Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROPROCESSOR |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.95 V |
12 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.65 V |
70 Cel |
0 Cel |
QUAD |
1.7 mm |
14 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
66 MHz |
14 mm |
CMOS |
1.8 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
30 |
245 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
0 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
2.7 V |
125 Cel |
8 |
-40 Cel |
TIN |
DUAL |
1.2 mm |
2048 |
4.4 mm |
NO |
0 |
20 MHz |
40 |
260 |
6.5 mm |
CMOS |
14 mA |
3 V |
1 |
.65 mm |
FIXED POINT |
R-PDSO-G20 |
3 |
20 rpm |
YES |
e3 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER COPPER |
40 |
260 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
AUTOMOTIVE |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
0 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.7 V |
125 Cel |
8 |
-40 Cel |
TIN |
QUAD |
1.6 mm |
2048 |
7 mm |
NO |
0 |
20 MHz |
40 |
260 |
7 mm |
CMOS |
14 mA |
3 V |
2 |
.5 mm |
FIXED POINT |
S-PQFP-G48 |
3 |
20 rpm |
YES |
e3 |
|||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
32 |
GRID ARRAY |
70 Cel |
0 Cel |
BOTTOM |
YES |
CMOS |
FIXED POINT |
S-PBGA-B256 |
75 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
25 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.86 MHz |
40 |
260 |
20 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
3 |
120 rpm |
YES |
e3 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
26 |
32 |
GRID ARRAY |
70 Cel |
0 Cel |
BOTTOM |
3.16 mm |
21 mm |
YES |
32 |
25 MHz |
21 mm |
CMOS |
3.3 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
25 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
AUTOMOTIVE |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
0 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.7 V |
125 Cel |
16 |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
4096 |
10 mm |
NO |
0 |
20 MHz |
40 |
260 |
10 mm |
CMOS |
14.8 mA |
3 V |
3 |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
3 |
20 rpm |
YES |
e3 |
|||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
GULL WING |
184 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK |
QFP184,1.4SQ |
4.75 V |
0 Cel |
MATTE TIN |
QUAD |
YES |
32 |
25 MHz |
40 |
260 |
HCMOS |
5 V |
Microprocessors |
.635 mm |
FIXED POINT |
S-PQFP-G184 |
1 |
Not Qualified |
25 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
42 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
3.6 V |
8 |
2/3.3 |
IN-LINE, SHRINK PITCH |
SDIP42,.6 |
1.8 V |
85 Cel |
-40 Cel |
DUAL |
5.08 mm |
61440 |
15.24 mm |
NO |
40 MHz |
36.83 mm |
4096 |
CMOS |
7.5 mA |
2 V |
Microcontrollers |
FLASH |
1.778 mm |
FIXED POINT |
R-PDIP-T42 |
1 |
Not Qualified |
40 rpm |
YES |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
5.25 V |
32 |
32 |
5 |
GRID ARRAY |
PGA179,18X18 |
4.75 V |
0 Cel |
PERPENDICULAR |
3.05 mm |
47.245 mm |
YES |
32 |
50 MHz |
47.245 mm |
HCMOS |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P179 |
Not Qualified |
25 rpm |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
GULL WING |
184 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
5.25 V |
32 |
32 |
5 |
FLATPACK |
QFP184,1.4SQ |
4.75 V |
0 Cel |
QUAD |
YES |
32 |
66.66 MHz |
HCMOS |
5 V |
Microprocessors |
.635 mm |
FLOATING POINT |
S-PQFP-G184 |
Not Qualified |
33 rpm |
NO |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
32 |
32 |
1.5,1.8,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.35 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
17 mm |
YES |
32 |
60 MHz |
40 |
260 |
17 mm |
CMOS |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
180 rpm |
YES |
e1 |
|||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
145 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
32 |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
0 Cel |
PERPENDICULAR |
4.95 mm |
39.625 mm |
YES |
16 |
39.625 mm |
HCMOS |
5 V |
2.54 mm |
FIXED POINT |
S-PPGA-P145 |
25.16 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
32 |
GRID ARRAY |
1.08 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
32 |
80 MHz |
40 |
260 |
CMOS |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
5.25 V |
0 |
32 |
32 |
GRID ARRAY |
4.75 V |
7 |
TIN LEAD |
PERPENDICULAR |
3.05 mm |
0 |
47.245 mm |
YES |
32 |
66.66 MHz |
47.245 mm |
HCMOS |
5 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
33 rpm |
NO |
e0 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
24 |
32 |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
24.2062 mm |
NO |
16 |
16.67 MHz |
24.2062 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16.67 rpm |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
32 |
FLATPACK |
3 V |
70 Cel |
0 Cel |
QUAD |
YES |
16 |
.05 MHz |
HCMOS |
3.3 V |
FIXED POINT |
S-PQFP-G160 |
Not Qualified |
16.78 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
FLATPACK |
1.08 V |
85 Cel |
-40 Cel |
QUAD |
YES |
32 |
48 MHz |
CMOS |
FIXED POINT |
S-PQFP-G208 |
240 rpm |
YES |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.