BGA Multi-functional Peripherals 83

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
STPCI2GDYI	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	14.31818 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified		e0	24
DW82801HBMSLJ4Y	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40					BOTTOM	2.49 mm		31 mm	PITCH_MINI	NO	32	48 MHz			31 mm	CMOS	1.05 V	Other uPs/uCs/Peripheral ICs	USB; PCI; I2C	1 mm	S-PBGA-B676		Not Qualified
NH82801HBMSLB9A	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40					BOTTOM	2.49 mm		31 mm	PITCH_MINI	NO	32	48 MHz			31 mm	CMOS	1.05 V	Other uPs/uCs/Peripheral ICs	USB; PCI; I2C	1 mm	S-PBGA-B676		Not Qualified
66AK2H06DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
NH82801GBM	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY	YES				1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS		Other Microprocessor ICs		1 mm	S-PBGA-B652		Not Qualified
NH82801GBM/SL8YB	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY	YES				1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS		Other Microprocessor ICs		1 mm	S-PBGA-B652		Not Qualified
NH82801GBSL8FX	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY	YES				1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS		Other Microprocessor ICs		1 mm	S-PBGA-B652		Not Qualified
AF82801IBM	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY						BOTTOM					NO			NOT SPECIFIED	NOT SPECIFIED		CMOS			PCI; USB; LPC		S-PBGA-B676
DW82801HBM	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		32			GRID ARRAY						BOTTOM	2.49 mm		31 mm	PITCH_MINI	NO	32	48 MHz			31 mm	CMOS	1.05 V		USB; PCI; I2C	1 mm	S-PBGA-B676
FW82801DB	Intel			BALL	421	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	32			GRID ARRAY		1.425 V				BOTTOM	2.59 mm	256	31 mm	ALSO REQUIRES 3.3V SUPPLY	NO	32	66 MHz			31 mm	CMOS	1.5 V		PCI; USB; LPC	1.27 mm	S-PBGA-B421	1				29
LE3100MICH/SL9PU	Intel			BALL	1284	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY						BOTTOM					NO						CMOS			PCI; SATA; SMBUS; UART; USB		S-PBGA-B1284					38
NH82801GB	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY	YES				1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40					BOTTOM											CMOS		Other Microprocessor ICs		1 mm	S-PBGA-B652		Not Qualified
NHE6300ESB	Intel			BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	64			GRID ARRAY		1.425 V				BOTTOM		256			NO	64	48 MHz				CMOS	1.5 V		PCI		S-PBGA-B689					4
XPC107APX100LB	Motorola			BALL	503	BGA	SQUARE	PLASTIC/EPOXY	YES	2.625 V	32			GRID ARRAY		2.375 V				BOTTOM	2.75 mm		33 mm		YES	64	100 MHz			33 mm	CMOS	2.5 V		PCI; I2C; 60X PROCESSOR	1.27 mm	S-PBGA-B503		Not Qualified			64
XPC107APX100LD	NXP Semiconductors			BALL	503	BGA	SQUARE	PLASTIC/EPOXY	YES	2.625 V				GRID ARRAY		2.375 V			TIN LEAD SILVER	BOTTOM	2.75 mm	256	33 mm		YES		66 MHz			33 mm	CMOS	2.5 V		PCI	1.27 mm	S-PBGA-B503				e0
66AK2H06DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H06DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
OMAP3630	Texas Instruments			BALL	515	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY						BOTTOM					NO						CMOS			I2C; SPI; UART; USB		S-PBGA-B515
66AK2H06DAAWA2	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H14DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H14DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H12DAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H14DXAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H12DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H12DAAWA2	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H12DXAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
66AK2H12DAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	32			GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm		YES	128		30	245	40 mm	CMOS	1 V		ETHERNET; I2C; PCI; SPI; UART; USB	1 mm	S-PBGA-B1517	4			e1	32
STPCE1HEBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified			16
STPCD0175BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	75 rpm	e0
STPCI2HDYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.31818 MHz			35 mm	CMOS	2.5 V	Other Microprocessor ICs	USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified			24
STPCV1KEBC	STMicroelectronics		COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32		1.8,3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs		1.27 mm	S-PBGA-B388		Not Qualified		e0
STPCC4HEBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Multifunction Peripherals	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified		e0
STPCE1EEBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	100 rpm	e0	16
STPCC0166BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	66 rpm	e0
STPCD0175BTI3	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32			GRID ARRAY		3 V	100 Cel	-40 Cel		BOTTOM	2.38 mm		35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCE1DDBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V	32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCC4HEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Multifunction Peripherals	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified		e0
STPCC4EEBC	STMicroelectronics		OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCC0366BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	66 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	66 rpm	e0
STPCE1EDBC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V	32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCE1HDC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V	32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCD0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	66 rpm	e0
STPCC4HDBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified
STPCI2GEYI	STMicroelectronics			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm		35 mm		YES	32	14.31818 MHz			35 mm	CMOS	2.5 V		USB; PCI; ISA; PCMCIA	1.27 mm	S-PBGA-B516		Not Qualified			24
STPCC5HEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		YES	32	14.318 MHz			35 mm	CMOS	2.5 V	Multifunction Peripherals	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified		e0
STPCC0180BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm		NO	32	14.318 MHz			35 mm	CMOS	3.3 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	80 rpm	e0
STPCE1HEBC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	2.7 V	32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm		35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm	CMOS	2.5 V		PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified			16
STPCC0375BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	3.75 V	32	32	3.3	GRID ARRAY	BGA388,26X26,50	3.15 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm		35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm	CMOS	3.45 V	Microprocessors	PCI; ISA	1.27 mm	S-PBGA-B388		Not Qualified	75 rpm	e0	0

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.