BGA Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8347CZQADFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC860DTCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC8280ZQTX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8275CVRMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8555ECVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8343ZQADDX	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8533CVTAQFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8555ECPXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	15	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.3 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8547EVJATGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e2
MC8641DVU1250KB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1250 rpm	YES
MPC8568EVTAQGG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1.045 V	105 Cel		0 Cel		BOTTOM	2.75 mm	33 mm		YES	64		40	260	33 mm	CMOS	1.1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
P1020NSN2DFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1	GRID ARRAY	BGA689,29X29,40	.95 V		12			BOTTOM	2.46 mm	31 mm		YES	32		40	260	31 mm	CMOS	1 V	4	Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	533 rpm	NO
MPC8547CVJATGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e2
MPC8545ECVJATGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1200 rpm	YES	e2
MPC8543PXANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e0
MPC8315EVRAGDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V				TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8545CVJANGC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	64	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	3.38 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC852TZT80A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	220	23 mm	CMOS	1.8 V		Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e0
MPC8272CZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
P1020SSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY	BGA689,29X29,40	.95 V		12			BOTTOM	2.46 mm	31 mm		YES	32				31 mm	CMOS	1 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
MPC8535CVJAQG	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.76 mm	29 mm		YES	64				29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8533VJARG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783			1067 rpm	YES
MPC8567VTANGG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1.045 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.75 mm	33 mm		YES	64		40	260	33 mm	CMOS	1.1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B1023	3	Not Qualified	800 rpm	YES	e2
MPC8541ECVTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541EPXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MC8641VJ1000HB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	YES
MPC8567ECVTAUJGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V					BOTTOM	2.75 mm	33 mm		YES	64	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023			1333 rpm	YES
MPC852TVR80A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS	1.8 V		Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MC8641DVU1500JB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V	16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1500 rpm	YES
MPC8536AVJAQGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1000 rpm	YES	e2
KMPC880CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm	25 mm		YES	32	66 MHz			25 mm	CMOS	1.8 V			1.27 mm	FIXED POINT	S-PBGA-B357			133 rpm	YES
MPC8536BVJANG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1,1.5/1.8,1.8/3.3	GRID ARRAY	BGA783,28X28,40						BOTTOM										CMOS			Microprocessors	1 mm		S-PBGA-B783		Not Qualified	800 rpm
MPC8323CZQAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V				TIN LEAD SILVER	BOTTOM	2.55 mm	27 mm		YES	0	66.67 MHz			27 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e0
MPC8533EVTARFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	.4 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1067 rpm	YES	e2
MPC8270ZQPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
P1021NSN2HFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	100 MHz			31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8271ZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V					BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8343ECZQAGDX	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8347ZQAGFA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8568CVTAQGGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm	33 mm		YES	0	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1000 rpm	YES	e2
MPC8536BVJAQGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1000 rpm	YES	e2
MPC8567ECVTAQGGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm	33 mm		YES	0	166 MHz			33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1000 rpm	YES	e2
MPC8347ECZQAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	400 rpm	YES
KMPC885ZP80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm	25 mm		YES	32	80 MHz			25 mm	CMOS	1.8 V			1.27 mm	FIXED POINT	S-PBGA-B357			80 rpm	YES
MPC8347EVRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC860PVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32	50 MHz	30	245	25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC859TZP100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm	25 mm		YES	32	50 MHz			25 mm	CMOS	1.8 V			1.27 mm	FIXED POINT	S-PBGA-B357			100 rpm	YES
MPC850DECZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN LEAD	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.