COMMERCIAL Microprocessors 1,174

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MC68SEC000AA16	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES			32	5	FLATPACK	QFP64,.66SQ,32		70 Cel		TIN	QUAD							40	260		CMOS	50 mA	5 V		Microprocessors	.8 mm		S-PQFP-G64	3	Not Qualified	16.67 rpm		e3
MC68SEC000AA20B1	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES			32	5	FLATPACK	QFP64,.66SQ,32		70 Cel		TIN	QUAD							40	260		CMOS	70 mA	5 V		Microprocessors	.8 mm		S-PQFP-G64	3	Not Qualified	20 rpm		e3
MC68EC000FN12F	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	24	32		CHIP CARRIER		4.75 V	70 Cel			QUAD	4.57 mm	24.2062 mm		NO	16	16.67 MHz			24.2062 mm	CMOS		5 V			1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	16.67 rpm	NO
MC68330FE8V	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	32	32		FLATPACK, BUMPER		3 V	70 Cel			QUAD	4.57 mm	24.13 mm		YES	16	8.39 MHz			24.13 mm	HCMOS		3.3 V			.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	8.39 rpm	YES
MCF5472VR200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32	32		GRID ARRAY		1.43 V	70 Cel		TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MCF5272VF66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	23	32		GRID ARRAY		3 V	70 Cel			BOTTOM	1.75 mm	15 mm		YES	32	66 MHz	30	220	15 mm	CMOS		3.3 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES
MPC8255AZUMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel		TIN LEAD	BOTTOM	1.65 mm	37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO	e0
MPC8541PXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel			BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8541VTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V	36	32		GRID ARRAY		1.25 V	70 Cel			BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.3 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1700 rpm	YES
MPC8250ACVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS		2 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8250AZQIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	70 Cel		TIN LEAD	BOTTOM	2.55 mm	27 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64		30	245	27 mm	CMOS		1.8 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	200 rpm	NO	e0
MPC860TZP66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		32	32		GRID ARRAY	BGA357,19X19,50		70 Cel	7		BOTTOM	2.52 mm	25 mm		YES	32				25 mm	CMOS		3.3 V	16		1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
MPC8541EVTAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel			BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.15 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8275VRSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8250AVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS		2 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541VTAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel			BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V			1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8541CPXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel			BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.15 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
MPC8250ACZQMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY		1.9 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS		2 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC860TZP50	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	357	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES		32	32		GRID ARRAY			70 Cel			BOTTOM				YES	32		NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V				FIXED POINT	R-PBGA-B357			50 rpm	YES
MPC8541EPXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8250ACZQIHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS		1.8 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	200 rpm	NO
MPC8275CZQTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8270CVVUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			37.5 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	450 rpm	NO
MPC8270ZQMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8541PXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel			BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V			1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8260AVVNJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			37.5 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	291 rpm	NO
MPC8541CVTAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel			BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V			1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8271CZQPIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8275VRTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8270CZQTPEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8250ACZUIHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.7 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS		1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	200 rpm	NO
MPC8270ZUMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8541ECVTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	70 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8250AZULHDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.9 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			37.5 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	250 rpm	NO
MPC8248CZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8541CPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel			BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V			1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1420 rpm	YES
MPC8275VRQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	NO
MPC8360EZUAHFG	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32		GRID ARRAY, LOW PROFILE		1.15 V	70 Cel			BOTTOM	1.69 mm	37.5 mm		YES	32	66.67 MHz			37.5 mm	CMOS		1.3 V			1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	500 rpm	YES
MPC8266AZUPJD	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		70 Cel			BOTTOM										CMOS				Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	300 rpm
MPC8271CVRPIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8247CZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			27 mm	CMOS		1.5 V			1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8260AVVMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			37.5 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC8250ACVVLHDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	HLBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32		GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.9 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			37.5 mm	CMOS		2 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	250 rpm	NO
MPC8541CPXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	70 Cel			BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.25 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
MPC8541CPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	70 Cel			BOTTOM	2.4 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
MPC8280CVVSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	70 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			37.5 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	375 rpm	NO
MPC8541VTAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	UNSPECIFIED	360	CGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	70 Cel			BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.15 V			1.27 mm	FLOATING POINT	S-CBGA-X360		Not Qualified	1000 rpm	YES
MPC8250ACVRIHBX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V	70 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.66 MHz			27 mm	CMOS		1.8 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	200 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.