COMMERCIAL Microprocessors 1,174

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8360EVVAHFG	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32		GRID ARRAY, LOW PROFILE		1.15 V	70 Cel		BOTTOM	1.69 mm	37.5 mm		YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	500 rpm	YES
MPC8541PXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8275ZQSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8541CVTALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8250AVRPIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8541CVTAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8275ZQTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8541PXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541ECPXAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8247CZQPIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8248CZQTMFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8280CZUMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8541CVTAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8270CVVSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	375 rpm	NO
MPC8280CZUMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8541EPXAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541EPXALDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8270CZUKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	233 rpm	NO
MPC8275CVRSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8270CVRSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MC9328MX21SVM	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	70 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	17 mm		YES	32	32 MHz	40	260	17 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8541PXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8250ACZQIFBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS	1.8 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	200 rpm	NO
MPC8541ECVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8270ZUTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	400 rpm	NO
MPC8270CVRTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8270CVVQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	333 rpm	NO
MPC8541CVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8541CPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8250ACZQLHDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	250 rpm	NO
MPC8541ECPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8541ECPXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8270ZQUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	450 rpm	NO
MPC8271CVRTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8265AZUPJD	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		70 Cel		BOTTOM										CMOS		Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	300 rpm
MPC8541ECPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8541VTAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8250ACZQNJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			27 mm	CMOS	2 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	291 rpm	NO
MPC8250AZUMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.9 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS	2 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8248CVRTMFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133 MHz			27 mm	CMOS	1.5 V		1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8275CVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541VTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8270CVRMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541EVTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541ECVTAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel		BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.3 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8270CZQUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel		BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS	1.5 V		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	450 rpm	NO
MPC8541EVTALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V		1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8280CZUPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	300 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.