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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1802EZWTD3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM3354BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3357BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3357ZCZD27	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V				TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.1 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	275 rpm	YES	e1
AM3357ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V			28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V				TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM3358BGCZA80EP	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			28	32		GRID ARRAY		1.056 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM					YES	16		20	220		CMOS		1.1 V					FIXED POINT	S-PBGA-B324	3		800 rpm	YES	e0
AM5706BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
ATSAMA5D26C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D31A-CFUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,22X22,20	1.08 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.2 V	39	10	Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES
DRA829VMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	3670016	24 mm		YES	32	27 MHz		250	24 mm	CMOS		.8 V		31		.8 mm	FIXED POINT	S-PBGA-B827	3		2000 rpm	YES	e1
KMPC8347VVAJFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
LX2160SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
LX2160XN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MCF5206ECAB40	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			28	32		FLATPACK		3 V	85 Cel		-40 Cel	TIN	QUAD	3.85 mm		28 mm		YES	32	40 MHz	30	245	28 mm	CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160	3		40 rpm	YES	e3
MCF5270VM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5271CVM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5307AI90B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32	32		FLATPACK, FINE PITCH		3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	45.45 MHz	30	250	28 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	90 rpm	YES	e3
MCF5307CAI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	33.33 MHz	30	250	28 mm	CMOS		3.3 V			Microprocessors	.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
MCF5307CAI90B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES					32	3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel		0 Cel	TIN	QUAD								30	250		CMOS		3.3 V			Microprocessors	.5 mm		S-PQFP-G208	3	Not Qualified	90 rpm		e3
MPC8280CVVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e1
MPC8323EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			14			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516			266 rpm	YES
MPC8547ECHXAUJ	Freescale Semiconductor	MICROPROCESSOR		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.155 V			64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm		29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1.1 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B783	1	Not Qualified	1333 rpm	YES	e0
MPC860ENVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880CZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm		25 mm		YES	32	66.67 MHz	30	245	25 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES
MPC880VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC880VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC880ZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880ZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
P1011NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO	e2
PPC460EX-SUB1000T	M/a-com Technology Solutions	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V			32			GRID ARRAY		1.2 V	85 Cel		-40 Cel		BOTTOM	2.65 mm		35 mm		YES	32	100 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.25 V				1 mm	FLOATING POINT	S-PBGA-B728			1000 rpm	YES
QU80386EXTC33	Intel	MICROPROCESSOR, RISC		GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32	5	FLATPACK, BUMPER	SPQFP132,1.1SQ	4.5 V	117 Cel	12	-40 Cel		QUAD	4.57 mm	0	24.13 mm		YES	16	25 MHz			24.13 mm	CMOS	320 mA	5 V	2	3	Microprocessors	.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	33 rpm	YES
SPC5125YVN400	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
STM32MP131CAG3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.21 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	172032	9 mm		YES	16	48 MHz			9 mm	CMOS	239 mA	1.25 V	56	8		.5 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
STM32MP131FAG7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.32 V	105 Cel		-40 Cel		BOTTOM	1.2 mm	172032	9 mm		YES	16	48 MHz			9 mm	CMOS	268 mA	1.35 V	56	8		.5 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP135FAG7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.32 V	105 Cel		-40 Cel		BOTTOM	1.2 mm	172032	9 mm		YES	16	48 MHz			9 mm	CMOS	268 mA	1.35 V	56	10		.5 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP157AAA3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	18 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			650 rpm	YES
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
XTDA4VMXXXGALF	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.77 V	125 Cel		-40 Cel		BOTTOM	2.8 mm	5242880	24 mm		YES	32	27 MHz			24 mm	CMOS		.8 V				.8 mm	FLOATING POINT	S-PBGA-B827			1000 rpm	YES
Z84C0008VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	8 MHz	40	260	16.5862 mm	CMOS	40 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	8 rpm	YES	e3
AM1705DPTPD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES		8		13	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.2 V	40			.5 mm	FIXED POINT	S-PQFP-G176	4		375 rpm	YES	e4
AM3352BZCE30R	Texas Instruments	MICROPROCESSOR, RISC		BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V				TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3703CBP100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	65536	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	740 mA	1.1 V			Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.