BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
PPC7448HX867ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	867 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	867 rpm	YES
P5020NSE7MMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY		.95 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295			1200 rpm	YES
P5010NSN1QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1600 rpm	YES
P5021PXN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P2020PXE2NFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P5021NSN12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		0	64		GRID ARRAY	BGA1295,36X36,40	1.17 V	105 Cel	12	0 Cel		BOTTOM	3.53 mm		37.5 mm		YES	0				37.5 mm	CMOS		1.2 V	8	2		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES
P5021PSE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
935339751557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
T4241NSN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
P2020PXE2HFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
PPC7447RX1000NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES				32	1.1,1.8/2.5	GRID ARRAY	BGA360,19X19,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	1000 rpm
BSC9131NSN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5040PXE1TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
BSC9131NXE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9132NJE7MNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1200 rpm	YES
PPC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32		GRID ARRAY		1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.25 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
PPC8567EVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm		YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
P5020NSE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
PPC7448HX1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	1250 rpm	YES
BSC9132NXN7MNMB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm		23 mm		YES	32		30	245	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
P2020PSE2MFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO
T4161NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS						1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
P2020NSN2NFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
XPC850ZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
P2010NSN2HHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		800 rpm	YES	e2
XPC7455RX867LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.65 V		36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.55 V				TIN LEAD	BOTTOM	3.22 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.6 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	867 rpm	YES	e0
PCIMX536AVV8C	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		26	32		GRID ARRAY, FINE PITCH		1.05 V	125 Cel		-40 Cel		BOTTOM	1.85 mm		19 mm		YES	32	27 MHz			19 mm	CMOS		1.1 V				.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES
P5010NXE1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
PPC7448HX600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
P5020NSN1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
PPC7448VU1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32		GRID ARRAY		1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.25 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
XPC7445RX867LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		25 mm		YES	64	133 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	867 rpm	YES
P2020PSN2NFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P5020NSN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
XPC755BRX350LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V					GRID ARRAY		1.9 V					BOTTOM					YES						CMOS		2 V					FIXED POINT	R-CBGA-B360			350 rpm	NO
935339744551	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
P5021NXE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64		30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5021PXE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021PSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
PPC7448HX800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	800 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	800 rpm	YES
SCIMX6D5EYM12CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V					BOTTOM	1.6 mm		21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
P4040NSN7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1
PPC8568CVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm		YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
P5021NSE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SCIMX6Q5EYM12CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V					BOTTOM	1.6 mm		21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
P2020PSE2KHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
P5010NXN1TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
BSC9131NLE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.