BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
XPC755BRX400LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY	BGA360,19X19,50	1.9 V	105 Cel		0 Cel		BOTTOM	3.2 mm	25 mm		YES	64				25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360			400 rpm	YES
XPC850DECZT80B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V					BOTTOM	2.35 mm	23 mm		YES	32	80 MHz			23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
XPC850DEZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
P2020NSN2HHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO	e2
XPC850SRCZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V					BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC7450RX533LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	CERAMIC		YES			32	1.8	GRID ARRAY	BGA484,22X22,50		105 Cel		0 Cel		BOTTOM										CMOS		1.8 V			Microprocessors	1.27 mm		S-XBGA-B484		Not Qualified	533 rpm
P2020NSE2MHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO	e2
XPC750PRX300RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V		32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		1.9 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
MPE603PRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V	70 Cel		0 Cel		BOTTOM	3 mm	21 mm		YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
P2020NSE2KHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
XPC862TZP100B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V					BOTTOM	2.05 mm	25 mm		YES	32				25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357			100 rpm	YES
P5021PSN72QB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P4080NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
LX2120SC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
LX2120SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MPC603PRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
MPC7410THX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.9 V				GRID ARRAY		1.7 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM				NO			40	260		CMOS		1.8 V					FIXED POINT	R-PBGA-B	1	Not Qualified	400 rpm	NO	e0
MPC755BRX300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				TIN LEAD	BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	300 rpm	YES	e0
MPC755CPX400LER2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V				TIN LEAD	BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e0
LX2120XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MPC603PRX240LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	240 rpm	YES
MPC603RRX266TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	266 rpm	YES
MPC603RZT200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	2.6 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			23 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	200 rpm	YES
LX2080XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC755BRX300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
MPC745BVT350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V					BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	350 rpm	YES	e2
LX2120XE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MPC603RZT200TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	2.6 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			23 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	200 rpm	YES
MPC7457RX867LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel		0 Cel		BOTTOM										CMOS					Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	867 rpm
LX2160SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MPC755BPX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,2.5/3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM										CMOS					Microprocessors	1.27 mm		S-PBGA-B255		Not Qualified	400 rpm
MPC603PRX240L	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM										CMOS					Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	240 rpm
MPC7547EVUAQG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM										CMOS					Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1000 rpm
MCF5480CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MPC750ARX200TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V	32	32		GRID ARRAY		2.5 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm	CMOS		2.6 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	200 rpm	YES
MPC7547EHXAQG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM										CMOS					Microprocessors	1 mm		S-PBGA-B783		Not Qualified	1000 rpm
MPC604ERX266XX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32		GRID ARRAY		1.8 V					BOTTOM	3.3 mm	21 mm		YES	64				21 mm	CMOS		1.9 V				1.27 mm	FLOATING POINT	S-CBGA-B255			266 rpm	NO
MPC7410HX450LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES			32	1.8,1.8/3.3	GRID ARRAY	BGA360,19X19,50						BOTTOM										CMOS					Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	450 rpm
MPC755CPX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V				TIN LEAD	BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e0
MPC755BPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				TIN LEAD	BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	350 rpm	YES	e0
MCF52277CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel		BOTTOM	1.75 mm	15 mm		YES	32	66.67 MHz	NOT SPECIFIED	NOT SPECIFIED	15 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196		Not Qualified	166.67 rpm	NO
MPC603PRX160LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm	21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	160 rpm	YES
MPC745BVT300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V				TIN SILVER	BOTTOM	2.8 mm	21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz	40	260	21 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	300 rpm	YES	e2
MCF54454VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.48 mm	23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC755CVT400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V					BOTTOM	2.77 mm	25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e2
LX2160XE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MCF5483CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
LX2160XE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm	40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.