MICROPROCESSOR Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MC8641VU1333NB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1333 rpm

YES

MPC8533EVJAQFA

NXP Semiconductors

MICROPROCESSOR

BALL

783

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, HEAT SINK/SLUG

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

1000 rpm

YES

MPC8347VRAJDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

MPC8378ECVRAGDA

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

64

66.66 MHz

40

260

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

3

Not Qualified

400 rpm

YES

e2

MC8640DVJ1250HC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1250 rpm

YES

MPC8347EVVALFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

3

Not Qualified

667 rpm

YES

e2

MPC8349CZUALD

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

-40 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B672

1

Not Qualified

667 rpm

YES

MPC8343CVRADDX

NXP Semiconductors

MICROPROCESSOR

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

266 rpm

YES

MPC8378ECVRANG

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

15

GRID ARRAY, HEAT SINK/SLUG

1 V

125 Cel

-40 Cel

BOTTOM

2.46 mm

31 mm

YES

64

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-PBGA-B689

800 rpm

YES

MC8640DTVU1067NC

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

32

32

GRID ARRAY

.9 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1067 rpm

YES

e2

MPC8533CVTANJA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

MPC8533CVTARGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

1067 rpm

YES

e2

MPC8379CVRALFA

NXP Semiconductors

MICROPROCESSOR

CMOS

MPC8315VRAFDA

NXP Semiconductors

MICROPROCESSOR

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

1,1.8/2.5,3.3

GRID ARRAY

BGA620,28X28,40

.95 V

TIN SILVER

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

66.67 MHz

40

260

29 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

3

Not Qualified

333 rpm

YES

e2

MC8641VU1000JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

MPC8533CVTARJA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

1067 rpm

YES

e2

P1013NSE2LFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

133 MHz

40

260

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

3

1067 rpm

YES

e2

MPC8347EVVALFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

667 rpm

YES

MPC8347CVVAGFB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

-40 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

400 rpm

YES

MPC8533ECVTALG

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

667 rpm

YES

e2

MPC8533CVTARG

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

1067 rpm

YES

e2

P1013NXN2HFB

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY

.95 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

133 MHz

40

260

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

3

800 rpm

YES

e2

MPC8347VVALDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

667 rpm

YES

MC8641VU1000KC

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

MPC8347CZQAJFB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

MPC8540CVT833LC

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

3.85 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

MPC8347EVRALDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

667 rpm

YES

MPC8379CVRALF

NXP Semiconductors

MICROPROCESSOR

CMOS

MPC8377EVRAGD

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

GRID ARRAY

BGA689,29X29,40

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

31 mm

CMOS

1 V

4

1 mm

S-PBGA-B689

MPC8377EVRALGA

NXP Semiconductors

MICROPROCESSOR

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA689,29X29,40

.95 V

TIN SILVER

BOTTOM

2.46 mm

31 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66.66 MHz

40

260

31 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B689

3

Not Qualified

400 rpm

YES

e2

MC8641VU1250HE

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

32

166.66 MHz

NOT SPECIFIED

NOT SPECIFIED

33 mm

CMOS

1.05 V

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

166.66 rpm

YES

MPC8533CVTALJ

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

667 rpm

YES

e2

MPC8378CVRAGG

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

-40 Cel

BOTTOM

2.46 mm

31 mm

YES

64

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

400 rpm

YES

MC8610TVT800GZ

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

105 Cel

-40 Cel

BOTTOM

2.7 mm

29 mm

YES

64

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

800 rpm

YES

MPC8533CVTALGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

667 rpm

YES

e2

P1013NXN2EFB

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

GRID ARRAY

.95 V

125 Cel

-40 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

133 MHz

40

260

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

3

600 rpm

YES

e2

MC8641DHX1250NB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MPC8347CVRAJDB

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

-40 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

MC8641HX1000HB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

33 mm

CMOS

1.05 V

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

1

Not Qualified

166.66 rpm

YES

MPC8378EVRANG

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

15

GRID ARRAY, HEAT SINK/SLUG

1 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-PBGA-B689

800 rpm

YES

MPC8343EZQADDA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

1

Not Qualified

266 rpm

YES

T1013NSE7KQA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

MC9328MX21VK

NXP Semiconductors

MICROPROCESSOR

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.65 V

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.45 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.49 mm

14 mm

ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US

YES

32

32 MHz

40

260

14 mm

CMOS

1.5 V

.65 mm

FIXED POINT

S-PBGA-B289

3

Not Qualified

266 rpm

YES

e1

MPC8377VRALGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

40

260

31 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B689

3

Not Qualified

667 rpm

YES

e2

MPC8533ECVTANFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

MPC8313ZQAGDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

32

32

1,1.8/2.5,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA516,26X26,40

.95 V

105 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

66.67 MHz

27 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

YES

e0

MPC8347CZUAGDA

NXP Semiconductors

MICROPROCESSOR

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, LOW PROFILE

1.14 V

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

400 rpm

YES

MPC8535BVJAQGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.76 mm

29 mm

YES

64

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1000 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.