RECTANGULAR Microprocessors 716

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
S9S08RN16W2MTG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	2.7 V	125 Cel		8	-40 Cel	TIN	DUAL	1.2 mm		2048	4.4 mm	NO	0	20 MHz	40	260	5 mm		CMOS	14 mA	3 V	1			.65 mm	FIXED POINT	R-PDSO-G16	3		20 rpm	YES	e3
MSCMMX6QZDK08AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	500	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				0			GRID ARRAY, FINE PITCH			85 Cel			0 Cel		BOTTOM	1.8 mm			14 mm	YES	0		40	260	17 mm		CMOS						.65 mm	FIXED POINT	R-PBGA-B500	3		800 rpm	YES
S8X305I/883B	NXP Semiconductors	MICROPROCESSOR, RISC	MILITARY	THROUGH-HOLE	50	DIP	RECTANGULAR	CERAMIC		NO			MIL-STD-883 Class B (Modified)		8	5	IN-LINE	DIP50,.9		125 Cel			-55 Cel	Tin/Lead (Sn/Pb)	DUAL												TTL		5 V		Microprocessors		2.54 mm		R-XDIP-T50		Not Qualified	4 rpm		e0
S9S08RN16W2MTJ	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.7 V	125 Cel		8	-40 Cel	TIN	DUAL	1.2 mm		2048	4.4 mm	NO	0	20 MHz	40	260	6.5 mm		CMOS	14 mA	3 V	1			.65 mm	FIXED POINT	R-PDSO-G20	3		20 rpm	YES	e3
XPC755BPX350LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V						GRID ARRAY		1.9 V						BOTTOM					YES							CMOS		2 V					FIXED POINT	R-PBGA-B360			350 rpm	NO
XPC755BPX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V						GRID ARRAY		1.9 V						BOTTOM					YES							CMOS		2 V					FIXED POINT	R-PBGA-B360			300 rpm	NO
MSCMMX6DZDK08AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	500	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				0			GRID ARRAY, FINE PITCH			85 Cel			0 Cel		BOTTOM	1.8 mm			14 mm	YES	0			260	17 mm		CMOS						.65 mm	FIXED POINT	R-PBGA-B500	3		800 rpm	YES
S9S08RN8W2MTG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	2.7 V	125 Cel		8	-40 Cel	TIN	DUAL	1.2 mm		2048	4.4 mm	NO	0	20 MHz	40	260	5 mm		CMOS	14 mA	3 V	1			.65 mm	FIXED POINT	R-PDSO-G16	3		20 rpm	YES	e3
SCN68010CAN64	NXP Semiconductors		COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V			23	16		IN-LINE		4.75 V	70 Cel			0 Cel	TIN LEAD	DUAL					NO	16						CMOS		5 V					FIXED POINT	R-PDIP-T64			10 rpm	YES	e0
XPC745BPX350LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V						GRID ARRAY		1.9 V						BOTTOM					YES							CMOS		2 V					FIXED POINT	R-PBGA-B255			350 rpm	NO
XPC745BPX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V						GRID ARRAY		1.9 V						BOTTOM					YES							CMOS		2 V					FIXED POINT	R-PBGA-B255			300 rpm	NO
S9S08RN8W2MTJ	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8		0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.7 V	125 Cel		8	-40 Cel	TIN	DUAL	1.2 mm		2048	4.4 mm	NO	0	20 MHz	40	260	6.5 mm		CMOS	14 mA	3 V	1			.65 mm	FIXED POINT	R-PDSO-G20	3		20 rpm	YES	e3
MC9S08GT60ACB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	3.6 V				8	2/3.3	IN-LINE, SHRINK PITCH	SDIP42,.6	1.8 V	85 Cel			-40 Cel		DUAL	5.08 mm	61440		15.24 mm	NO		40 MHz			36.83 mm	4096	CMOS	7.5 mA	2 V		Microcontrollers	FLASH	1.778 mm	FIXED POINT	R-PDIP-T42	1	Not Qualified	40 rpm	YES
MC9S08PT16VTJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	TSSOP20,.25	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		16384			NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	.635 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
MPC7410THX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.9 V						GRID ARRAY		1.7 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM					NO			40	260			CMOS		1.8 V					FIXED POINT	R-PBGA-B	1	Not Qualified	400 rpm	NO	e0
MC9S08PT16VWJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	SOP20,.4	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		16384			NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	1.27 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
MC9S08PT8VWJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	SOP20,.4	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		8192			NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	1.27 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
MPC7410RX550PE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL		BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.05 V						GRID ARRAY		1.95 V						BOTTOM					YES		133 MHz					CMOS		2 V					FIXED POINT	R-CBGA-B			550 rpm	NO
MC9S08PT8VTJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES					8	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel	HCS08		-40 Cel	TIN	DUAL		8192						40	260		2048	CMOS	14 mA			Microcontrollers	FLASH	.635 mm		R-PDSO-G20	3	Not Qualified	20 rpm		e3
MC9S08GT32ACB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	3.6 V				8	2/3.3	IN-LINE, SHRINK PITCH	SDIP42,.6	1.8 V	85 Cel			-40 Cel		DUAL	5.08 mm	32768		15.24 mm	NO		40 MHz			36.83 mm	2048	CMOS	7.5 mA	2 V		Microcontrollers	FLASH	1.778 mm	FIXED POINT	R-PDIP-T42	1	Not Qualified	40 rpm	YES
MPC7410THX450LE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.9 V						GRID ARRAY		1.7 V	105 Cel			-40 Cel		BOTTOM					NO							CMOS		1.8 V					FIXED POINT	R-PBGA-B			450 rpm	NO
MC9S08PT8VTG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES					8	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		105 Cel	HCS08		-40 Cel	MATTE TIN	DUAL		8192						40	260		2048	CMOS	14 mA			Microcontrollers	FLASH	.635 mm		R-PDSO-G16	3	Not Qualified	20 rpm		e3
MPC7410RX500PE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL		BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.05 V						GRID ARRAY		1.95 V						BOTTOM					YES		133 MHz					CMOS		2 V					FIXED POINT	R-CBGA-B			500 rpm	NO
MC68330FG16	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.25 V			32	32	5	FLATPACK, FINE PITCH	QFP128,.68X.85,20	4.75 V	70 Cel			0 Cel	TIN LEAD	QUAD	3.4 mm			14 mm	YES	16	16.78 MHz			20 mm		HCMOS		5 V		Microprocessors		.5 mm	FIXED POINT	R-PQFP-G128		Not Qualified	16.78 rpm	YES	e0
MC68330CFG16	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.25 V			32	32	5	FLATPACK, FINE PITCH	QFP128,.68X.85,20	4.75 V	85 Cel			-40 Cel	TIN LEAD	QUAD	3.4 mm			14 mm	YES	16	16.78 MHz			20 mm		HCMOS		5 V		Microprocessors		.5 mm	FIXED POINT	R-PQFP-G128		Not Qualified	16.78 rpm	YES	e0
MC9S08PT16VTG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	TSSOP16,.25	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		16384			NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	.635 mm	FIXED POINT	R-PDSO-G16	3	Not Qualified	20 rpm	YES	e3
MPC7410RX450PE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL		BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.05 V						GRID ARRAY		1.95 V						BOTTOM					YES		133 MHz					CMOS		2 V					FIXED POINT	R-CBGA-B			450 rpm	NO
MC9S08PT8VWJ,574	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8		SMALL OUTLINE, SHRINK PITCH		2.7 V	105 Cel			-40 Cel		DUAL					NO	0	20 MHz					CMOS		5 V				1 mm	FIXED POINT	R-PDSO-G20			20 rpm	YES
MPC8541ECPXAJE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541CVTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541ECVTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC860TZP50	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	357	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				32	32		GRID ARRAY			70 Cel			0 Cel		BOTTOM					YES	32		NOT SPECIFIED	NOT SPECIFIED			CMOS		3.3 V					FIXED POINT	R-PBGA-B357			50 rpm	YES
MPC8541CPXAQD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541ECVTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541PXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			0 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541EPXAKD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			0 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541CPXAQF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541EPXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel			0 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541EVTALD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			0 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541CVTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541CPXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541EPXAQF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel			0 Cel	TIN LEAD	BOTTOM	3.75 mm			29 mm	YES	64	166 MHz	30	245	29 mm		CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	1000 rpm	YES	e0
MPC8541ECPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541CVTALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541CVTALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541ECPXAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			-40 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541PXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel			0 Cel		BOTTOM	3.75 mm			29 mm	YES	64	166 MHz			29 mm		CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541EVTAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V			64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	3.75 mm			29 mm	YES	64	166 MHz	40	260	29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.