COMMERCIAL Microprocessors 1,174

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8270ZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541EPXAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8250AZUMHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	TIN LEAD	BOTTOM	1.65 mm	37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64		30	220	37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO	e0
MPC8275CVRUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	450 rpm	NO
MC9328MX21VK	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.49 mm	14 mm	ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	YES	32	32 MHz	40	260	14 mm	CMOS	1.5 V		.65 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8541PXAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8541ECPXAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8360ZUAHFG	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32		GRID ARRAY, LOW PROFILE		1.15 V	70 Cel		BOTTOM	1.69 mm	37.5 mm		YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	500 rpm	YES
MPC8270CVRQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	NO
MPC8250ACVRPIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8541EVTAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8270CVRKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MPC8541EPXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8271CZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8541EPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541VTALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8271CVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541EVTALDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8541PXAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8541ECPXAQDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8275ZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541ECPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541ECVTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8250AZUIHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.7 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	200 rpm	NO
MPC8541EVTAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8272CVRTMFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8360VVALFH	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32		GRID ARRAY, LOW PROFILE		1.25 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.69 mm	37.5 mm		YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	667 rpm	YES	e1
MPC8270CZUMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8541ECVTAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541VTAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8270ZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm	37.5 mm		YES	64	83.33 MHz	40	260	37.5 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO	e0
MPC8541CVTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MC9328MX21SVK	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.49 mm	14 mm		YES	32	32 MHz	40	260	14 mm	CMOS	1.5 V		.65 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8250AVRLHDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	250 rpm	NO
MPC8250ACVRIFBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	1.8 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	200 rpm	NO
MPC8270VRSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8541VTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8264AZUMHB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		70 Cel		BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	266 rpm
MPC8541ECPXAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8270CVRUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	450 rpm	NO
MPC8270CVVKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	233 rpm	NO
MPC8541PXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8270ZUMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8264AZUMIB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		70 Cel		BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	300 rpm
MC9328MX1VM20	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V	25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS	1.9 V		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES	e1
MPC8541PXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8260AVVPIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	300 rpm	NO
MPC8271CZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	266 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.