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Manufacturer | Freescale Semiconductor |
---|---|
Manufacturer's Part Number | MPC8544EAVTAQG |
Description | MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 783; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V; |
Datasheet | MPC8544EAVTAQG Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.8 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver (Sn/Ag) |
No. of Terminals: | 783 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 32 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B783 |
Maximum Clock Frequency: | 1000 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HBGA |
Width: | 29 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | NO |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA783,28X28,40 |
Length: | 29 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1,1.8/2.5,3.3 |