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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC9S08PT8VTJ |
| Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; |
| In Stock | 3,663 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 14 mA |
| Terminal Finish: | TIN |
| No. of Terminals: | 20 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G20 |
| Package Shape: | RECTANGULAR |
| ROM Words: | 8192 |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | TSSOP |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 20 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| RAM Bytes: | 2048 |
| Bit Size: | 8 |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP20,.25 |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
| CPU Family: | HCS08 |
