Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
MICROPROCESSOR, RISC |
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Toshiba |
MICROPROCESSOR, RISC |
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Toshiba |
MICROPROCESSOR, RISC |
GULL WING |
240 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5,3.3 |
FLATPACK |
QFP240,1.3SQ,20 |
QUAD |
CMOS |
Microprocessors |
.5 mm |
S-PQFP-G240 |
Not Qualified |
133 rpm |
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Toshiba |
MICROPROCESSOR, RISC |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
16 |
GRID ARRAY |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
4.3 mm |
0 |
26.92 mm |
NO |
16 |
16.67 MHz |
26.92 mm |
CMOS |
50 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
16.67 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
13 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
BOTTOM |
1.4 mm |
13 mm |
NO |
32 |
11.52 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
CMOS |
3.3 V |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
Not Qualified |
92.16 rpm |
YES |
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Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
241 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
24 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-20 Cel |
BOTTOM |
1.2 mm |
12 mm |
YES |
16 |
10 MHz |
12 mm |
CMOS |
3.3 V |
.65 mm |
FLOATING POINT |
S-PBGA-B241 |
Not Qualified |
80 rpm |
YES |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
144 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK, FINE PITCH |
4.75 V |
70 Cel |
-10 Cel |
TIN LEAD |
QUAD |
4.45 mm |
20 mm |
8 MHz |
20 mm |
CMOS |
5 V |
.5 mm |
S-PQFP-G144 |
Not Qualified |
e0 |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK |
3 V |
70 Cel |
0 Cel |
QUAD |
3.05 mm |
14 mm |
8 MHz |
20 mm |
CMOS |
3.3 V |
.65 mm |
R-PQFP-G100 |
Not Qualified |
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Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
240 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.7 V |
32 |
32 |
FLATPACK, FINE PITCH |
2.3 V |
70 Cel |
0 Cel |
QUAD |
4.45 mm |
32 mm |
NO |
32 |
66.67 MHz |
32 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-PQFP-G240 |
Not Qualified |
133 rpm |
YES |
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|
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
20 |
64 |
1.5,3.3 |
GRID ARRAY |
BGA484,26X26,50 |
1.4 V |
70 Cel |
0 Cel |
BOTTOM |
2.46 mm |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133.3 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
35 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B484 |
Not Qualified |
333 rpm |
YES |
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Toshiba |
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|
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
20 |
64 |
1.5,3.3 |
GRID ARRAY |
BGA484,26X26,50 |
1.4 V |
70 Cel |
0 Cel |
BOTTOM |
2.46 mm |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
133.3 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
35 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B484 |
Not Qualified |
300 rpm |
YES |
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Toshiba |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
40 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
16 |
8 |
SMALL OUTLINE, SHRINK PITCH |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
2.8 mm |
0 |
8.8 mm |
BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY |
NO |
8 |
6 MHz |
17.5 mm |
CMOS |
22 mA |
5 V |
0 |
0 |
.8 mm |
FIXED POINT |
R-PDSO-G40 |
Not Qualified |
6 rpm |
YES |
e0 |
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|
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
193 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
24 |
32 |
1.5,2.5,3.3 |
GRID ARRAY |
BGA193,14X14,25 |
1.35 V |
85 Cel |
-20 Cel |
BOTTOM |
524288 |
YES |
16 |
40 MHz |
24576 |
CMOS |
74 mA |
Microcontrollers |
MROM |
.635 mm |
FIXED POINT |
S-PBGA-B193 |
Not Qualified |
40 rpm |
NO |
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Toshiba |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
IN-LINE |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
4.8 mm |
0 |
15.24 mm |
BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY |
NO |
8 |
8 MHz |
50.7 mm |
CMOS |
25 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
8 rpm |
YES |
e0 |
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Toshiba |
MICROPROCESSOR |
GULL WING |
132 |
QFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
32 |
FLATPACK |
QUAD |
33 MHz |
CMOS |
S-CQFP-G132 |
Not Qualified |
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Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
447 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.6 V |
0 |
64 |
64 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
3.3 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.24 mm |
0 |
52.32 mm |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
YES |
64 |
75 MHz |
52.32 mm |
CMOS |
3000 mA |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
YES |
e0 |
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Toshiba |
MICROPROCESSOR |
PIN/PEG |
128 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
32 |
GRID ARRAY |
PERPENDICULAR |
20.25 MHz |
CMOS |
S-CPGA-P128 |
Not Qualified |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
22 |
16 |
CHIP CARRIER |
4.75 V |
70 Cel |
3 |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
8 MHz |
19.1262 mm |
NMOS |
5 V |
0 |
0 |
1.27 mm |
FIXED POINT |
S-PQCC-J52 |
Not Qualified |
8 rpm |
NO |
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Toshiba |
MICROPROCESSOR, RISC |
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Toshiba |
MICROPROCESSOR |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
FLATPACK |
QUAD |
16.67 MHz |
CMOS |
S-PQFP-G132 |
Not Qualified |
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Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
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Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
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|
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
281 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
8 |
24 |
32 |
1.8/3.3,3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA281,18X18,25 |
1.35 V |
85 Cel |
12 |
-20 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
1536 |
57344 |
13 mm |
YES |
16 |
13.5 MHz |
13 mm |
57344 |
CMOS |
60 mA |
1.5 V |
8 |
7 |
Microcontrollers |
MROM |
.65 mm |
FIXED POINT |
S-PBGA-B281 |
Not Qualified |
54 rpm |
YES |
e1 |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
8 |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
5.08 mm |
15.24 mm |
5 MHz |
52.07 mm |
NMOS |
5 V |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
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Toshiba |
MICROPROCESSOR, RISC |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
4.89 mm |
47.5 mm |
47.5 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
180 rpm |
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Toshiba |
MICROPROCESSOR, RISC |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
64 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
23 |
16 |
FLATPACK |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
QUAD |
3.05 mm |
0 |
14 mm |
NO |
16 |
12.5 MHz |
20 mm |
CMOS |
35 mA |
5 V |
0 |
0 |
1 mm |
FIXED POINT |
R-PQFP-G64 |
Not Qualified |
12.5 rpm |
YES |
e0 |
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Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
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Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.7 mm |
28 mm |
NO |
74 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
74 rpm |
YES |
e0 |
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Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
281 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.3 V |
24 |
32 |
2.5,3,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA281,18X18,25 |
2.2 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
13 mm |
LOW POWER TAKEN FROM STANDBY MODE |
YES |
16 |
13.5 MHz |
13 mm |
CMOS |
110 mA |
2.5 V |
Microprocessors |
.65 mm |
FIXED POINT |
S-PBGA-B281 |
Not Qualified |
40.5 rpm |
YES |
e1 |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
16 |
GRID ARRAY |
4.75 V |
70 Cel |
7 |
0 Cel |
PERPENDICULAR |
2.59 mm |
0 |
26.92 mm |
NO |
16 |
10 MHz |
26.92 mm |
MOS |
30 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
10 rpm |
YES |
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Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
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Toshiba |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
16 |
8 |
CHIP CARRIER |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
29.21 mm |
BUILT-IN DYNAMIC RAM REFRESH CONTROLLER |
NO |
8 |
6 MHz |
29.21 mm |
CMOS |
27 mA |
5 V |
0 |
1 |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
Not Qualified |
6.144 rpm |
YES |
e0 |
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Toshiba |
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Toshiba |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
64 |
GRID ARRAY |
PERPENDICULAR |
CMOS |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
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|
Toshiba |
MICROPROCESSOR, RISC |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.31 V |
64 |
64 |
1.25,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,15X15,32 |
1.1875 V |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
13 mm |
YES |
64 |
133 MHz |
13 mm |
CMOS |
640 mA |
1.25 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B217 |
Not Qualified |
400 rpm |
YES |
e1 |
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Toshiba |
MICROPROCESSOR, RISC |
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|
Toshiba |
MICROPROCESSOR, RISC |
NOT SPECIFIED |
NOT SPECIFIED |
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Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.9 V |
13 |
32 |
2.7,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP208,1.2SQ,20 |
2.5 V |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1.7 mm |
28 mm |
NO |
32 |
12 MHz |
28 mm |
CMOS |
2.7 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
129 rpm |
YES |
e0 |
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Toshiba |
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|
Toshiba |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
64 |
1.5,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
1.4 V |
70 Cel |
0 Cel |
BOTTOM |
2.52 mm |
27 mm |
YES |
32 |
20 MHz |
30 |
260 |
27 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
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Toshiba |
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Toshiba |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
20 |
16 |
IN-LINE |
4.75 V |
70 Cel |
3 |
0 Cel |
DUAL |
5.08 mm |
0 |
15.24 mm |
NO |
8 |
8 MHz |
61.72 mm |
CMOS |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T48 |
Not Qualified |
8 rpm |
NO |
|||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
32 |
GRID ARRAY |
PERPENDICULAR |
12.5 MHz |
CMOS |
S-CPGA-P144 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
3.05 mm |
14 mm |
16.67 MHz |
20 mm |
CMOS |
4.75 V |
.65 mm |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK |
3 V |
70 Cel |
0 Cel |
QUAD |
3.15 mm |
14 mm |
8 MHz |
20 mm |
CMOS |
3.3 V |
.65 mm |
R-PQFP-G100 |
Not Qualified |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.