MICROPROCESSOR Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8533EVTANG	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MC8641DHX1000KB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm	ALSO REQUIRIED 1.05 VDD CORE1	YES	64	166.66 MHz			33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1000 rpm	YES
MPC8349ZUAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e0
MPC8377CVRANDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8314ECVRAFDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8347ECVVALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8379VRAJD	NXP Semiconductors	MICROPROCESSOR																														CMOS
MPC8343CZQADDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8343ZQAGDX	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8347VVADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES
MPC8347CZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MC8640DHX1250HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e0
MPC8533EVJANJA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8347EZQAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
MPC8377ECVRAGD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1 V	4			1 mm		S-PBGA-B689
MPC8533EVJALJ	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MC8641DHX1500GC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V	16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1500 rpm	YES
MPC8347EZQALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8347CVRADDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8349CZUAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
T1023NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
MPC8347VRADFA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MC8641DHX1000HC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm	ALSO REQUIRIED 1.05 VDD CORE1	YES	64	166.66 MHz			33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1000 rpm	YES
MPC8533EVJARF	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8536BVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783	3		800 rpm	YES	e2
P1013SSE2MHA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	0	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz			31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689			1200 rpm	YES	e2
MC8640TVJ1067NC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	YES
MPC8378VRAJF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MC8640DVJ1067NC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	YES
MPC8343EVRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8540VTAQFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MC8641DHX1333KC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MPC8378EVRAGGA	NXP Semiconductors	MICROPROCESSOR		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V					BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	400 rpm	YES
MC8610VT800GZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.7 mm	29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MPC8377EVRALG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1 V	4			1 mm		S-PBGA-B689
MC9328MX21SCVM	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	17 mm		YES	32	32 MHz	40	260	17 mm	CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8347VVAJDA	NXP Semiconductors	MICROPROCESSOR		BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V					BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	533 rpm	YES
MPC8540CVT667LC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MC8641VU1333KB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MC9328MXSCVP10	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V	25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MPC8349CZUALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
T1013NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8377VRAJF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8347EVRAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8379VRANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32	1.05,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	800 rpm	YES
MC8640DTVJ1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	YES
MPC8535CVJAKGA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.76 mm	29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783			600 rpm	YES
MPC8377CVRAGF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.