BGA Multi-functional Peripherals 83

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
STPCD0166BTI3	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32			GRID ARRAY		3 V	100 Cel	-40 Cel		BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCC4EEBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCC0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	66 rpm	e0
STPCV1KEBCE	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32			GRID ARRAY		3 V	105 Cel	-40 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	3.3 V			1.27 mm	S-PBGA-B388		Not Qualified
STPCI2EEYI	STMicroelectronics		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA	1.27 mm	S-PBGA-B516		Not Qualified		e0	24
STPCE1HDBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	133 rpm	e0	16
STPCC0366BTI3	STMicroelectronics		COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32			GRID ARRAY		3 V	70 Cel	0 Cel		BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	66 MHz			35 mm	CMOS	3.3 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCE1EDBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V	32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCI0180BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm	S-PBGA-B388		Not Qualified	80 rpm	e0	8
STPCE1EEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	100 rpm	e0	16
STPCI0166BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm	S-PBGA-B388		Not Qualified	66 rpm	e0	8
STPCI0180BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm	S-PBGA-B388		Not Qualified	80 rpm	e0	8
STPCE1HDBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	133 rpm	e0	16
STPCC0390BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.75 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3.15 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.45 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	90 rpm	e0	0
STPCI2GEYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.31818 MHz			35 mm	CMOS	2.5 V		USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified			24
STPCV1KEBI	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32		1.8,3.3	GRID ARRAY	BGA388,26X26,50	3 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs		1.27 mm	S-PBGA-B388		Not Qualified		e0
STPCC4HDBC	STMicroelectronics		OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCI2HEYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	14.31818 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified		e0	24
STPCI2GDYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.31818 MHz			35 mm	CMOS	2.5 V		USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified			24
STPCI2EEYC	STMicroelectronics		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA	1.27 mm	S-PBGA-B516		Not Qualified		e0	24
STPCD0166BTA3	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32			GRID ARRAY		3 V	115 Cel	-40 Cel		BOTTOM	2.38 mm		35 mm	-40 TO 115 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCC0310BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	100 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	100 rpm	e0
STPCI0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm	S-PBGA-B388		Not Qualified	66 rpm	e0	8
STPCI2HEYI	STMicroelectronics		INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	115 Cel	-40 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.31818 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified			24
STPCV1JEBI	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32		1.8,3.3	GRID ARRAY	BGA388,26X26,50	3 V	105 Cel	-40 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	3.3 V	Other Microprocessor ICs		1.27 mm	S-PBGA-B388		Not Qualified
STPCC0180BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	80 rpm	e0
STPCC5HEBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Multifunction Peripherals	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified		e0
STPCI2HEYC1	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	13			GRID ARRAY		2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm	128M	35 mm	SEATED HGT-CALCULATED	YES	64				35 mm	CMOS	2.5 V		I2C, IDE, ISA, PCI, USB, VGA	1.27 mm	S-PBGA-B516		Not Qualified		e0	16
STPCI2HDYI	STMicroelectronics		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.31818 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified		e0	24
STPCE1DDBC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V	32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
B4860NXN7QUMD	NXP Semiconductors		INDUSTRIAL	BALL	1020	BGA	SQUARE	PLASTIC/EPOXY	YES	1.08 V	16			GRID ARRAY		1.02 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.93 mm		33 mm		YES	64	133.333 MHz	30	250	33 mm	CMOS	1.05 V		USB; PCI; I2C	1 mm	S-PBGA-B1020	3			e1
XPC107APX100LC	NXP Semiconductors			BALL	503	BGA	SQUARE	PLASTIC/EPOXY	YES	2.625 V				GRID ARRAY		2.375 V				BOTTOM	2.75 mm	256	33 mm		YES		66 MHz	NOT SPECIFIED	NOT SPECIFIED	33 mm	CMOS	2.5 V		PCI	1.27 mm	S-PBGA-B503
HD64465BP	Renesas Electronics			BALL	387	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY					TIN SILVER COPPER	BOTTOM	2.48 mm		35 mm							35 mm	CMOS				1.27 mm	S-PBGA-B387		Not Qualified		e1
HD64465BQ	Renesas Electronics			BALL	387	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY					TIN SILVER COPPER	BOTTOM	2.48 mm		27 mm							27 mm	CMOS				1.27 mm	S-PBGA-B387		Not Qualified		e1
HD64463	Renesas Electronics			BALL	387	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY					TIN SILVER COPPER	BOTTOM	2.48 mm		35 mm							35 mm	CMOS				1.27 mm	S-PBGA-B387		Not Qualified		e1

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.