NXP Semiconductors - MC9S08PT8VTG

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MC9S08PT8VTG by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9S08PT8VTG
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
In Stock2,089
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 14 mA
Terminal Finish: MATTE TIN
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
ROM Words: 8192
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: TSSOP
Moisture Sensitivity Level (MSL): 3
Speed: 20 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
RAM Bytes: 2048
Bit Size: 8
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: TSSOP16,.25
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: HCS08
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