SQUARE Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	2.8 mm			25 mm		YES	64	200 MHz	40	260	25 mm		CMOS		1.15 V			Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC7410HX500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V			32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V					TIN LEAD	BOTTOM	3.2 mm			25 mm		YES	64	133 MHz	40	260	25 mm		CMOS		1.8 V					1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES	e0
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel			-40 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
RH80536GC0332MSL8U6	Intel	MICROPROCESSOR		PIN/PEG	478	SPGA	SQUARE	PLASTIC/EPOXY	YES	NO				28	32	1.3	GRID ARRAY, SHRINK PITCH	PGA478,26X26,50							PERPENDICULAR	4.13 mm			35 mm	ITS ALSO OPERATES AT TYPICAL CORE VOLTAGE 0.988 V AT 600MHZ	YES	64				35 mm		CMOS	21000 mA	1.34 V			Microprocessors		1.27 mm	FLOATING POINT	S-PPGA-P478		Not Qualified	1800 rpm	YES
XPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V			32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.375 V	105 Cel		5	0 Cel		BOTTOM	1.65 mm			35 mm		YES	64	66 MHz			35 mm		CMOS		2.5 V	2				1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MCF5207CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			13 mm		YES	32	40 MHz	40	260	13 mm		CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	166.67 rpm	YES	e1
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel			-40 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
XCF5206EFT40	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			28	32		FLATPACK		3 V	70 Cel			0 Cel		QUAD	3.85 mm			28 mm		YES	32				28 mm		CMOS		3.3 V					.65 mm	FIXED POINT	S-PQFP-G160		Not Qualified	40 rpm	YES
21281-DB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V			32	32	2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.8 V	70 Cel			0 Cel		QUAD	1.6 mm			20 mm		YES	32	3.68 MHz			20 mm		CMOS		2 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified	166 rpm	YES
CS80C286-25	Renesas Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V			24			CHIP CARRIER		4.75 V	70 Cel			0 Cel		QUAD	4.57 mm			24.23 mm		NO	16				24.23 mm		CMOS		5 V					1.27 mm	FIXED POINT	S-PQCC-J68			20 rpm	YES
A80960CF-40	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	8		32	32	5	GRID ARRAY	PGA168,17X17	4.5 V	85 Cel		9	0 Cel		PERPENDICULAR	4.57 mm		512	44.7 mm	OPERATING CASE TEMPERTURE 0 TO 85 C	NO	32	80 MHz			44.7 mm		MOS	1150 mA	5 V	4	0	Microprocessors		2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	40 rpm	NO
GCIXP1200GA	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel			0 Cel	TIN LEAD	BOTTOM	1.67 mm			40 mm		YES	32	166 MHz			40 mm		CMOS		2 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B432		Not Qualified	166 rpm	NO	e0
MCF5233CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5235CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
P1022NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES		133 MHz	40	260	31 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P2010NXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16	32		GRID ARRAY		1 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64	100 MHz	40	260	31 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P3041NXN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.04 V			0			GRID ARRAY		.96 V					TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	0	133 MHz	30	245	37.5 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
A80960KA25	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.5 V	0		32	32	5	GRID ARRAY	PGA132,14X14	4.5 V	85 Cel		4	0 Cel		PERPENDICULAR	4.57 mm		0	37.08 mm	REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS	NO	32	32 MHz	NOT SPECIFIED	NOT SPECIFIED	37.08 mm		CMOS	420 mA	5 V	0	0	Microprocessors		2.54 mm	FIXED POINT	S-CPGA-P132		Not Qualified	25 rpm	NO
AF82801JIRSLB8S	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES						1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40							BOTTOM													CMOS					Other uPs/uCs/Peripheral ICs		1 mm		S-PBGA-B676		Not Qualified
CM8064601483405/SR1CN	Intel	MICROPROCESSOR		NO LEAD	1150	LGA	SQUARE		YES	YES					64		GRID ARRAY								BOTTOM						NO							CMOS								FIXED POINT	S-XBGA-N1150			2700 rpm	NO
FA80386EXTC33	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32		FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	118 Cel			-40 Cel		QUAD	1.7 mm			20 mm		YES	16	66 MHz	NOT SPECIFIED	NOT SPECIFIED	20 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified	33 rpm	YES
LS1012ASE7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel			0 Cel		BOTTOM	.925 mm			9.6 mm		YES	16	25 MHz	40	260	9.6 mm		CMOS		.9 V					.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
LUPXA255A0C400	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.43 V			26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	85 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm			17 mm		YES	32	3.6864 MHz	40	250	17 mm		CMOS		1.3 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel			-40 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC860DEZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				0 Cel	TIN LEAD	BOTTOM	2.52 mm			25 mm		YES	32	50 MHz	30	245	25 mm		CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
NG80960JD3V66	Intel	MICROPROCESSOR, RISC		GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V			32	32		FLATPACK		3.15 V						QUAD						YES	32	33.3 MHz	NOT SPECIFIED	NOT SPECIFIED			CMOS		3.3 V						FIXED POINT	S-PQFP-G132		Not Qualified	66 rpm	YES
SCC68070CCA84	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES					32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel			0 Cel		QUAD													CMOS	112 mA	5 V			Microprocessors		1.27 mm		S-PQCC-J84		Not Qualified	15 rpm
TA80960KB-16	Intel	MICROPROCESSOR, RISC	AUTOMOTIVE	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	0		32	32	5	GRID ARRAY	PGA132,14X14	4.5 V	125 Cel		4	-40 Cel		PERPENDICULAR	4.57 mm		0	37.08 mm	OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS	NO	32	32 MHz			37.08 mm		CMOS	315 mA	5 V	0	0	Microprocessors		2.54 mm	FLOATING POINT	S-CPGA-P132		Not Qualified	16 rpm	NO
TN80C188XL12	Intel	MICROPROCESSOR	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		20	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel		5	-40 Cel	TIN LEAD	QUAD	4.83 mm		0	24.2316 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS	NO	8	25 MHz			24.2316 mm		CMOS	62.5 mA	5 V	2	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12 rpm	YES	e0
XPC860SRZP50C1	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				0 Cel	TIN LEAD	BOTTOM	2.05 mm			25 mm			32	50 MHz			25 mm		CMOS		3.3 V			Other Microprocessor ICs		1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
CH80566EE014DT/SLGPP	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	437	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		AEC-Q100	28	64	1	GRID ARRAY, HEAT SINK/SLUG	BGA437,21X21,40	.9 V	85 Cel			-40 Cel		BOTTOM	2.792 mm			22 mm	IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY	YES	64		NOT SPECIFIED	NOT SPECIFIED	22 mm		CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B437		Not Qualified	1330 rpm	YES
CM8063701098702SR0PA	Intel	MICROPROCESSOR		NO LEAD	1155		SQUARE	UNSPECIFIED	YES	YES					64										BOTTOM						NO							CMOS								FIXED POINT	S-XBGA-N1155			3500 rpm	NO
CS80C286-16	Renesas Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V			24			CHIP CARRIER		4.75 V	70 Cel			0 Cel		QUAD	4.57 mm			24.23 mm		NO	16				24.23 mm		CMOS		5 V					1.27 mm	FIXED POINT	S-PQCC-J68			16 rpm	YES
GG8067402570801SR2M5	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1667	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				0	64		GRID ARRAY			85 Cel			-40 Cel		BOTTOM						NO	0						CMOS								FIXED POINT	S-PBGA-B1667			1500 rpm	NO
KU80386EXTC25	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			26	32		FLATPACK		4.5 V	117 Cel			-40 Cel		QUAD	4.57 mm			24.13 mm		YES	16	50 MHz			24.13 mm		CMOS		5 V					.635 mm	FIXED POINT	S-PQFP-G132			25 rpm	YES
LUPXA255A0C200	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			26	32	1,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	.95 V	85 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2 mm			17 mm		YES	32	3.6864 MHz			17 mm		CMOS		1 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	200 rpm	YES	e1
MC68000FN10	Motorola	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0		23	32	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel		7	0 Cel	TIN LEAD	QUAD			0			NO	16	10 MHz					CMOS	30 mA	5 V	0	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	10 rpm	NO	e0
MC68060RC50	Motorola	MICROPROCESSOR		PIN/PEG	206	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	3.465 V	0		32	32		GRID ARRAY		3.135 V			7			PERPENDICULAR	3.05 mm		0	47.245 mm	BUS CONTROLLER	YES	32	50 MHz	NOT SPECIFIED	NOT SPECIFIED	47.245 mm		CMOS		3.3 V	0	0			2.54 mm	FLOATING POINT	S-CPGA-P206		Not Qualified	50 rpm	YES
MC68HC000FN12	Motorola	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0		23	32	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel		7	0 Cel	Tin/Lead (Sn/Pb)	QUAD	4.57 mm		0	24.2062 mm		NO	16	12 MHz			24.2062 mm		CMOS	35 mA	5 V	0	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12 rpm	NO	e0
MC9328MXLVH15	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel			0 Cel		BOTTOM	1.6 mm			14 mm		YES	32	16 MHz			14 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256		Not Qualified	150 rpm	YES
MC9S08PT16VLD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	FLATPACK	QFP44,.47SQ,32	2.7 V	105 Cel	HCS08		-40 Cel	TIN	QUAD		16384				NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V			Microcontrollers	FLASH	.8 mm	FIXED POINT	S-PQFP-G44	3	Not Qualified	20 rpm	YES	e3
MCF54452VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel			0 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel			0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	32	35 MHz	40	260	27 mm		CMOS		1.4 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8321EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	0	66.67 MHz	40	260	27 mm		CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC860ENCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm			25 mm		YES	32	50 MHz	30	245	25 mm		CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
P1013NSN2LFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64		40	260	31 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P2020NSE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16		1.05	GRID ARRAY	BGA689,29X29,40	1 V			7		TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64		40	260	31 mm		CMOS		1.05 V	4		Microprocessors		1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
P4040NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V					TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm		CMOS		1 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.