SQUARE Microprocessors 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			32			GRID ARRAY, HEAT SINK/SLUG		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V				1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
ATSAMA5D34A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
AM3356BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AT91SAM9263B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	98304	15 mm		YES	32	50 MHz			15 mm	CMOS	73.3 mA	1.2 V	22			.8 mm	FIXED POINT	S-PBGA-B324			240 rpm	YES	e1
ATSAMA5D35A-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CUS100NEP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	30	260	16 mm	CMOS	37 mA	1.14 V			Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MCF5484CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
SAM9X60T-V/DWB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	228	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.21 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA228,16X16,26	1.12 V	105 Cel	1	-40 Cel		BOTTOM	1.2 mm	69632	11 mm		YES	32	48 MHz			11 mm	CMOS		1.15 V	16			.65 mm	FIXED POINT	S-PBGA-B228			600 rpm	YES
ATSAMA5D22C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D35A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
SPC5200CBV400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC8321ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
P1010NXE5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
AM3703CUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	800 mA	1.1 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
P1022NSN2MHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V				32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FIXED POINT	S-PBGA-B689	3		1200 rpm	YES	e2
AM3517AZERC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AT91SAM9X25-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	16 MHz			15 mm	CMOS		1 V	16		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
ATSAMA5D42B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
MCF54417CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC8270VRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
ADSP-21489BSWZ-4A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	400 rpm	NO	e3
AM3354BZCZA80R	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.21 V				TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		800 rpm	YES	e1
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS						.8 mm		S-PBGA-B624	3				e1
AT91SAM9X25-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	16 MHz			15 mm	CMOS		1 V	16		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
MPC8321VRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
P4080NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
AM3351BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
AM3351BZCEA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		600 rpm	YES	e1
MPC8313CVRAFFC	NXP Semiconductors	MICROPROCESSOR		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			32	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3		333 rpm	YES	e2
AM3354BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM6442BSDGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7		.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
MCF5373LCVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	80 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
AM3352BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8280CZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	YES	e0
AM3517AZERAC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V			16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz	30	260	23 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
P1021NXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
DM3725CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MC7455ARX1000LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	1000 rpm	YES
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz			10 mm	CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
DM3730CUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
DM3730CUSD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
TDA4VM88TGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		26		.8 mm	FLOATING-POINT	S-PBGA-B827	3		2000 rpm	YES	e1
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
KMPC866TZP133A	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32	32		GRID ARRAY							BOTTOM	2.52 mm		25 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	32	133 MHz			25 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	133 rpm	YES
MCF54416CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC852TVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.