SQUARE Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC7448TVU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		0			GRID ARRAY		1 V					BOTTOM	2.4 mm		25 mm		YES	0	200 MHz	40	260	25 mm	CMOS		1.05 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1		1267 rpm	YES
MCIMX6S1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC8347CVVAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e2
MPC8358ECZQAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				TIN LEAD	BOTTOM	2.46 mm		29 mm		YES	32	66.67 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B668	3	Not Qualified	400 rpm	YES	e0
MCF5307AI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		FLATPACK, FINE PITCH		3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	33.33 MHz	30	250	28 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
MCIMX6U6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
P2010NXN2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16	32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
T1042NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES
VCBU3730GSCUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.14 V				.65 mm	FLOATING POINT	S-PBGA-B423	3		1000 rpm	YES	e1
MCF5271CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MPC860SRCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
AM3352BZCZT60R	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
AM5706BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
MCF5208CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm		YES	32	40 MHz	40	260	15 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES	e1
MPC8270CZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	8	32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm	32768	37.5 mm		YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V	4	16	Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e0
RTPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V		26	32		GRID ARRAY		1.3775 V					BOTTOM					YES	32	3.6864 MHz	30	240		CMOS		1.45 V					FIXED POINT	S-PBGA-B356		Not Qualified	520 rpm	YES
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5706BCBDDA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5706BCBDDEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AT91SAM9G45B-CU-999	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7		.8 mm	FIXED POINT	S-PBGA-B324			400 rpm	YES
AT91SAM9M10C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	14	32	1,1.8/3.3,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	16	12 MHz			15 mm	CMOS		1 V	37		Microprocessors	.8 mm	FIXED POINT	R-PBGA-B324		Not Qualified	400 rpm	YES
MCF5328CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm		YES	32	80 MHz	40	260	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
P1020NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1	GRID ARRAY	BGA689,29X29,40	.95 V		12		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4		Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	800 rpm	NO	e2
ADSP-21488KSWZ-4B1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		400 rpm	NO	e3
TDA4VM88TGBALFR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		26		.8 mm	FLOATING-POINT	S-PBGA-B827	3		2000 rpm	YES	e1
ADSP-21488KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
AM6442BSEFGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16	14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7		.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
ATSAMA5D27C-LD1G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
MC7455ARX933LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	933 rpm	YES
MPC885VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
P1022NXE2LFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
AM3874CCYEA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	786432	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	64		Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	800 rpm	YES	e1
ATSAMA5D225C-D1M-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	65536	11 mm		YES	0	24 MHz			11 mm	CMOS		1.2 V	51	1		.75 mm	FIXED POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D31A-CFU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,22X22,20	1.08 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.2 V	39	10	Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
LS1046ASE8Q1A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	HBGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm					30	250	23 mm	CMOS						.8 mm		S-PBGA-B780	3		64 rpm		e1
MC7448HX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MC7455ARX867LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	867 rpm	YES
AM3359ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V				TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM5746ABZXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM6411BSCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16	14	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	2359296	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V		7		.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MIMXRT1015CAF4B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	0	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.15 V	105 Cel	0	-40 Cel		QUAD	1.7 mm	131072	14 mm		YES	0	24 MHz	40	260	14 mm	CMOS	90 mA		32	6		.5 mm	FLOATING POINT	S-PQFP-G100	3		396 rpm	YES
MPC880CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
OMAP3530ECUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm					30	260	16 mm	CMOS					Graphics Processors	.65 mm		S-PBGA-B423	4	Not Qualified	720 rpm		e1
P1014NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, FINE PITCH		.95 V				TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	0	100 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425	3		800 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.