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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | XPC823ZC75A |
| Description | MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
| In Stock | 1,325 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 75 rpm |
| Peripheral IC Type: | MICROPROCESSOR |
| Integrated Cache: | YES |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| Surface Mount: | YES |
| Bit Size: | 32 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 256 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Temperature Grade: | COMMERCIAL |









