BGA Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

P2041NXN1MMB

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

780

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

16

GRID ARRAY

BGA780,28X28,32

1.71 V

105 Cel

12

-40 Cel

BOTTOM

2.51 mm

23 mm

ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY

YES

64

23 mm

CMOS

1.8 V

4

.8 mm

FIXED POINT

S-PBGA-B780

1200 rpm

YES

MPC8540CVT833LB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

3.85 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

MPC860TCVR66D4

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA357,19X19,50

3.135 V

TIN SILVER COPPER

BOTTOM

2.52 mm

25 mm

YES

32

50 MHz

30

245

25 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

66 rpm

YES

e1

MPC8547EVTATGC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

NOT SPECIFIED

NOT SPECIFIED

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1200 rpm

YES

P1021SSN2DFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY

.95 V

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

100 MHz

31 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B689

533 rpm

YES

e2

MPC8555ECPXAJDX

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

MC8640VJ1067NC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

1067 rpm

YES

MPC8250ACVRLHDX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.2 V

32

32

GRID ARRAY

1.9 V

70 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

83.3 MHz

27 mm

CMOS

2 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

250 rpm

NO

MPC860SRZQ50D4

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA357,19X19,50

3.135 V

0 Cel

TIN LEAD

BOTTOM

2.52 mm

25 mm

YES

32

50 MHz

30

245

25 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

50 rpm

YES

e0

MPC8560VTAQFC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY

1.25 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

3.85 mm

29 mm

YES

64

166 MHz

40

260

29 mm

CMOS

1.3 V

1 mm

FIXED POINT

S-PBGA-B783

3

Not Qualified

1000 rpm

YES

e2

MC8641DHX1500JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1500 rpm

YES

MPC8568EVTANGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

800 rpm

YES

e2

MPC8555ECVTAPD

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

15

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

3.75 mm

29 mm

YES

64

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

833 rpm

YES

MPC8560VTAQJB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY

1.25 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

1000 rpm

YES

SPC5121YVY400B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.47 V

AEC-Q100

0

32

1.4,3.3

GRID ARRAY

BGA516,26X26,40

1.33 V

85 Cel

-40 Cel

TIN SILVER

BOTTOM

2.55 mm

27 mm

YES

0

40

260

27 mm

CMOS

1.4 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B516

3

Not Qualified

400 rpm

YES

e2

MPC8343EVRAGDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

3

Not Qualified

400 rpm

YES

e2

MPC8280ZQPX

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

105 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

YES

64

66 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

300 rpm

NO

MPC8347EZQAJD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

e0

MPC853TVR66

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA256,16X16,50

1.7 V

BOTTOM

2.54 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

23 mm

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

1.27 mm

FIXED POINT

S-PBGA-B256

Not Qualified

66 rpm

YES

MC7457RX1200LC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

483

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.35 V

36

32

1.3,1.8/2.5

GRID ARRAY

BGA483,22X22,50

1.25 V

BOTTOM

3.2 mm

29 mm

YES

64

167 MHz

29 mm

CMOS

1.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-CBGA-B483

Not Qualified

1200 rpm

YES

MC8640VJ1000HC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MPC8343ECVRAGDA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

-40 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

400 rpm

YES

MPC8555ECVTAJE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

15

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

3.75 mm

29 mm

YES

64

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

P2041NSN7PNC

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

780

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

16

GRID ARRAY

BGA780,28X28,32

1.71 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

2.51 mm

23 mm

ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY

YES

64

30

245

23 mm

CMOS

1.8 V

4

.8 mm

FIXED POINT

S-PBGA-B780

3

1500 rpm

YES

e1

MPC8347ECVRADFB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

266 rpm

YES

MPC8547VJATGD

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

40

260

CMOS

Microprocessors

1 mm

S-PBGA-B783

3

Not Qualified

1200 rpm

MPC857DSLZP66B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA357,19X19,50

105 Cel

0 Cel

BOTTOM

3.3 V

Microprocessors

1.27 mm

S-PBGA-B357

Not Qualified

66 rpm

P1021SSN2HFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY

.95 V

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

100 MHz

31 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

YES

e2

MPC860DTZQ50D4

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA357,19X19,50

3.135 V

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.52 mm

25 mm

YES

32

50 MHz

30

245

25 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

50 rpm

YES

e0

MC8641DVU1000JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

MPC862PZP66B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA357,19X19,50

105 Cel

0 Cel

BOTTOM

3.3 V

Microprocessors

1.27 mm

S-PBGA-B357

Not Qualified

66 rpm

MPC8572ECLVJAVNE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1500 rpm

YES

P1022NSN2LFB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

133 MHz

40

260

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

3

1067 rpm

YES

e2

MC8641VU1250JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MPC862PCZP66B

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA357,19X19,50

115 Cel

-40 Cel

BOTTOM

3.3 V

Microprocessors

1.27 mm

S-PBGA-B357

Not Qualified

66 rpm

MPC8541VTAJFX

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.25 V

36

32

GRID ARRAY

1.15 V

70 Cel

0 Cel

BOTTOM

2.4 mm

25 mm

LOW POWER TAKEN FROM SLEEP MODE

YES

64

200 MHz

25 mm

CMOS

1.2 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

1420 rpm

YES

MPC8280CVRUPEX

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

105 Cel

-40 Cel

BOTTOM

2.55 mm

27 mm

YES

64

100 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

450 rpm

NO

P1011NSE2FFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

BGA689,29X29,40

.95 V

7

BOTTOM

2.46 mm

31 mm

YES

32

31 mm

CMOS

1 V

4

1 mm

FIXED POINT

S-PBGA-B689

667 rpm

NO

MPC8543ECVJANGC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

MC8640TVU1250HC

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

GRID ARRAY

1 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1250 rpm

YES

e2

MPC8545ECVJAQGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

e2

MPC8536BVJAQG

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1,1.5/1.8,1.8/3.3

GRID ARRAY

BGA783,28X28,40

BOTTOM

CMOS

Microprocessors

1 mm

S-PBGA-B783

Not Qualified

1000 rpm

MC8641DVU1250GB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MPC8547ECPXAQGC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

64

32

GRID ARRAY

1.045 V

TIN LEAD SILVER

BOTTOM

3.38 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

e0

P1021NXN2DFA

NXP Semiconductors

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY

.95 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

100 MHz

31 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B689

533 rpm

YES

e2

P1011NSN2FFA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

BGA689,29X29,40

.95 V

7

BOTTOM

2.46 mm

31 mm

YES

32

31 mm

CMOS

1 V

4

1 mm

FIXED POINT

S-PBGA-B689

667 rpm

NO

MPC8378CVRAGGA

NXP Semiconductors

MICROPROCESSOR

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

GRID ARRAY

.95 V

BOTTOM

2.46 mm

31 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66.66 MHz

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

Not Qualified

400 rpm

YES

MC8641VJ1500KB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

1500 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.