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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC860TZP66 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | MPC860TZP66 Datasheet |
| In Stock | 496 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Integrated Cache: | YES |
| Maximum Seated Height: | 2.52 mm |
| Surface Mount: | YES |
| No. of Terminals: | 357 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| No. of DMA Channels: | 16 |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B357 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 25 mm |
| Speed: | 66 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| No. of External Interrupts: | 7 |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | 0 Cel |
| Package Equivalence Code: | BGA357,19X19,50 |
| Length: | 25 mm |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |









