BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
BSC9132NSE7KNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm	23 mm		YES	64	100 MHz			23 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
P5020NXN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PXN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
XPC850SEZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM										CMOS	3.3 V		Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
P4040NSE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	133.3 MHz			37.5 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P2020NXE2HHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
SCIMX6D5EYM10CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, HEAT SINK/SLUG		1.35 V					BOTTOM	1.6 mm	21 mm		YES	64	24 MHz			21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES
P5040PSE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
T4161NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
P3041NXE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.04 V	0			GRID ARRAY		.96 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
XPC850DEZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
SCF5249VM140	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		24	32		GRID ARRAY			70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm	15 mm		YES	16	33.86 MHz	40	260	15 mm	CMOS	1.8 V			1 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	140 rpm	YES	e1
PPC7457RX1000NB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM										CMOS	1.1 V					X-PBGA-B			1000 rpm
P2020NXN2NHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
P2020PSE2NHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
BSC9131CSN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
MPE603RRX133LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50						BOTTOM										CMOS			Microprocessors	1.27 mm		S-XBGA-B255		Not Qualified	133 rpm
BSC9131CLN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131CLN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P2020PSN2HHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
P2020NSN2NFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
XPC7445RX600NC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V	36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm	25 mm		YES	64	133 MHz			25 mm	CMOS	1.3 V			1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
P2020PSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
P5040PXN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P2020NXN2KHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
SCIMX6Q5EYM12CE	NXP Semiconductors	MICROPROCESSOR		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V					BOTTOM	1.6 mm	21 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624			1200 rpm	YES
P5040NXE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
T4161NSN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
P2020PSE2NFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P3041NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P5020NXE7TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P2020PXN2KHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
XPC850ZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
P2020NSN2NHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
XPC750PRX400RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V		32		GRID ARRAY		2 V					BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS	2.05 V			1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	400 rpm	YES
T4161NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
P5021PXE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P2020PSE2KHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
MSCMMX6DZDK08AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	500	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES		0			GRID ARRAY, FINE PITCH			85 Cel		0 Cel		BOTTOM	1.8 mm	14 mm		YES	0			260	17 mm	CMOS				.65 mm	FIXED POINT	R-PBGA-B500	3		800 rpm	YES
P2020PSE2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
MGT5100TS/D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES		32	32		GRID ARRAY			85 Cel		-40 Cel		BOTTOM				NO	32					CMOS					FLOATING POINT	S-PBGA-B272		Not Qualified	66 rpm	YES
P5040PSN72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5040PXN7TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P2020NXE2NHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P4040NSN1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	133.3 MHz			37.5 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P2020NXN2HFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4		1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO	e2
XPC8260VVHFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e1
BSC9131NJN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.