Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
24 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.23 mm |
NO |
16 |
24.23 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
12.5 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
BALL |
676 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
0.75/1.15 |
GRID ARRAY, FINE PITCH |
BGA676,37X37,32 |
BOTTOM |
CMOS |
3500 mA |
Microprocessors |
.8 mm |
S-PBGA-B676 |
Not Qualified |
1.3 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
NO |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
FIXED POINT |
S-PQCC-J68 |
12 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
QUAD |
NO |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
FIXED POINT |
S-PQCC-J68 |
20 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
492 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3,3.3 |
GRID ARRAY |
BGA492,26X26,50 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-PBGA-B492 |
1 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
GULL WING |
208 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3,3.3/5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP208,1.2SQ,20 |
QUAD |
CMOS |
1450 mA |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
100 rpm |
||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
BALL |
360 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.485 V |
26 |
32 |
GRID ARRAY |
1.2825 V |
BOTTOM |
YES |
32 |
3.6864 MHz |
CMOS |
1.35 V |
FIXED POINT |
S-PBGA-B360 |
1 |
Not Qualified |
416 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
360 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.485 V |
26 |
32 |
GRID ARRAY |
1.2825 V |
85 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
3.6864 MHz |
CMOS |
1.35 V |
FIXED POINT |
S-PBGA-B360 |
1 |
Not Qualified |
416 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
432 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.1 V |
32 |
32 |
2,3.3 |
GRID ARRAY, LOW PROFILE |
BGA432,31X31,50 |
1.9 V |
70 Cel |
0 Cel |
BOTTOM |
1.67 mm |
40 mm |
YES |
32 |
200 MHz |
40 mm |
CMOS |
2 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B432 |
1 |
Not Qualified |
200 rpm |
NO |
||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
432 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.1 V |
32 |
32 |
2,3.3 |
GRID ARRAY, LOW PROFILE |
BGA432,31X31,50 |
1.9 V |
70 Cel |
0 Cel |
BOTTOM |
1.67 mm |
40 mm |
YES |
32 |
232 MHz |
40 mm |
CMOS |
2 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B432 |
1 |
Not Qualified |
232 rpm |
NO |
||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
432 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.1 V |
32 |
32 |
2,3.3 |
GRID ARRAY, LOW PROFILE |
BGA432,31X31,50 |
1.9 V |
70 Cel |
0 Cel |
BOTTOM |
1.67 mm |
40 mm |
YES |
32 |
232 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
40 mm |
CMOS |
2 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B432 |
Not Qualified |
232 rpm |
NO |
|||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
520 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.1 V |
32 |
32 |
GRID ARRAY, LOW PROFILE |
1.9 V |
70 Cel |
0 Cel |
BOTTOM |
1.7 mm |
40 mm |
YES |
32 |
232 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
40 mm |
CMOS |
2 V |
1.27 mm |
FIXED POINT |
S-PBGA-B520 |
Not Qualified |
232 rpm |
NO |
||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.45 V |
32 |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA196(UNSPEC) |
3.15 V |
BOTTOM |
YES |
32 |
33.3 MHz |
CMOS |
320 mA |
3.3 V |
Microprocessors |
FIXED POINT |
S-PBGA-B196 |
Not Qualified |
33 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
1 mm |
S-PBGA-B256 |
Not Qualified |
206 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
1667 |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
0 |
64 |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NO |
0 |
CMOS |
FIXED POINT |
S-PBGA-B1667 |
1600 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
24 |
CHIP CARRIER |
4.75 V |
85 Cel |
-40 Cel |
QUAD |
4.57 mm |
24.23 mm |
NO |
16 |
24.23 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
20 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
BALL |
480 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.2 V |
32 |
32 |
GRID ARRAY, LOW PROFILE |
1.9 V |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.65 mm |
37.5 mm |
YES |
64 |
66.66 MHz |
40 |
260 |
37.5 mm |
CMOS |
2 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B480 |
3 |
Not Qualified |
266 rpm |
NO |
e1 |
|||||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
32 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA357,19X19,50 |
1.7 V |
TIN SILVER COPPER |
BOTTOM |
2.52 mm |
25 mm |
YES |
32 |
30 |
245 |
25 mm |
CMOS |
1.8 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B357 |
3 |
Not Qualified |
133 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
32 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA357,19X19,50 |
1.7 V |
TIN SILVER COPPER |
BOTTOM |
2.52 mm |
25 mm |
YES |
32 |
40 |
260 |
25 mm |
CMOS |
1.8 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PBGA-B357 |
3 |
Not Qualified |
133 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
OTHER |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
26 |
32 |
3/5 |
FLATPACK, BUMPER |
SPQFP132,1.1SQ |
2.7 V |
100 Cel |
10 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.13 mm |
DRAM REFRESH CONTROLLER |
YES |
16 |
50 MHz |
24.13 mm |
CMOS |
420 mA |
5 V |
2 |
2 |
Microprocessors |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
Not Qualified |
25 rpm |
YES |
e0 |
||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
26 |
32 |
FLATPACK, BUMPER |
2.7 V |
117 Cel |
-40 Cel |
QUAD |
4.57 mm |
24.13 mm |
YES |
16 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
24.13 mm |
CMOS |
3.3 V |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
Not Qualified |
25 rpm |
YES |
||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
FLATPACK |
SPQFP100,.9SQ |
4.5 V |
70 Cel |
9 |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
19.05 mm |
NO |
8 |
50 MHz |
19.05 mm |
CMOS |
125 mA |
5 V |
4 |
2 |
Microprocessors |
.635 mm |
FIXED POINT |
S-PQFP-G100 |
4 |
Not Qualified |
25 rpm |
YES |
e0 |
||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
BALL |
479 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
28 |
32 |
GRID ARRAY |
BOTTOM |
2.85 mm |
35 mm |
YES |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
35 mm |
CMOS |
1.34 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B479 |
1800 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.64 V |
26 |
32 |
1.3,2.5/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.235 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2 mm |
17 mm |
YES |
32 |
3.6864 MHz |
40 |
250 |
17 mm |
CMOS |
1.3 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
400 rpm |
YES |
e1 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
22 |
32 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
10 MHz |
19.1262 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J52 |
Not Qualified |
10 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
32 |
GRID ARRAY |
PGA68,10X10 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
5.16 mm |
0 |
26.92 mm |
NO |
16 |
12 MHz |
26.92 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
12 rpm |
NO |
e0 |
||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
PIN/PEG |
128 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
32 |
32 |
GRID ARRAY |
4.75 V |
7 |
0 Cel |
PERPENDICULAR |
3.81 mm |
0 |
34.545 mm |
NO |
32 |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
34.545 mm |
CMOS |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
S-CPGA-P128 |
Not Qualified |
40 rpm |
NO |
|||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
128 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
32 |
32 |
5 |
GRID ARRAY |
PGA128,13X13 |
4.75 V |
70 Cel |
3 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
DYNAMIC BUS SIZING |
NO |
32 |
25 MHz |
CMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P128 |
Not Qualified |
25 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
10 MHz |
24.2062 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
10 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
16.67 MHz |
24.2062 mm |
CMOS |
50 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16.67 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
CHIP CARRIER |
4.75 V |
70 Cel |
7 |
0 Cel |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
16.67 MHz |
24.2062 mm |
CMOS |
50 mA |
5 V |
0 |
0 |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16.67 rpm |
NO |
||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
8 MHz |
24.2062 mm |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
5.16 mm |
0 |
26.92 mm |
NO |
16 |
12 MHz |
26.92 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
12 rpm |
NO |
e0 |
||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
GRID ARRAY |
1.08 V |
85 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
48 MHz |
CMOS |
FIXED POINT |
S-PBGA-B256 |
240 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
32 |
FLATPACK |
85 Cel |
-40 Cel |
QUAD |
YES |
66 MHz |
CMOS |
3.3 V |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
66 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
MILITARY |
PIN/PEG |
168 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
5.25 V |
0 |
38535Q/M;38534H;883B |
32 |
32 |
3.3 |
GRID ARRAY |
PGA168,17X17 |
3.135 V |
125 Cel |
3 |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
4.57 mm |
0 |
44.45 mm |
YES |
32 |
25 MHz |
44.45 mm |
CMOS |
1100 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P168 |
Not Qualified |
75 rpm |
YES |
e0 |
||||||||||||||||||||||
Motorola |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
480 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.2 V |
32 |
32 |
1.7/2.1,3.3 |
GRID ARRAY, LOW PROFILE |
BGA480,29X29,50 |
1.9 V |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1.65 mm |
37.5 mm |
REQUIRES 3.3V SUPPLY FOR I/O |
YES |
64 |
37.5 mm |
CMOS |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B480 |
Not Qualified |
266 rpm |
e0 |
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|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
OTHER |
BALL |
620 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY |
BGA620,28X28,40 |
1.14 V |
105 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.46 mm |
29 mm |
YES |
32 |
66 MHz |
40 |
260 |
29 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B620 |
3 |
Not Qualified |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR, RISC |
OTHER |
BALL |
672 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
32 |
32 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA672,34X34,40 |
1.14 V |
105 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.69 mm |
35 mm |
YES |
32 |
66 MHz |
40 |
260 |
35 mm |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B672 |
3 |
Not Qualified |
533 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR |
BALL |
783 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.155 V |
64 |
32 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA783,28X28,40 |
1.045 V |
Tin/Silver (Sn/Ag) |
BOTTOM |
3.38 mm |
29 mm |
YES |
64 |
133 MHz |
40 |
260 |
29 mm |
CMOS |
1.1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-CBGA-B783 |
1 |
Not Qualified |
1000 rpm |
YES |
e2 |
||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR |
BALL |
783 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA783,28X28,40 |
.95 V |
Tin/Silver (Sn/Ag) |
BOTTOM |
2.8 mm |
29 mm |
YES |
32 |
1000 MHz |
40 |
260 |
29 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B783 |
3 |
Not Qualified |
400 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR |
BALL |
783 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.155 V |
64 |
32 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA783,28X28,40 |
1.045 V |
Tin/Silver (Sn/Ag) |
BOTTOM |
3.38 mm |
29 mm |
YES |
64 |
133 MHz |
40 |
260 |
29 mm |
CMOS |
1.1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-CBGA-B783 |
1 |
Not Qualified |
1200 rpm |
YES |
e2 |
||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.83 mm |
24.2316 mm |
NO |
16 |
16 MHz |
24.2316 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
70 Cel |
6 |
0 Cel |
TIN LEAD |
QUAD |
4.83 mm |
0 |
29.3 mm |
NO |
16 |
50 MHz |
29.3 mm |
CMOS |
115 mA |
5 V |
0 |
2 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
Not Qualified |
25 rpm |
YES |
e0 |
|||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
5 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.83 mm |
0 |
24.2316 mm |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS |
NO |
8 |
25 MHz |
24.2316 mm |
CMOS |
62.5 mA |
5 V |
2 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
12 rpm |
YES |
e0 |
||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.45 V |
32 |
32 |
FLATPACK |
3.15 V |
QUAD |
YES |
32 |
33.3 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
3.3 V |
FIXED POINT |
S-PQFP-G132 |
Not Qualified |
33 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.45 V |
32 |
32 |
3.3,3.3/5 |
FLATPACK |
SPQFP132,1.1SQ |
3.15 V |
QUAD |
YES |
32 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
190 mA |
3.3 V |
Microprocessors |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
Not Qualified |
25 rpm |
YES |
||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
COMMERCIAL |
BALL |
1088 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
25 |
32 |
1.2,1.8,2.5,3.3,5 |
GRID ARRAY |
BGA1088,33X33,43 |
1.14 V |
70 Cel |
0 Cel |
BOTTOM |
5.635 mm |
37.5 mm |
YES |
16 |
1200 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
37.5 mm |
CMOS |
12000 mA |
1.2 V |
Microprocessors |
1.09 mm |
FLOATING POINT |
S-PBGA-B1088 |
Not Qualified |
1200 rpm |
YES |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.