BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC755BPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32		GRID ARRAY		1.8 V				TIN LEAD	BOTTOM	2.77 mm		25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	350 rpm	YES	e0
MCF52277CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel		BOTTOM	1.75 mm		15 mm		YES	32	66.67 MHz	NOT SPECIFIED	NOT SPECIFIED	15 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196		Not Qualified	166.67 rpm	NO
MCF5274LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
MPC603PRX160LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V			32	32		GRID ARRAY		2.375 V					BOTTOM	3 mm		21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	160 rpm	YES
MPC745BVT300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32		GRID ARRAY		1.8 V				TIN SILVER	BOTTOM	2.8 mm		21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz	40	260	21 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	300 rpm	YES	e2
MPC755CPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32		GRID ARRAY, HEAT SINK/SLUG		1.8 V				TIN LEAD	BOTTOM	2.77 mm		25 mm		YES	64	100 MHz	30	245	25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3		350 rpm	YES	e0
MCF54454VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC755CVT400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32		GRID ARRAY		1.9 V					BOTTOM	2.77 mm		25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e2
LX2160XE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MCF5483CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
LX2160XE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MCF53014CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24	32		GRID ARRAY		1.08 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM					YES	32	80 MHz	40	260		CMOS							FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MPC604ERX300XX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V			32	32		GRID ARRAY		1.8 V					BOTTOM	3.3 mm		21 mm		YES	64				21 mm	CMOS		1.9 V				1.27 mm	FLOATING POINT	S-CBGA-B255			300 rpm	NO
C5ENPA1-DS/D	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	840	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.26 V			12	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel		-40 Cel		BOTTOM	3.55 mm		30.8 mm		YES	139	266 MHz			30.8 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-CBGA-B840			266 rpm	NO
MCF5271CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MPC603PRX225LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES					32	2.5,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	225 rpm
MPC603PRX200L	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES					32	2.5,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	200 rpm
MPC7410HX500LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES					32	1.8,1.8/3.3	GRID ARRAY	BGA360,19X19,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	500 rpm
MPC750ARX266LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V			32	32		GRID ARRAY		2.5 V					BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm	CMOS		2.6 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	266 rpm	YES
LX2160SE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
LX2160SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MCF5475VR200	NXP Semiconductors	MICROPROCESSOR		BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8		32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3			YES	e1
MPC603ERX133T	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES					32	3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM											CMOS		3.3 V			Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	133 rpm
MCF5471ZP200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
LX2120SE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC7410HX450LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V			32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm		25 mm		YES	64	133 MHz	40	260	25 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	450 rpm	YES	e0
MCF54450VM180	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	UNSPECIFIED	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel		0 Cel		BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-XBGA-B256		Not Qualified	180 rpm	YES
MPC750PRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V				32		GRID ARRAY		2 V					BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		2.05 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	400 rpm	YES
FS32V232CTN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm	4194304	17 mm		YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3		1000 rpm	YES
FS32V234CMN1AVUB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0	64		GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm	4194304	17 mm		YES	0	40 MHz			17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621			1000 rpm	YES
FS32V234CTN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm	4194304	17 mm		YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3		1000 rpm	YES
FS32V234CON2VUB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100		64		GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm	4194304	17 mm		YES		40 MHz	40	260	17 mm	CMOS		1 V	32	2		.65 mm	FLOATING POINT	S-PBGA-B621	3		1000 rpm	YES
MPC7450RX600LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC		YES					32	1.6	GRID ARRAY	BGA483,22X22,50						BOTTOM											CMOS		1.6 V			Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	600 rpm
MPC745BPX350	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32		GRID ARRAY		1.8 V					BOTTOM	2.8 mm		21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	350 rpm	YES
MCF54453VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MCF53014CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24			GRID ARRAY		1.08 V	85 Cel		-40 Cel		BOTTOM					YES	32	48 MHz				CMOS							FIXED POINT	S-PBGA-B256			240 rpm	YES
MCF5471VR200	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MPC604ERX300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES					32	1.9,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	300 rpm
MPC603PRX166LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES					32	2.5,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	166 rpm
MPC603ERX133TX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA255,16X16,50	3.135 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	3 mm		21 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	133.33 MHz			21 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	133 rpm	YES	e0
LX2120XN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MPC750PRX333LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V				32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		1.9 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	333 rpm	YES
MPC7410HX400LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES					32	1.8,1.8/3.3	GRID ARRAY	BGA360,19X19,50						BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	400 rpm
MPC7410THX450NE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.55 V			32	32		GRID ARRAY		1.45 V				TIN LEAD	BOTTOM	3.2 mm		25 mm		YES	64	133 MHz	40	260	25 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1		450 rpm	YES	e0
MCF5234CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
LX2080SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
LX2120SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MPC7410RX550PE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL		BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.05 V						GRID ARRAY		1.95 V					BOTTOM					YES		133 MHz				CMOS		2 V					FIXED POINT	R-CBGA-B			550 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.