SQUARE Microprocessors 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC8641VJ1500KE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V			16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1500 rpm	YES	e2
MC9328MXSVP10	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MCF53281CVM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,1.8/3.3	GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B256	3	Not Qualified	240 rpm
MCIMX7D2DVK12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V			26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel		BOTTOM	1.1 mm		12 mm		YES	16		40	260	12 mm	CMOS		1.225 V				.4 mm	FLOATING POINT	S-PBGA-B488	3		1200 rpm	YES
MPC8323ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8343CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
R7S721021VLFP#AA1	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	208	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		26			FLATPACK, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	85 Cel	8	-40 Cel		QUAD	1.7 mm	3145728	28 mm		YES	32	13.33 MHz			28 mm	CMOS	492 mA	1.18 V	16	13		.5 mm	FLOATING POINT	S-PQFP-G208	3		400 rpm	YES
STM32MP131DAE7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	268 mA	1.35 V	56	8		.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP151AAB3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	1.18 V	125 Cel		-40 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	940 mA	1.2 V	48	8		.8 mm	FLOATING POINT	S-PBGA-B354			650 rpm	YES
STM32MP157DAA1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			800 rpm	YES
14305R-2000	Dialog Semiconductor	MICROPROCESSOR	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	NO	YES	3.6 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel		QUAD	.9 mm		7 mm		YES	0	10 MHz		260	7 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-XQCC-N48			80 rpm	NO
AM3351BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
AM3351BZCEA30R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO HAVING 28 GPMC ADDRESS AND 16 MULTIPLEXED ADDRESS AND DATA LINES	YES	16		30	260	13 mm	CMOS		1.1 V				.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
MCF54452CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54455CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC8347ECVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
STM32MP131CAG3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.21 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	172032	9 mm		YES	16	48 MHz			9 mm	CMOS	239 mA	1.25 V	56	8		.5 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
Z84C0006VEG	IXYS Corporation	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	100 Cel	2	-40 Cel	Matte Tin (Sn)	QUAD	4.57 mm	0	16.5862 mm	DRAM MEMORY REFRESH COUNTER	NO	8	6.17 MHz	40	260	16.5862 mm	CMOS	30 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	6.17 rpm	YES	e3
AM1806BZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
KMPC8270CZUQLDA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32		GRID ARRAY, LOW PROFILE		1.45 V					BOTTOM	1.65 mm		37.5 mm		YES	64	83.33 MHz	40	260	37.5 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO
LS1020AXN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MCF5275CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
PPC440EP-3JC400C	Applied Micro Circuits	MICROPROCESSOR, RISC		BALL	456	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,2.5,3.3	GRID ARRAY	BGA456,26X26,50	1.4 V					BOTTOM	2.65 mm		35 mm	ALSO REQUIRES 2.5 AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS	2200 mA	1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B456		Not Qualified	400 rpm	YES
SPC5200CBV400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
XPC860TZP50D4	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel		BOTTOM	2.05 mm		25 mm		YES	32	50 MHz			25 mm	CMOS		3.3 V			Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
AM5706BCBDD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
IBM25PPC750FX-GB0133T	Ibm Microelectronics	MICROPROCESSOR, RISC		BALL	292	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.5 V			32	32	1.45,1.8/3.3	GRID ARRAY	BGA292,20X20,40	1.4 V					BOTTOM	3.087 mm		21.02 mm		YES	64	200 MHz			21.02 mm	CMOS		1.45 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B292		Not Qualified	600 rpm	YES
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32		GRID ARRAY		1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
LS1012ASN7HKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		800 rpm	YES
MC9328MXSVP10R2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MPC8360ECVVAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.15 V				TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.3 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e2
AM1808EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
BV80605001908AK/SLBJJ	Intel	MICROPROCESSOR, RISC		NO LEAD	1156	LGA	SQUARE	PLASTIC/EPOXY		YES					64	0.65/1.4	GRID ARRAY	LGA1156,40X40,36						BOTTOM											CMOS	110000 mA				Microprocessors	.9 mm		S-PBGA-N1156		Not Qualified	2800 rpm
MC7455ARX733LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	733 rpm	YES
MPC8280ZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e0
RJ80530UY750512	Intel	MICROPROCESSOR, RISC		BALL	479	BGA	SQUARE	CERAMIC		YES					32	1.15,1.25	GRID ARRAY	BGA479,26X26,50					Tin/Lead (Sn/Pb)	BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B479		Not Qualified	750 rpm		e0
DM388AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD11FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V				TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		970 rpm	YES	e1
DM388AAARD21FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V				TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
LS1012AXE7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
MPC860PCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860PZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC860SRVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860TCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860TZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.