COMMERCIAL Microprocessors 1,174

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MCF5251VM140	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.08 V	70 Cel		0 Cel		BOTTOM	1.6 mm		13 mm		YES	32	140 MHz	40	260	13 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	140 rpm	NO
HD6417705F100BV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES				32	1.5,3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel		-20 Cel		QUAD											CMOS	200 mA				Microprocessors	.5 mm		S-PQFP-G208		Not Qualified	100 rpm
ADSP-21489KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
MCF5272VM66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		23	32		GRID ARRAY		3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
ADSP-21489KSWZ-4A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100		Not Qualified	400 rpm	NO	e3
MCF5474VR266	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8	32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
MCF5272VM66R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		23	32	3.3	GRID ARRAY	BGA196,14X14,40	3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
Z8018010PSG	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V		20	8		IN-LINE, SHRINK PITCH	SDIP64,.75	4.5 V	70 Cel	3	0 Cel	MATTE TIN	DUAL	5.01 mm		19.05 mm	DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY	NO	8				57.785 mm	CMOS	60 mA	5 V	2	2		1.778 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	YES	e3
MPC8270VRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
Z0840006PSC	IXYS Corporation	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO				8	5	IN-LINE	DIP40,.6		70 Cel		0 Cel		DUAL											MOS	200 mA	5 V			Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	6 rpm
MCF5206EAB54	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		28	32		FLATPACK		3 V	70 Cel		0 Cel	TIN	QUAD	3.85 mm		28 mm		YES	32	54 MHz	30	245	28 mm	CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160	3		54 rpm	YES	e3
ADSP-21489KSWZ-3A	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
ADSP-21489KSWZ-5B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		450 rpm	NO	e3
MCF5307AI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		FLATPACK, FINE PITCH		3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	33.33 MHz	30	250	28 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
ADSP-21488KSWZ-4B1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		400 rpm	NO	e3
ADSP-21488KSWZ-4B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	400 rpm	NO	e3
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
CP80C88-2Z	Renesas Electronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.5 V		20	16		IN-LINE		4.5 V	70 Cel		0 Cel	MATTE TIN	DUAL	6.35 mm		15.24 mm		NO	8				51.75 mm	CMOS		5 V				2.54 mm	FIXED POINT	R-PDIP-T40			8 rpm	YES	e3
MCF5270VM100	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MC68HC000EI8	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MCF5206AB33A	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	5.25 V		28	32		FLATPACK		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	3.85 mm		28 mm		YES	32	33.33 MHz	30	245	28 mm	CMOS		5 V				.65 mm	FIXED POINT	S-PQFP-G160	3	Not Qualified	33.33 rpm	YES	e3
MPC8270VVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e1
MC9328MXSVP10	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
Z8038018FSC	IXYS Corporation	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.25 V	0	32	32	5	FLATPACK	QFP100,.7X.9	4.75 V	70 Cel	5	0 Cel	TIN LEAD	QUAD	3.1 mm	0	14 mm	DYNAMIC BUS SIZING; DRAM REFRESH CONTROLLER	NO	16	18 MHz		240	20 mm	CMOS		5 V	0	0	Microprocessors	.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	18 rpm	YES	e0
MC9328MXSVP10R2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V		25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
ADSP-21489KSWZ-3B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.05 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	163840	24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G176	3	Not Qualified	350 rpm	NO	e3
MC68EC000EI10	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	30 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	2	Not Qualified	10 rpm		e3
MPC8280CZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e0
MCF5270VM100J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm		YES	32		40	260	15 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES
MCF5307AI90B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		FLATPACK, FINE PITCH		3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	45.45 MHz	30	250	28 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	90 rpm	YES	e3
MCF5307CAI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	70 Cel		0 Cel	TIN	QUAD	4.1 mm		28 mm		YES	32	33.33 MHz	30	250	28 mm	CMOS		3.3 V			Microprocessors	.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
MCF5307CAI90B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES				32	3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel		0 Cel	TIN	QUAD								30	250		CMOS		3.3 V			Microprocessors	.5 mm		S-PQFP-G208	3	Not Qualified	90 rpm		e3
Z8038025FSC	Zilog	MICROPROCESSOR	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	0	32	32		FLATPACK		4.5 V	70 Cel	5	0 Cel		QUAD	3.1 mm	0	14 mm	16-BIT OR 32-BIT LINEAR ADDRESS SPACE; DYNAMIC REFRESH CONTROL	NO	16	25 MHz		240	20 mm	CMOS		5 V	0	0		.65 mm	FIXED POINT	R-PQFP-G100		Not Qualified	25 rpm	YES
MC68HC000EI16	Freescale Semiconductor	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16		CHIP CARRIER		4.75 V	70 Cel		0 Cel	MATTE TIN	QUAD	4.57 mm		24.2 mm		NO	16	20 MHz	30	245	24.2 mm	HCMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68	3		20 rpm	YES	e3
MC68HC000EI8R2	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	MATTE TIN	QUAD								30	245		CMOS	25 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J68	3	Not Qualified	8 rpm		e3
MPC8270VVQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO	e1
MPC8270ZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
N80C188-12	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	4.572 mm		24.2062 mm	DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO	8	25 MHz			24.2062 mm	CMOS		5 V				1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12.5 rpm	YES	e0
UPD70108C8	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO				16	5	IN-LINE	DIP40,.6		70 Cel		-10 Cel	Tin/Lead (Sn/Pb)	DUAL											CMOS	80 mA	5 V			Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	8 rpm		e0
D8088-2	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	5.25 V		20	8		IN-LINE		4.75 V	70 Cel		0 Cel	TIN LEAD	DUAL	6.096 mm		15.24 mm		NO	8	8 MHz			52.2605 mm	NMOS		5 V				2.54 mm	FIXED POINT	R-GDIP-T40		Not Qualified	8 rpm	NO	e0
MCF5274VM166	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF54450VM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm		YES	16		40	260	17 mm	CMOS					Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
MCF5475ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	NICKEL GOLD	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e4
MPC5200VR400B	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32	32		GRID ARRAY		1.42 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC5200VR400BR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY		1.42 V	70 Cel		0 Cel		BOTTOM	2.65 mm		27 mm		YES	32	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272			400 rpm	YES
SB80C188-12	Rochester Electronics	MICROPROCESSOR	COMMERCIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V		20	16		FLATPACK, THIN PROFILE, FINE PITCH		4.5 V	70 Cel		0 Cel	TIN LEAD	QUAD	1.2 mm		12 mm	DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER	NO	8	25 MHz			12 mm	CMOS		5 V				.5 mm	FIXED POINT	S-PQFP-G80		Not Qualified	12.5 rpm	YES	e0
TMP68HC000P-10	Toshiba	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	23	16		IN-LINE		4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.66 mm	0	22.86 mm		NO	16	10 MHz			81.5 mm	CMOS	30 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	10 rpm	YES	e0
FWIXP420BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V		32	32	1.3,3.3	GRID ARRAY	BGA492,26X26,50	1.235 V	70 Cel		0 Cel		BOTTOM	2.59 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.33 MHz			35 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B492	1	Not Qualified	400 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.