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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | XPC823CZT25Z3 |
Description | MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | XPC823CZT25Z3 Datasheet |
In Stock | 1,586 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Speed: | 25 rpm |
Peripheral IC Type: | MICROPROCESSOR |
Integrated Cache: | YES |
Low Power Mode: | YES |
Boundary Scan: | YES |
Surface Mount: | YES |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 256 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Temperature Grade: | INDUSTRIAL |