BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC7450RX667LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.6	GRID ARRAY	BGA483,22X22,50						BOTTOM										CMOS		1.6 V		Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	667 rpm
LX2080XN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MPC603PRX166LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS		2.5 V			1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	166 rpm	YES
MPC7547EVUATG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM										CMOS				Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1200 rpm
LX2120SE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MCF54452YVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32		GRID ARRAY		1.35 V	105 Cel		-40 Cel		BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B360			200 rpm	YES
MPC7410VU400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES			32	1.8,1.8/3.3	GRID ARRAY	BGA360,19X19,50						BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	400 rpm
MPC7457RX1000LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES			32		GRID ARRAY							BOTTOM										CMOS		1.1 V				FLOATING POINT	S-CBGA-B483			1000 rpm	YES
MPC7457RX1200LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel		0 Cel		BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	1200 rpm
MPC604ERX266	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	1.9,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	266 rpm
MPC7410THX450LE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.9 V				GRID ARRAY		1.7 V	105 Cel		-40 Cel		BOTTOM				NO						CMOS		1.8 V				FIXED POINT	R-PBGA-B			450 rpm	NO
MPC603PRX200LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	200 rpm
LX2080XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
LX2120SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
LX2120XE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC750PRX333RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V		32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		1.9 V			1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	333 rpm	YES
LX2160SC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MPC750PRX400RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V		32		GRID ARRAY		2 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		2.05 V			1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	400 rpm	YES
MPC7457VG1267LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel		0 Cel		BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	1267 rpm
LX2080XE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel		BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES
MPC7410HX450NE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.55 V	32	32		GRID ARRAY		1.45 V				TIN LEAD	BOTTOM	3.2 mm	25 mm		YES	64	133 MHz	40	260	25 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	450 rpm	YES	e0
MPC603PRX233LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS		2.5 V			1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	233 rpm	YES
MCF53016CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel		-40 Cel		BOTTOM				YES	32	48 MHz	40	260		CMOS						FIXED POINT	S-PBGA-B256	3		240 rpm	YES
MCF5249CVM140	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		24	32		GRID ARRAY						TIN SILVER COPPER	BOTTOM	1.75 mm	15 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	16	33.86 MHz	40	260	15 mm	CMOS		1.8 V			1 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	140 rpm	YES	e1
MCF5482CZP166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	30	220	27 mm	CMOS		3.3 V			1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e0
MCF5272CVF66	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	23	32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.75 mm	15 mm		YES	32	66 MHz	30	220	15 mm	CMOS		3.3 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e0
MCF53015CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24			GRID ARRAY		1.08 V	85 Cel		-40 Cel		BOTTOM				YES	32	48 MHz				CMOS						FIXED POINT	S-PBGA-B256			240 rpm	YES
MPC7410RX400LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.8,1.8/3.3	GRID ARRAY	BGA360,19X19,50						BOTTOM										CMOS				Microprocessors	1.27 mm		S-PBGA-B360		Not Qualified	400 rpm
MPC7410RX500PE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL		BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.05 V				GRID ARRAY		1.95 V					BOTTOM				YES		133 MHz				CMOS		2 V				FIXED POINT	R-CBGA-B			500 rpm	NO
MPC750ARX233LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V	32	32		GRID ARRAY		2.5 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm	CMOS		2.6 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	233 rpm	YES
MPC750ARX200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V	32	32		GRID ARRAY		2.5 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm	CMOS		2.6 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	200 rpm	YES
MCF53017CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24	32		GRID ARRAY		1.08 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM				YES	32	80 MHz	40	260		CMOS						FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MPC755BPX300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V					BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B360		Not Qualified	300 rpm	YES
MPC7457VG1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel		0 Cel		BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	1000 rpm
MPC7410RX450NE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm	25 mm		YES	64	133 MHz	30	245	25 mm	CMOS		1.8 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	450 rpm	YES	e0
MPC755BVT350	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V					BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B360		Not Qualified	350 rpm	YES
MPC755BVT300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V					BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B360		Not Qualified	300 rpm	YES
LX2080SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MCF5482CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V			1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MPC750PRX300RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V		32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		1.9 V			1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
MPC750PRX300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V		32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		1.9 V			1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
MPC745BPX300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				TIN LEAD	BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	300 rpm	YES	e0
LX2160XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V	17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC750ARX266TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V	32	32		GRID ARRAY		2.5 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm	CMOS		2.6 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	266 rpm	YES
MPC603ERX100LX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA255,16X16,50	3.135 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	100 MHz			21 mm	CMOS		3.3 V		Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	100 rpm	YES	e0
MCF54455VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC755CRX450LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES			32	2,2.5/3.3	GRID ARRAY	BGA360,19X19,50						BOTTOM										CMOS				Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	450 rpm
C5ENPB0-DS	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	840	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.31 V	12	32		GRID ARRAY		1.19 V	125 Cel		-40 Cel		BOTTOM	3.55 mm	30.8 mm		YES	139	300 MHz			30.8 mm	CMOS		1.25 V			1 mm	FIXED POINT	S-CBGA-B840			300 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.