQGG

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

0 Cel

BOTTOM

2.75 mm

33 mm

YES

64

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1023

3

Not Qualified

1000 rpm

YES

e2

P1020NXE2HFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

BGA689,29X29,40

.95 V

12

BOTTOM

2.46 mm

31 mm

YES

32

31 mm

CMOS

1 V

4

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

NO

MPC8536AVJANGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.76 mm

29 mm

YES

64

40

260

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

800 rpm

YES

e2

MPC8547ECVTAVGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,2.5/3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

CMOS

Microprocessors

1 mm

S-PBGA-B783

Not Qualified

1500 rpm

MPC855TZQ50D4

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA357,19X19,50

3.135 V

0 Cel

TIN LEAD

BOTTOM

2.52 mm

25 mm

YES

32

50 MHz

30

245

25 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

50 rpm

YES

e0

MPC8547CVJAQGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

e2

MPC859TCZP100A

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA357,19X19,50

1.7 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.52 mm

25 mm

YES

32

30

220

25 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

100 rpm

YES

e0

P2041NSN7NNC

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

780

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

16

GRID ARRAY

BGA780,28X28,32

1.71 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

2.51 mm

23 mm

ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY

YES

64

30

245

23 mm

CMOS

1.8 V

4

.8 mm

FIXED POINT

S-PBGA-B780

3

1333 rpm

YES

e1

MPC8555EPXALFX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

MPC8378EVRAGFA

NXP Semiconductors

MICROPROCESSOR

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

GRID ARRAY

.95 V

TIN SILVER

BOTTOM

2.46 mm

31 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66.66 MHz

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

Not Qualified

333 rpm

YES

e2

MPC8248ZQMIBX

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.575 V

32

32

GRID ARRAY

1.425 V

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66.67 MHz

27 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B516

Not Qualified

266 rpm

NO

MPC8533ECVTARFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

1067 rpm

YES

e2

MPC8347CVRADDB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

3

Not Qualified

266 rpm

YES

e2

MPC860ENZQ50D4R2

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA357,19X19,50

3.135 V

0 Cel

TIN LEAD

BOTTOM

2.52 mm

25 mm

YES

32

50 MHz

30

245

25 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

50 rpm

YES

e0

MPC8543EVJAQGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

e2

MPC8545ECVJANGC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

MPC8543EPXAQGC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN LEAD SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

e0

MPC859TVR100A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA357,19X19,50

1.7 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.52 mm

25 mm

YES

32

30

245

25 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

100 rpm

YES

e1

MPC8568ECVTAQGG

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

-45 Cel

BOTTOM

2.75 mm

33 mm

YES

64

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1023

3

Not Qualified

1000 rpm

YES

e2

MC8641DVJ1250HC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1250 rpm

YES

MPC8271CZQPIEX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.575 V

32

32

GRID ARRAY

1.425 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

27 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B516

Not Qualified

300 rpm

NO

MPC8547EPXAUHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,2.5/3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

CMOS

Microprocessors

1 mm

S-PBGA-B783

Not Qualified

1333 rpm

MC8641HX1333KC

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1333 rpm

YES

MC8641VU1000KB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

P1020NXE2DFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

BGA689,29X29,40

.95 V

12

BOTTOM

2.46 mm

31 mm

YES

32

31 mm

CMOS

1 V

4

1 mm

FIXED POINT

S-PBGA-B689

533 rpm

NO

MPC8275VRTPEX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

NO

MPC8270CZQTPEX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

100 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

NO

MPC8545ECVJAQGC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

e2

P1011NXE2FFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

BGA689,29X29,40

.95 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

32

40

260

31 mm

CMOS

1 V

4

1 mm

FIXED POINT

S-PBGA-B689

3

667 rpm

NO

e2

MPC8555ECPXAKF

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

15

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

3.75 mm

29 mm

YES

64

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

600 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.