NXP Semiconductors - XPC823ZC75A

XPC823ZC75A by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC823ZC75A
Description MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
In Stock1,325
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 75 rpm
Peripheral IC Type: MICROPROCESSOR
Integrated Cache: YES
Low Power Mode: YES
Boundary Scan: YES
Surface Mount: YES
Bit Size: 32
Minimum Operating Temperature: 0 Cel
No. of Terminals: 256
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Temperature Grade: COMMERCIAL
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Pricing (USD)

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