BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P2020PXE2NHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P5040NSN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P2020PSN2MFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO
P2010NXE2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2
PPC8568ECVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm	YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
P5021NSE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5021NSE7TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	64		GRID ARRAY	BGA1295,36X36,40	1.05 V	105 Cel	12	0 Cel		BOTTOM	3.53 mm		37.5 mm	YES	0				37.5 mm	CMOS		1.1 V	8	2		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
XPC8260ZUHFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm		37.5 mm	YES	64	66.66 MHz			37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e0
P2020PSN2NHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
PPC8567CVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm	YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
T4241NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm	YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
P5020NSE7TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5010NXN1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
BSC9131CLN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm	YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
XPC823CZT25Z3	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			85 Cel		-40 Cel		BOTTOM				YES						CMOS							FIXED POINT	S-PBGA-B256			25 rpm	YES
P4081NSN7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P5040NXE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040NSN72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
P5040NXN12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
XPC7455RX733NC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		29 mm	YES	64	133 MHz			29 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	733 rpm	YES
T4240NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm	YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
SCIMX6D5EYM12CE	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V					BOTTOM	1.6 mm		21 mm	YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
P5020NSN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5021NSN1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021NXN1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
BSC9132NJE7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm	YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
P2020PXE2HFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
P5040NSE7VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
P5021PSN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
MPE603ERX100TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	3 mm		21 mm	YES	64	66.67 MHz			21 mm	CMOS		3.3 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	100 rpm	YES
XPC7445RX600LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		25 mm	YES	64	133 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
P5010NSE1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PSE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
935339743557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm	YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
P5040NXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SVF532R3K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm	YES	16		40	260	17 mm	CMOS		3.3 V				.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
BSC9132NXE7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm		23 mm	YES	32		30	245	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1000 rpm	YES	e1
P4040NXN1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER OVER NICKEL	BOTTOM	3.53 mm		37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES
MVF60NN152CMK50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm	YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
XPC8260CVVHFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm	YES	64	66.66 MHz	30	245	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e1
BSC9131NSE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm	YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P2020PXN2KFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
XPC7455RX600NC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		29 mm	YES	64	133 MHz			29 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	600 rpm	YES
P2020NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO	e2
P2020NSE2NHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
P4080NSE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	16	133.3 MHz			37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
XPC862PCZP66B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	2.05 mm		25 mm	YES	32				25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
PPC7455RX1000LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.65 V		36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.55 V				TIN LEAD	BOTTOM	3.22 mm		29 mm	YES	64	133 MHz			29 mm	CMOS		1.6 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	1000 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.