MICROPROCESSOR Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC68EC000FU12F	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	32		FLATPACK		4.75 V	70 Cel		0 Cel		QUAD	2.45 mm		14 mm		NO	16	16.67 MHz			14 mm	CMOS		5 V				.8 mm	FIXED POINT	S-PQFP-G64		Not Qualified	16.67 rpm	NO
MC68330FC16	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES			32	32	5	FLATPACK, BUMPER	SPQFP132,1.1SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	4.57 mm		24.13 mm		YES	16	16.78 MHz			24.13 mm	HCMOS	120 mA	5 V			Microprocessors	.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	16.78 rpm	YES	e0
MCF54454VP266	NXP Semiconductors	MICROPROCESSOR																													40	260											3
MC68341FT16	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		32			FLATPACK		4.75 V	70 Cel		0 Cel		QUAD					YES	16	.05 MHz				HCMOS		5 V					FIXED POINT	S-PQFP-G160		Not Qualified	16.78 rpm	YES
MC68EC040RC20B	NXP Semiconductors	MICROPROCESSOR		PIN/PEG	179	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V		32	32	5	GRID ARRAY	PGA179,18X18	4.75 V			0 Cel		PERPENDICULAR	3.05 mm		47.245 mm		YES	32				47.245 mm	HCMOS		5 V			Microprocessors	2.54 mm	FLOATING POINT	S-CPGA-P179		Not Qualified	20 rpm	NO
MC68040RC25	NXP Semiconductors	MICROPROCESSOR		PIN/PEG	179	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V	0	32	32		GRID ARRAY		4.75 V		7		TIN LEAD	PERPENDICULAR	3.05 mm	0	47.245 mm	20 MIPS; 3.5 MFLOPS	YES	32	50 MHz			47.245 mm	HCMOS		5 V	0	0		2.54 mm	FLOATING POINT	S-CPGA-P179		Not Qualified	25 rpm	NO	e0
MC68EC000FN12F	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	32		CHIP CARRIER		4.75 V	70 Cel		0 Cel		QUAD	4.57 mm		24.2062 mm		NO	16	16.67 MHz			24.2062 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	16.67 rpm	NO
MC68330FE8V	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V		32	32		FLATPACK, BUMPER		3 V	70 Cel		0 Cel		QUAD	4.57 mm		24.13 mm		YES	16	8.39 MHz			24.13 mm	HCMOS		3.3 V				.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	8.39 rpm	YES
MC68330FE6V	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8313CVRAFFA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e1
MC8640THX1000HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e0
MPC8379CVRAJFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	533 rpm	YES
MPC8378CVRAND	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8379VRAJGA	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8535BVTANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.76 mm		29 mm		YES	32	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	800 rpm	YES	e2
MPC8377VRAJDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MC8640HX1000HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32	32		GRID ARRAY		1 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e0
MC8610VT1066JZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.7 mm		29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1066 rpm	YES
MC8641DHX1333GB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.97 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MPC8535BVJANG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.76 mm		29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783			800 rpm	YES
MPC8349CVVAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e1
MC8641VU1250NB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1250 rpm	YES
MPC8315CVRAGDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V				TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8347ECVVAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8347CVRAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MC8641HX1250GC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.97 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1250 rpm	YES
MPC8343EACZQAGDB	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8377EVRALF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V					GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm		31 mm		YES					31 mm	CMOS		1 V	4			1 mm		S-PBGA-B689
MPC8347VRALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8533EVJANFA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8533ECVTALJ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES	e2
MPC8349EZUAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MPC8377CVRALGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MPC8378EVRANDA	NXP Semiconductors	MICROPROCESSOR		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz			31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	266 rpm	YES	e2
P1013SXN2HFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz			31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2
MPC8378VRAJG	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8533ECVTANJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8343ECVRAGDX	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V					BOTTOM	2.46 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8349VVALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	667 rpm	YES	e2
MPC8379CVRANDA	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8535AVJATHA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783	3		1250 rpm	YES	e2
MC8641DHX1333NB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.97 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1333 rpm	YES
MPC8314EVRAFDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8379VRAJG	NXP Semiconductors	MICROPROCESSOR																																CMOS
MPC8377VRANF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		0 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MC8641DHX1500HB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V		16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.97 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1500 rpm	YES
MPC8377VRAGG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
P1013SXN2HFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz			31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.