Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Motorola |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
5.25 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
3 |
0 Cel |
TIN LEAD |
DUAL |
5.84 mm |
0 |
15.24 mm |
NO |
8 |
4 MHz |
52.275 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-GDIP-T40 |
Not Qualified |
1 rpm |
NO |
e0 |
||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
10 MHz |
24.2062 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
10 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
16.67 MHz |
24.2062 mm |
CMOS |
50 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16.67 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
CHIP CARRIER |
4.75 V |
70 Cel |
7 |
0 Cel |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
16.67 MHz |
24.2062 mm |
CMOS |
50 mA |
5 V |
0 |
0 |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16.67 rpm |
NO |
||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.57 mm |
0 |
24.2062 mm |
NO |
16 |
8 MHz |
24.2062 mm |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
|||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
5.16 mm |
0 |
26.92 mm |
NO |
16 |
12 MHz |
26.92 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
12 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
480 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.2 V |
32 |
32 |
1.7/2.1,3.3 |
GRID ARRAY, LOW PROFILE |
BGA480,29X29,50 |
1.9 V |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1.65 mm |
37.5 mm |
REQUIRES 3.3V SUPPLY FOR I/O |
YES |
64 |
37.5 mm |
CMOS |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B480 |
Not Qualified |
266 rpm |
e0 |
|||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.83 mm |
24.2316 mm |
NO |
16 |
16 MHz |
24.2316 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
70 Cel |
6 |
0 Cel |
TIN LEAD |
QUAD |
4.83 mm |
0 |
29.3 mm |
NO |
16 |
50 MHz |
29.3 mm |
CMOS |
115 mA |
5 V |
0 |
2 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
Not Qualified |
25 rpm |
YES |
e0 |
|||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
5 |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
4.83 mm |
0 |
24.2316 mm |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS |
NO |
8 |
25 MHz |
24.2316 mm |
CMOS |
62.5 mA |
5 V |
2 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
12 rpm |
YES |
e0 |
||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
COMMERCIAL |
BALL |
1088 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
25 |
32 |
1.2,1.8,2.5,3.3,5 |
GRID ARRAY |
BGA1088,33X33,43 |
1.14 V |
70 Cel |
0 Cel |
BOTTOM |
5.635 mm |
37.5 mm |
YES |
16 |
1200 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
37.5 mm |
CMOS |
12000 mA |
1.2 V |
Microprocessors |
1.09 mm |
FLOATING POINT |
S-PBGA-B1088 |
Not Qualified |
1200 rpm |
YES |
|||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
16 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
492 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3,3.3 |
GRID ARRAY |
BGA492,26X26,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-PBGA-B492 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
492 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.365 V |
32 |
32 |
GRID ARRAY |
1.235 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.59 mm |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.33 MHz |
35 mm |
CMOS |
1.3 V |
1.27 mm |
FIXED POINT |
S-PBGA-B492 |
Not Qualified |
533 rpm |
NO |
e1 |
||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
492 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.365 V |
32 |
32 |
GRID ARRAY |
1.235 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.59 mm |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.33 MHz |
35 mm |
CMOS |
1.3 V |
1.27 mm |
FIXED POINT |
S-PBGA-B492 |
Not Qualified |
533 rpm |
NO |
e1 |
||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
5.5 V |
20 |
8 |
5 |
CHIP CARRIER |
LCC68A,.95SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.68 mm |
24.13 mm |
NO |
8 |
10 MHz |
24.13 mm |
CMOS |
100 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CQCC-N68 |
Not Qualified |
10 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
20 |
16 |
3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
2.7 V |
70 Cel |
9 |
0 Cel |
TIN LEAD |
QUAD |
1.66 mm |
0 |
14 mm |
NO |
16 |
26 MHz |
14 mm |
CMOS |
36 mA |
3 V |
4 |
2 |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
13 rpm |
YES |
e0 |
|||||||||||||||||||||||
Toshiba |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
23 |
16 |
IN-LINE |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
DUAL |
5.66 mm |
0 |
22.86 mm |
NO |
16 |
12.5 MHz |
81.5 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
12.5 rpm |
YES |
e0 |
||||||||||||||||||||||||||
|
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
20 |
64 |
1.5,3.3 |
GRID ARRAY |
BGA484,26X26,50 |
1.4 V |
70 Cel |
0 Cel |
BOTTOM |
2.46 mm |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133.3 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
35 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B484 |
Not Qualified |
300 rpm |
YES |
|||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
GRID ARRAY |
BGA256,16X16,50 |
70 Cel |
0 Cel |
BOTTOM |
3.3 V |
Microprocessors |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
5 MHz |
16.585 mm |
CMOS |
50.5 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
1 |
Not Qualified |
5 rpm |
YES |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
COMMERCIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA349,22X22,32 |
1.19 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
19 mm |
YES |
60 MHz |
30 |
260 |
19 mm |
CMOS |
1.25 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
3 |
Not Qualified |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
COMMERCIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA349,22X22,32 |
1.19 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
19 mm |
YES |
60 MHz |
19 mm |
CMOS |
1.25 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
3 |
Not Qualified |
500 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
0 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
70 Cel |
0 Cel |
QUAD |
.9 mm |
4 mm |
NO |
0 |
4 mm |
CMOS |
3.3 V |
.4 mm |
FIXED POINT |
S-PQCC-N32 |
NO |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
0 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
70 Cel |
0 Cel |
DUAL |
1.1 mm |
4.4 mm |
NO |
0 |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
FIXED POINT |
R-PDSO-G28 |
NO |
|||||||||||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
5.5 V |
20 |
16 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
5.72 mm |
15.24 mm |
NO |
8 |
5 MHz |
CMOS |
50.5 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-GDIP-T40 |
Not Qualified |
5 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
Intersil |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
20 |
16 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
6.35 mm |
15.24 mm |
NO |
8 |
8 MHz |
51.75 mm |
CMOS |
80.5 mA |
5 V |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
8 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
240 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.05 V |
8 |
26 |
32 |
1.9,3.3 |
FLATPACK, FINE PITCH |
QFP240,1.3SQ,20 |
1.7 V |
75 Cel |
6 |
-20 Cel |
QUAD |
3.95 mm |
16384 |
32 mm |
YES |
32 |
66.67 MHz |
32 mm |
CMOS |
650 mA |
1.9 V |
4 |
3 |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G240 |
Not Qualified |
160 rpm |
YES |
|||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
84 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA84,10X10 |
70 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
CMOS |
230 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P84 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
National Semiconductor |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
National Semiconductor |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
+-5,12 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
2 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
32 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
QUAD |
0 |
NO |
16 |
8 MHz |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
23 |
32 |
IN-LINE |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
DUAL |
5.84 mm |
0 |
22.86 mm |
NO |
16 |
10 MHz |
81.535 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
10 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
32 |
GRID ARRAY |
PGA68,10X10 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
5.16 mm |
0 |
26.92 mm |
NO |
16 |
10 MHz |
26.92 mm |
CMOS |
30 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
10 rpm |
NO |
e0 |
||||||||||||||||||||||||
Motorola |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
3 |
0 Cel |
TIN LEAD |
DUAL |
5.08 mm |
0 |
15.24 mm |
NO |
8 |
4 MHz |
52.07 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
1 rpm |
NO |
e0 |
||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
32 |
32 |
1.5,1.8,2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1.35 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
17 mm |
YES |
32 |
60 MHz |
40 |
260 |
17 mm |
CMOS |
1.5 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
|||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
32 |
32 |
GRID ARRAY |
1.43 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
66.66 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B388 |
3 |
Not Qualified |
266.66 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
32 |
32 |
GRID ARRAY |
1.43 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
66.66 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B388 |
3 |
Not Qualified |
266.66 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
480 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA480,29X29,50 |
1.45 V |
70 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
1.65 mm |
37.5 mm |
YES |
64 |
100 MHz |
40 |
260 |
37.5 mm |
CMOS |
1.5 V |
Other uPs/uCs/Peripheral ICs |
1.27 mm |
FLOATING POINT |
S-PBGA-B480 |
4 |
Not Qualified |
100 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.572 mm |
24.2062 mm |
DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER |
NO |
16 |
32 MHz |
24.2062 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
16 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Rochester Electronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.572 mm |
24.2062 mm |
DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER |
NO |
8 |
40 MHz |
24.2062 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
20 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Ami Semiconductor |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
DUAL |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
|
IXYS Corporation |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
20 |
8 |
FLATPACK |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
3.1 mm |
14 mm |
DYNAMIC REFRESH CONTROL; 1M BYTE PHYSICAL MEMORY |
NO |
8 |
20 mm |
CMOS |
60 mA |
5 V |
.8 mm |
FIXED POINT |
R-PQFP-G80 |
Not Qualified |
10 rpm |
YES |
e3 |
||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
+-5,12 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
DUAL |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
16 |
IN-LINE |
DIP64,.9 |
70 Cel |
0 Cel |
DUAL |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Microprocessors |
2.54 mm |
R-XDIP-T64 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
24 |
32 |
GRID ARRAY |
PGA68,11X11 |
4.75 V |
70 Cel |
2 |
0 Cel |
PERPENDICULAR |
0 |
NO |
32 |
10 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
NMOS |
300 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
10 rpm |
NO |
|||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1,1.2,1.8,1.8/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,26X26,20 |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.95 mm |
14 mm |
30 |
260 |
14 mm |
CMOS |
Graphics Processors |
.5 mm |
S-PBGA-B515 |
3 |
Not Qualified |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.