COMMERCIAL Microprocessors 1,174

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8270CZQPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8265ACVVMIBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz	40	260	37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO	e1
MPC8270ZUSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	375 rpm	NO
MPC8264AZUPIB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		70 Cel	0 Cel		BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	266 rpm
MPC8275CVRPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8264AZUPJD	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		70 Cel	0 Cel		BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	300 rpm
MPC8248CVRTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8275CZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8272CZQTMFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8271CZQTMFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8275ZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8541EPXAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8280CZUTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	400 rpm	NO
MPC8250AZUIFBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.7 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	200 rpm	NO
MPC8275VRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	64	266 MHz	30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8270CVVTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	400 rpm	NO
MPC8541CVTALDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541ECPXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8250AVRIFBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	1.8 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	200 rpm	NO
MPC8270CZQQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	NO
MPC8541EVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel	0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8250AVRNJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	291 rpm	NO
MPC8250ACVRLHDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	250 rpm	NO
MPC8541VTAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8270CZUPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	300 rpm	NO
MPC8541CVTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541VTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8250ACZUNJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.9 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	291 rpm	NO
MPC8541CVTAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8270ZUKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	233 rpm	NO
MC9328MXLVM15	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS	1.8 V		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES	e1
MPC8260AZUIHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	200 rpm	NO
MPC8541ECPXAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541CPXAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8270ZQKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MPC8541EPXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel	0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8260AZUMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO
MPC8250AZUNJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.9 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	291 rpm	NO
MPC5123VY300B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	0	32	1.4,3.3	GRID ARRAY	BGA516,26X26,40	1.33 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm		YES	0		NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1.4 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	YES
MPC8250AZUMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.65 mm	37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64				37.5 mm	CMOS			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm		e0
MPC8541VTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel	0 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8250ACVVPIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.9 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	300 rpm	NO
MPC8541EVTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel	0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8264AZUPIBB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.65 mm	37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	300 rpm	NO	e0
MPC8270ZUUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel	0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	450 rpm	NO
MPC8265AZUPJDC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.65 mm	37.5 mm		YES	64	83.33 MHz	30	220	37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	300 rpm	NO	e0
MPC8275ZQKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MCIMX31LDVKN5DR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	457	FBGA	SQUARE	PLASTIC/EPOXY		YES				1.2/1.5,1.8/3.3	GRID ARRAY, FINE PITCH	BGA457,26X26,20		70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM							40	260				Microprocessors	.5 mm		S-PBGA-B457	3	Not Qualified			e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.