SQUARE Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
PRIXP425ABD	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES					1.3,3.3	GRID ARRAY	BGA492,26X26,50		70 Cel		0 Cel		BOTTOM											CMOS					Microprocessors		1.27 mm		S-PBGA-B492		Not Qualified
QU80386EXTC25	Rochester Electronics	MICROPROCESSOR, RISC		GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		26	32	5	FLATPACK, BUMPER	SPQFP132,1.1SQ	4.5 V	117 Cel	12	-40 Cel		QUAD	4.57 mm	0	24.13 mm		YES	16	25 MHz			24.13 mm	CMOS	320 mA	5 V	2	3	Microprocessors		.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	25 rpm	YES
RK80546PG0801M	Intel	MICROPROCESSOR		PIN/PEG	478	SPGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	1.4 V		36	32	1.2	GRID ARRAY, SHRINK PITCH	BGA478,26X26,50	1.25 V					PERPENDICULAR	4.5 mm		35 mm		YES	64	200 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.2 V			Microprocessors		1.27 mm	FLOATING POINT	S-CPGA-P478		Not Qualified	3000 rpm	YES
SB80C188EC-20	Intel	MICROPROCESSOR	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	70 Cel	9	0 Cel	TIN LEAD	QUAD	1.66 mm	0	14 mm		NO	8	40 MHz			14 mm	CMOS	100 mA	5 V	4	2	Microprocessors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified	20 rpm	YES	e0
T1022NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES
A80486DX4WB100/SK096	Intel	MICROPROCESSOR, RISC		PIN/PEG	168	PGA	SQUARE	CERAMIC		NO				32	3.3,3.3/5	GRID ARRAY	PGA168,17X17						PERPENDICULAR											CMOS	1450 mA				Microprocessors		2.54 mm		S-XPGA-P168		Not Qualified	100 rpm
CM8063701211600SR0PK	Intel	MICROPROCESSOR		NO LEAD	1155	LGA	SQUARE	UNSPECIFIED	YES	YES				64	0.25/1.52	GRID ARRAY	LGA1155,40X40,36						BOTTOM											CMOS	112000 mA				Microprocessors		.9 mm		S-XBGA-N1155		Not Qualified	3900 rpm
CM8064601465605SR14J	Intel	MICROPROCESSOR		NO LEAD	1150		SQUARE	UNSPECIFIED	YES	YES				64									BOTTOM					NO			NOT SPECIFIED	NOT SPECIFIED		CMOS								FIXED POINT	S-XBGA-N1150			2900 rpm	NO
FA80486SXSF-33	Intel	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V	0	32	32	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	2.7 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	1.7 mm	0	24 mm		YES	32	33.33 MHz			24 mm	CMOS	345 mA	3.3 V	0	0	Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	33.33 rpm	YES	e0
MC68030RP25B	Motorola	MICROPROCESSOR	COMMERCIAL	PIN/PEG	128	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0	32	32		GRID ARRAY		4.75 V	70 Cel	7	0 Cel		PERPENDICULAR		0			NO	32	25 MHz				CMOS		5 V	0	0				FIXED POINT	S-CPGA-P128		Not Qualified	25 rpm	NO
MCIMX6L3EVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1.1 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MCIMX6L3EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS							.5 mm		S-PBGA-B	3				e1
MPC8569ECVJAQLJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				TIN SILVER COPPER	BOTTOM	3.94 mm		29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1067 rpm	YES	e1
MPC860DEZQ50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860ENCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
N80C188XL20	Intel	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	5	0 Cel	Tin/Lead (Sn/Pb)	QUAD	4.83 mm	0	24.2316 mm	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS	NO	8	40 MHz			24.2316 mm	CMOS	90 mA	5 V	2	0	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	20 rpm	YES	e0
N80L186EB-16	Intel	MICROPROCESSOR	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	20	16	3/5	CHIP CARRIER	LDCC84,1.2SQ	3 V	70 Cel	6	0 Cel	TIN LEAD	QUAD	4.83 mm	0	29.3 mm		NO	16	32 MHz			29.3 mm	CMOS	54 mA	3.3 V	0	2	Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J84		Not Qualified	16 rpm	YES	e0
NHPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V		26	32		GRID ARRAY		1.3775 V				TIN SILVER COPPER	BOTTOM					YES	32	3.6864 MHz				CMOS		1.45 V						FIXED POINT	S-PBGA-B360		Not Qualified	520 rpm	YES	e1
P1010NXN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
PR80321M400SL84R	Intel	MICROPROCESSOR		BALL	544	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V		64			GRID ARRAY		1.235 V					BOTTOM	2.59 mm		35 mm		YES	64	133 MHz			35 mm	CMOS		1.3 V					1.27 mm	FIXED POINT	S-PBGA-B544		Not Qualified	400 rpm	YES
QU80386EXTB25	Intel	MICROPROCESSOR, RISC		GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V		26	32	5	FLATPACK, BUMPER	SPQFP132,1.1SQ	3 V	117 Cel	12	-40 Cel		QUAD	4.57 mm	0	24.13 mm		YES	16	25 MHz			24.13 mm	CMOS	320 mA	3.3 V	2	3	Microprocessors		.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	25 rpm	YES
RH80536GC0212M	Intel	MICROPROCESSOR, RISC		PIN/PEG	478	SPGA	SQUARE	CERAMIC		NO				64	1.3	GRID ARRAY, SHRINK PITCH	PGA478,26X26,50						PERPENDICULAR											CMOS	21000 mA	1.3 V			Microprocessors		1.27 mm		S-XPGA-P478		Not Qualified	1500 rpm
S3C2410A20-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel		BOTTOM	1.26 mm		14 mm		YES	32	20 MHz			14 mm	CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B272			200 rpm	YES
TSPC603RVGS12LC	Atmel	MICROPROCESSOR, RISC		UNSPECIFIED	255	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V		32	32	2.5,3.3	GRID ARRAY	BGA255,16X16,50	2.375 V				TIN LEAD	BOTTOM	3.84 mm		21 mm		YES	64	75 MHz			21 mm	CMOS		2.5 V			Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-X255		Not Qualified	266 rpm	YES	e0
XPC850DSLZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V					1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC860ENCZP50C1	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.05 mm		25 mm			32	50 MHz			25 mm	CMOS		3.3 V			Other Microprocessor ICs		1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
88AP312-A2-BGW2C624-TN02	Marvell Technology	MICROPROCESSOR, RISC	OTHER	BALL	416	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA416,21X21,25		85 Cel		-25 Cel		BOTTOM	.93 mm		15 mm		YES	0	13.002 MHz			15 mm	CMOS					Graphics Processors		.65 mm	FLOATING POINT	S-PBGA-B416		Not Qualified	624 rpm	YES
A80386DX-16	Rochester Electronics	MICROPROCESSOR, RISC		PIN/PEG	132	PGA	SQUARE	CERAMIC		NO				32	5	GRID ARRAY	PGA132,14X14						PERPENDICULAR											CMOS		5 V			Microprocessors		2.54 mm		S-XPGA-P132		Not Qualified	16 rpm
A80486DX266	Intel	MICROPROCESSOR	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V	0	32	32	5	GRID ARRAY	PGA168,17X17	4.75 V	85 Cel	2	0 Cel	TIN LEAD	PERPENDICULAR	4.57 mm	0	44.45 mm	DYNAMIC BUS SIZING; BURST BUS; MULTIPROCESSOR SUPPORT; BUILT IN SELF TEST	YES	32	33 MHz			44.45 mm	CMOS	1200 mA	5 V	0	0	Microprocessors		2.54 mm	FLOATING POINT	S-CPGA-P168		Not Qualified	66 rpm	YES	e0
A80486DX4-100	Intel	MICROPROCESSOR, RISC		PIN/PEG	168	PGA	SQUARE	CERAMIC		NO				32	3.3	GRID ARRAY	PGA168,17X17					TIN LEAD	PERPENDICULAR											CMOS	1450 mA	3.3 V			Microprocessors		2.54 mm		S-XPGA-P168		Not Qualified	100 rpm		e0
A80486DX4WB100/SK101	Intel	MICROPROCESSOR, RISC		PIN/PEG	168	PGA	SQUARE	CERAMIC		NO				32	3.3,3.3/5	GRID ARRAY	PGA168,17X17						PERPENDICULAR											CMOS	1450 mA				Microprocessors		2.54 mm		S-XPGA-P168		Not Qualified	100 rpm
A80960CF-25	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	8	32	32	5	GRID ARRAY	PGA168,17X17	4.5 V	100 Cel	9	0 Cel		PERPENDICULAR	4.57 mm	512	44.7 mm	OPERATING CASE TEMPERTURE 0 TO 100 C	NO	32	50 MHz			44.7 mm	MOS	950 mA	5 V	4	0	Microprocessors		2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	25 rpm	NO
A80960HD66	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	3.45 V	8	32	32	3.3,3.3/5	GRID ARRAY	PGA168,17X17	3.15 V	85 Cel	9	0 Cel		PERPENDICULAR	4.57 mm	1024	44.7 mm	OPERATING CASE TEMPERATURE 0 TO 90	YES	32	40 MHz			44.7 mm	MOS	1790 mA	3.3 V	0	0	Microprocessors		2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	66 rpm	NO
AF82801JIR	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM											CMOS					Other Microprocessor ICs		1 mm		S-PBGA-B676		Not Qualified
AU80610004653AA/SLBMG	Intel	MICROPROCESSOR		BALL	559	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.175 V		15	64	0.8/1.175,1.5,1.8	GRID ARRAY	BGA559(UNSPEC)	.8 V					BOTTOM	2.35 mm		22 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	22 mm	CMOS	5770 mA				Microprocessors			FIXED POINT	S-PBGA-B559		Not Qualified	1660 rpm	YES
AV80576SH0516MSLGAF	Intel	MICROPROCESSOR		BALL	956	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		32	64	1.2	GRID ARRAY	BGA956,44X44,20	1.05 V					BOTTOM					YES	64	2260 MHz				CMOS	37000 mA	1.1 V			Microprocessors		.5 mm	FLOATING POINT	S-PBGA-B956		Not Qualified	1066 rpm	YES
AW80576GH0726M/SLB47	Intel	MICROPROCESSOR, RISC		PIN/PEG	478	SPGA	SQUARE	PLASTIC		NO				64	1.2	GRID ARRAY, SHRINK PITCH	PGA478,26X26,50						PERPENDICULAR												47000 mA	1.2 V			Microprocessors		1.27 mm		S-PPGA-P478		Not Qualified	2800 rpm
AW80577SH0513MSLGFC	Intel	MICROPROCESSOR		PIN/PEG	478	SPGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO			32	64	1.2	GRID ARRAY, SHRINK PITCH	PGA478,26X26,50						PERPENDICULAR	2.102 mm		35 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS	38000 mA	1.2 V			Microprocessors		1.27 mm	FLOATING POINT	S-CPGA-P478		Not Qualified	2260 rpm	YES
BX80621E52620SR0KW	Intel	MICROPROCESSOR		NO LEAD	2011	LGA	SQUARE	UNSPECIFIED	YES	YES				64	0.65/1.4	GRID ARRAY							BOTTOM					NO						CMOS					Microprocessors			FIXED POINT	S-XBGA-N2011		Not Qualified	2000 rpm	NO
CM80616003060AESLBTD	Intel	MICROPROCESSOR	INDUSTRIAL	BUTT	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	64		GRID ARRAY		1.045 V	85 Cel		-40 Cel		BOTTOM					YES	0	133 MHz				CMOS		1.1 V						FLOATING POINT	S-PBGA-B1156		Not Qualified	133 rpm	YES
CM8062301044204SR05Y	Intel	MICROPROCESSOR		NO LEAD	1155	LGA	SQUARE	PLASTIC/EPOXY		YES				64	0.25/1.52	GRID ARRAY	LGA1155,40X40,36						BOTTOM											CMOS	75000 mA				Microprocessors		.9 mm		S-PBGA-N1155		Not Qualified	3300 rpm
CM8062301046204SR05Q	Intel	MICROPROCESSOR		NO LEAD	1155	LGA	SQUARE	PLASTIC/EPOXY		YES				64	0.25/1.52	GRID ARRAY	LGA1155,40X40,36						BOTTOM											CMOS	75000 mA				Microprocessors		.9 mm		S-PBGA-N1155		Not Qualified	2900 rpm
CM8062307262304SR00G	Intel	MICROPROCESSOR		NO LEAD	1155	LGA	SQUARE	PLASTIC/EPOXY		YES				64	0.25/1.52	GRID ARRAY	LGA1155,40X40,36						BOTTOM											CMOS	112000 mA				Microprocessors		.9 mm		S-PBGA-N1155		Not Qualified	3100 rpm
CM8064601465605	Intel	MICROPROCESSOR		NO LEAD	1150		SQUARE	UNSPECIFIED	YES	YES				64									BOTTOM					NO						CMOS								FIXED POINT	S-XBGA-N1150			2900 rpm	NO
CM8066201920404SR2L6	Intel	MICROPROCESSOR		NO LEAD	1151	LGA	SQUARE	UNSPECIFIED	YES	YES				64		GRID ARRAY							BOTTOM					NO			NOT SPECIFIED	NOT SPECIFIED		CMOS								FIXED POINT	S-XBGA-N1151			3600 rpm	NO
CM8068403362607SR3XE	Intel	MICROPROCESSOR		NO LEAD	1151	BGA	SQUARE	UNSPECIFIED	YES	YES				64		GRID ARRAY							BOTTOM					NO						CMOS								FIXED-POINT	S-XBGA-N1151			4100 rpm	NO
CM8070104282134	Intel	MICROPROCESSOR		NO LEAD	1200		SQUARE	UNSPECIFIED	YES	YES				64									BOTTOM					NO						CMOS								FIXED POINT	S-XBGA-N1200			4100 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.