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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
IS80C88	Intersil	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	85 Cel		-40 Cel	TIN LEAD	QUAD	4.57 mm		16.585 mm		NO	8	5 MHz			16.585 mm	CMOS	50.5 mA	5 V			Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	5 rpm	YES	e0
KU80386EXTC33	Rochester Electronics	MICROPROCESSOR	INDUSTRIAL	GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		26	32		FLATPACK		4.5 V	117 Cel		-40 Cel		QUAD	4.57 mm		24.13 mm		YES	16	66 MHz			24.13 mm	CMOS		5 V				.635 mm	FIXED POINT	S-PQFP-G132			33 rpm	YES
KU80386SLB1A20	Intel	MICROPROCESSOR, RISC		GULL WING	196	BQFP	SQUARE	PLASTIC/EPOXY		YES				32	3.3/5	FLATPACK	SPQFP196,1.5SQ						QUAD											CMOS	325 mA				Microprocessors	.635 mm		S-PQFP-G196		Not Qualified	20 rpm
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		800 rpm	YES	e1
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		14	64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
MC68000FN8	Motorola	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0	23	32	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	7	0 Cel	TIN LEAD	QUAD		0			NO	16	8 MHz				CMOS	25 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	8 rpm	NO	e0
MC68010RC10	Motorola	MICROPROCESSOR	COMMERCIAL	PIN/PEG	68	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0	23	32		GRID ARRAY	PGA68,10X10	4.75 V	70 Cel	7	0 Cel	TIN LEAD	PERPENDICULAR	5.16 mm	0	26.92 mm		NO	16	10 MHz			26.92 mm	CMOS	30 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P68		Not Qualified	10 rpm	NO	e0
MC68SEC000CFU10	Motorola	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	NO	YES			24	32		FLATPACK			85 Cel		-40 Cel		QUAD	2.45 mm		14 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	10 MHz			14 mm	CMOS		3.3 V				.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	10 rpm	YES
MC7447AHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V				TIN LEAD	BOTTOM	3.24 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447ATHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V				TIN LEAD	BOTTOM	3.24 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447AVU1267LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	2.8 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e2
MC7448VU1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES
MC8640DTHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel		BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO
MC8641DVJ1333JE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		16	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1333 rpm	YES	e2
MCF52277CVM160	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		15 mm		YES	32	66.67 MHz	40	260	15 mm	CMOS	.7 mA	1.5 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	NO	e1
MCF5232CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF5253CVM140	NXP Semiconductors		OTHER	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.32 V		16			GRID ARRAY, FINE PITCH		1.08 V	70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	2.85 mm		13 mm		YES	16	35 MHz	40	260	13 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO	e1
MCF54410CMF250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0			GRID ARRAY		1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0					CMOS		1.2 V					FIXED POINT	S-PBGA-B196			250 rpm	YES
MCF54450VM240	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF5474VR200	NXP Semiconductors	MICROPROCESSOR		BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8	32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3			YES	e1
MCF5474ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e0
MCF5475VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
MCIMX6S6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS						.8 mm		S-PBGA-B624	3				e1
MCIMX6U1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MG80960MC-25	Rochester Electronics	MICROPROCESSOR, RISC	MILITARY	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V		32	32		GRID ARRAY		4.75 V	125 Cel		-55 Cel	TIN LEAD	PERPENDICULAR	4.061 mm		36.802 mm		NO	32	50 MHz			36.802 mm	CMOS		5 V				2.54 mm	FLOATING POINT	S-CPGA-P132		Not Qualified	25 rpm	NO	e0
MG80C186XL-20	Rochester Electronics	MICROPROCESSOR	MILITARY	PIN/PEG	68	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V		20	16		GRID ARRAY		4.5 V	125 Cel		-55 Cel	TIN LEAD	PERPENDICULAR	4.57 mm		29.464 mm		NO	16	40 MHz			29.464 mm	CMOS		5 V				2.54 mm	FIXED POINT	S-CPGA-P68		Not Qualified	20 rpm	YES	e0
MPC5200CVR400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY, HEAT SINK/SLUG		1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V				1.27 mm	FIXED POINT	S-PBGA-B272	3		400 rpm	YES	e1
MPC8255AVVMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	40	260	37.5 mm	CMOS						1.27 mm	FLOATING POINT	S-PBGA-B480	3		266 rpm	NO	e1
MPC8270ZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	100 rpm	NO	e0
MPC8306CVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B369	3		333 rpm	YES	e2
MPC8309CVMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	266 rpm	YES	e2
MPC8313ECVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313ECVRAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8313EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313ZQAFFC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e0
MPC8323EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8343CZQADDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
MPC8358CVVAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.14 V				TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	400 rpm	YES	e2
MPC8360VVAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.15 V				TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.3 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e2
MPC8555EVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V					BOTTOM	3.75 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	833 rpm	YES
MPC855TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC8569EVJANKGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				TIN SILVER COPPER	BOTTOM	3.94 mm		29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	800 rpm	YES	e1
N80C186-16	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.572 mm		24.2062 mm	DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO	16	32 MHz			24.2062 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	16 rpm	YES	e0
N80C188-20	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.572 mm		24.2062 mm	DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO	8	40 MHz			24.2062 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	20 rpm	YES	e0
NHPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V		26	32		GRID ARRAY		1.2825 V				TIN SILVER COPPER	BOTTOM					YES	32	3.6864 MHz				CMOS		1.35 V					FIXED POINT	S-PBGA-B360		Not Qualified	416 rpm	YES	e1
OMAP3530ECUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm					30	260	16 mm	CMOS					Graphics Processors	.65 mm		S-PBGA-B423	4	Not Qualified	720 rpm		e1
P2010NSN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.