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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MPC5200CVR400 |
Description | MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | MPC5200CVR400 Datasheet |
In Stock | 1,585 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.42 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.65 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 272 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 13 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B272 |
Maximum Clock Frequency: | 35 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HBGA |
Width: | 27 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR |
Maximum Supply Voltage: | 1.58 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Length: | 27 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |