RECTANGULAR Microprocessors 716

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8541VTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541CPXAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541CVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541VTALD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541EVTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541EPXALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	30	245	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES	e0
MPC8541ECPXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541ECPXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541EVTAJE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541CVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541VTALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES
MPC8541CPXALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541EVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	833 rpm	YES	e2
MPC8541ECVTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541CPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541EVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541CVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541EVTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541PXAKE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541ECPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541ECVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541ECVTAPE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541VTAKE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541ECVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541ECVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541PXALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	30	245	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES	e0
MPC8541CPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541CVTAJD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e2
MPC8541PXAKF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541VTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541CVTAKE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541CVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541ECPXAQF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541ECPXALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541ECVTALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES
MPC8541EPXAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541VTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541EVTAQF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	40	260	29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	1000 rpm	YES
MPC8541VTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541EPXAQD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541ECPXAKE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.14 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V	Microprocessors	1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES	e0
MPC8541CPXAJE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541CVTAJE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541EPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm	YES	64	166 MHz	30	245	29 mm	CMOS		1.2 V		1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	833 rpm	YES	e0
MPC8541VTAQD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel	0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS		1.3 V		1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
5962-01-220-3065	Infineon Technologies	MICROPROCESSOR, RISC	MILITARY	THROUGH-HOLE	52	DIP	RECTANGULAR	CERAMIC		NO		38535Q/M;38534H;883B		16	5	IN-LINE	DIP52,.9		125 Cel	-55 Cel		DUAL									CMOS	173 mA	5 V	Microprocessors	2.54 mm		R-XDIP-T52		Not Qualified	13.3 rpm
SAB8085A-P	Infineon Technologies	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO				8	5	IN-LINE	DIP40,.6		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL									MOS	170 mA	5 V	Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	3 rpm		e0
SAB8088-1-P	Infineon Technologies	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V		20	8	5	IN-LINE	DIP40,.6	4.75 V	70 Cel	0 Cel	TIN LEAD	DUAL	5.1 mm	15.24 mm	NO	8	10 MHz			50.9 mm	NMOS	340 mA	5 V	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	10 rpm	NO	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.