COMMERCIAL Microprocessors 1,174

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
ST6X86P133+HS	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	PIN/PEG	296	IPGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	3.7 V		32	64	3.3	GRID ARRAY, INTERSTITIAL PITCH	SPGA296,37X37	3.15 V	70 Cel		0 Cel	TIN LEAD	PERPENDICULAR	4.7 mm		49.595 mm		NO	64	55.55 MHz			49.595 mm	CMOS	5800 mA	3.3 V			Microprocessors	2.54 mm	FLOATING POINT	S-CPGA-P296		Not Qualified	110 rpm	YES	e0
Z8004AD1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V		16	16		IN-LINE		4.75 V	70 Cel		0 Cel		DUAL	3.6 mm		15.24 mm		NO	16	6.06 MHz				CMOS		5 V				2.54 mm	FIXED POINT	R-CDIP-T40		Not Qualified	6 rpm	NO
Z8400AF1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	WDIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	5.25 V	0	16	8	5	IN-LINE, WINDOW	DIP40,.6	4.75 V	70 Cel	2	0 Cel	TIN LEAD	DUAL	5.72 mm	0	15.24 mm	DRAM REFRESH CONTROLLER	NO	8	4 MHz			52.195 mm	NMOS	200 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-GDIP-T40		Not Qualified	4 rpm	NO	e0
Z8400AC1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.75 V	70 Cel	2	0 Cel	TIN LEAD	QUAD	4.57 mm	0	16.5862 mm	DRAM REFRESH CONTROLLER	NO	8	4 MHz			16.5862 mm	NMOS	200 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	4 rpm	NO	e0
STPCC0175BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.3 MHz			35 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	75 rpm	YES	e0
EF6808FNL	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY		YES				8	5	CHIP CARRIER	LDCC44,.7SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD											MOS		5 V			Microprocessors	1.27 mm		S-PQCC-J44		Not Qualified	1 rpm		e0
STPCD0112BTC3	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	64	120 MHz			35 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B388		Not Qualified	120 rpm	YES	e0
TS68000CP16	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	24	16	5	IN-LINE	DIP64,.9	4.75 V	70 Cel	7	0 Cel	TIN LEAD	DUAL	5.59 mm	0	22.86 mm		NO	16	16.7 MHz			81.535 mm	NMOS		5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T64		Not Qualified	16.7 rpm	NO	e0
Z8004AB1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V		16	16		IN-LINE		4.75 V	70 Cel		0 Cel		DUAL	4.445 mm		15.24 mm		NO	16	6.06 MHz				CMOS		5 V				2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6 rpm	NO
Z8002BD1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0	16	16		IN-LINE		4.75 V	70 Cel	3	0 Cel		DUAL	3.6 mm	0	15.24 mm		NO	16	10 MHz				MOS	300 mA	5 V	0	0		2.54 mm	FIXED POINT	R-CDIP-T40		Not Qualified	10 rpm	YES
Z8004B1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V		16	16		IN-LINE		4.75 V	70 Cel		0 Cel		DUAL	4.445 mm		15.24 mm		NO	16	4 MHz				CMOS		5 V				2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	4 rpm	NO
IMST805-G30S	STMicroelectronics	MICROPROCESSOR, RISC	COMMERCIAL	PIN/PEG	84	PGA	SQUARE	CERAMIC		NO				32	5	GRID ARRAY	PGA84,10X10		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR											CMOS	230 mA	5 V			Microprocessors	2.54 mm		S-XPGA-P84		Not Qualified	30 rpm		e0
IMST400-T20S	STMicroelectronics	MICROPROCESSOR, TRANSPUTER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	30	32	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	70 Cel	1	0 Cel	TIN LEAD	QUAD	1.6 mm	1024	14 mm		NO	32				14 mm	CMOS		5 V	1	2	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified	20 rpm	NO	e0
Z8001AD1	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0	23	16		IN-LINE		4.75 V	70 Cel	3	0 Cel		DUAL	3.73 mm	0	15.24 mm		NO	16	6 MHz				MOS	300 mA	5 V	0	0		2.54 mm	FIXED POINT	R-CDIP-T48		Not Qualified	6 rpm	YES
TS68008CP10	STMicroelectronics	MICROPROCESSOR	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	20	16	5	IN-LINE	DIP48,.6	4.75 V	70 Cel	3	0 Cel	TIN LEAD	DUAL	5.08 mm	0	15.24 mm		NO	8	10 MHz				NMOS		5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-PDIP-T48		Not Qualified	10 rpm	NO	e0
XPC823ZC66A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS							FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC823ZT66A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS							FIXED POINT	S-PBGA-B256			66 rpm	YES
XPC850ZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
XPC850SEZT40	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	40 rpm
XPC823ZT81A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS		2.5 V					FIXED POINT	S-PBGA-B256			81 rpm	YES
SCF5249LPV120	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			24	32	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		70 Cel		-20 Cel	MATTE TIN	QUAD	1.6 mm		20 mm		YES	16	33.86 MHz	30	220	20 mm	CMOS		1.8 V			Microprocessors	.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	120 rpm	YES	e3
XPC823ZT75A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS		2.5 V					FIXED POINT	S-PBGA-B256			75 rpm	YES
XPC750PRX366RE	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V		32	32		GRID ARRAY		2 V	65 Cel		0 Cel	TIN LEAD	BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	100 MHz			25 mm	CMOS		2.05 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	366 rpm	YES	e0
XPC801ZP40	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	NO	YES			26	32		GRID ARRAY			70 Cel		0 Cel		BOTTOM	3.16 mm		21 mm		YES	32	40 MHz			21 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	40 rpm	YES
XPC8255ZUIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
SCF5249VF140	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			24	32	3.3	GRID ARRAY	BGA160,14X14,40		70 Cel		-20 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.75 mm		15 mm		YES	16	33.86 MHz	40	260	15 mm	CMOS		1.8 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	140 rpm	YES	e0
SCF5249LAG120	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			24	32		FLATPACK, LOW PROFILE, FINE PITCH			70 Cel		-20 Cel	TIN	QUAD	1.6 mm		20 mm		YES	16	33.86 MHz	40	260	20 mm	CMOS		1.8 V				.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified	120 rpm	YES	e3
XPC8255VVIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
MPE603PRX166LX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V		32	32		GRID ARRAY		2.375 V	70 Cel		0 Cel		BOTTOM	3 mm		21 mm		YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	167 rpm	YES
XPC823ZT50Z3	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS							FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC8260VVIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
XPC850SEZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
SCF5249VM140	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			24	32		GRID ARRAY			70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	16	33.86 MHz	40	260	15 mm	CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	140 rpm	YES	e1
PR31700	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		13	32	3.3	FLATPACK	QFP208,1.2SQ,20	3 V	70 Cel		0 Cel	TIN	QUAD					NO	32	10 MHz				CMOS	130 mA	3.3 V			Microprocessors	.5 mm	FIXED POINT	S-PQFP-G208		Not Qualified	75 rpm	YES	e3
PR31500ABC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES				32	3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel		0 Cel		QUAD											CMOS		3.3 V			Microprocessors	.5 mm		S-PQFP-G208		Not Qualified	40 rpm
XPC8260VVHFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e1
XPC823ZC81A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS							FIXED POINT	S-PBGA-B256			81 rpm	YES
XPC850ZT40	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	40 rpm
XPC823ZT25Z3	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS							FIXED POINT	S-PBGA-B256			25 rpm	YES
SCN68010CAN64	NXP Semiconductors		COMMERCIAL	THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V		23	16		IN-LINE		4.75 V	70 Cel		0 Cel	TIN LEAD	DUAL					NO	16					CMOS		5 V					FIXED POINT	R-PDIP-T64			10 rpm	YES	e0
XPC8260ZUIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
SCC68070CDA84-T	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel		0 Cel		QUAD											CMOS	130 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J84		Not Qualified	17.5 rpm
XPC8260ZUIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel		BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO
SCC68070CCA84-T	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel		0 Cel		QUAD											CMOS	112 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J84		Not Qualified	15 rpm
XPC8260ZUHFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e0
MPC180LMA	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	1.95 V		12			FLATPACK, LOW PROFILE, FINE PITCH		1.65 V	70 Cel		0 Cel		QUAD	1.7 mm		14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz			14 mm	CMOS		1.8 V				.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES
XPC823ZC75A	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			70 Cel		0 Cel		BOTTOM					YES						CMOS							FIXED POINT	S-PBGA-B256			75 rpm	YES
SCC68070CDA84	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel		0 Cel		QUAD											CMOS	130 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J84		Not Qualified	17.5 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.