BALL Multi-functional Peripherals 503

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
DRA716BHGCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		800 rpm		e1	186
DRA776PPIGACDRQ1	Texas Instruments		AUTOMOTIVE	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	32			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		2.5M	23 mm		YES	64	38.4 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B784	3		1800 rpm		e1	247
DRA725AGGABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	8	AEC-Q100	16			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		512K	23 mm		YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B760	3		1176 rpm	YES	e1	215
DRA722AHGABCRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		512K	23 mm		YES	32	27 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B760	3		800 rpm	YES	e1	215
DRA790BAGCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm		512K	17 mm		YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		300 rpm		e1	186
TDA2HFBTQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100				GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		2.5M	23 mm		YES		38.4 MHz		250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1176 rpm		e1	247
MAXQ617V-L000+T	Analog Devices	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	16	FBGA	SQUARE	PLASTIC/EPOXY		YES					16	1.8/3.3	GRID ARRAY, FINE PITCH	BGA16,4X4,16		70 Cel	-20 Cel	TIN SILVER COPPER NICKEL	BOTTOM		81920							30	260		4096		3.5 mA			Microcontrollers	FLASH		.4 mm		S-PBGA-B16	1	Not Qualified	12 rpm		e2
STPCE1HEBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified				16
STPCD0175BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	75 rpm		e0
STPCI2HDYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm			35 mm		YES	32	14.31818 MHz			35 mm		CMOS		2.5 V		Other Microprocessor ICs		USB; PCI; ISA; PCMCIA	1.27 mm		S-PBGA-B516		Not Qualified				24
STPCV1KEBC	STMicroelectronics		COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32		1.8,3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			1.27 mm		S-PBGA-B388		Not Qualified			e0
STPCC4HEBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Multifunction Peripherals		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified			e0
STPCE1EEBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	100 rpm		e0	16
STPCC0166BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0
STPCD0175BTI3	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32			GRID ARRAY		3 V	100 Cel	-40 Cel		BOTTOM	2.38 mm			35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCE1DDBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V			32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCC4HEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Multifunction Peripherals		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified			e0
STA2065N	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	372	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V						GRID ARRAY, THIN PROFILE, FINE PITCH	BGA372,24X24,25	1.2 V	85 Cel	-40 Cel		BOTTOM	1.2 mm		32K	16 mm		YES					16 mm		CMOS		1.25 V				CAN, I2C, I2S, SPI, SSP, UART USB	.65 mm		S-PBGA-B372
STPCC4EEBC	STMicroelectronics		OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCC0366BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	66 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0
STPCE1EDBC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V			32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCE1HDC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V			32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCD0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0
STPCC4HDBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCI2GEYI	STMicroelectronics			BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm			35 mm		YES	32	14.31818 MHz			35 mm		CMOS		2.5 V				USB; PCI; ISA; PCMCIA	1.27 mm		S-PBGA-B516		Not Qualified				24
STPCC5HEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	OTHER	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32		3.3	GRID ARRAY	BGA388,26X26,40	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Multifunction Peripherals		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified			e0
ST2100TR	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	373	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			15			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA373,23X23,20	1.08 V	85 Cel	-40 Cel		BOTTOM	1.2 mm		8192	12 mm		YES	16		NOT SPECIFIED	NOT SPECIFIED	12 mm		CMOS		1.2 V	4			CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB	.5 mm		S-PBGA-B373						40
STPCC0180BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0
STPCE1HEBC	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified				16
STA2065P	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	372	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V						GRID ARRAY, THIN PROFILE, FINE PITCH	BGA372,24X24,25	1.2 V	85 Cel	-40 Cel		BOTTOM	1.2 mm		32K	16 mm		YES					16 mm		CMOS		1.25 V				CAN, I2C, I2S, SPI, SSP, UART USB	.65 mm		S-PBGA-B372
STPCC0375BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.75 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3.15 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.45 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	75 rpm		e0	0
STPCD0166BTI3	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32			GRID ARRAY		3 V	100 Cel	-40 Cel		BOTTOM	2.38 mm			35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCC4EEBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCC0166BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0
STPCV1KEBCE	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32			GRID ARRAY		3 V	105 Cel	-40 Cel		BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		3.3 V					1.27 mm		S-PBGA-B388		Not Qualified
STPCI2EEYI	STMicroelectronics		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32		2.5,3.3	GRID ARRAY	BGA516,26X26,50	2.45 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Other Microprocessor ICs		USB; PCI; ISA	1.27 mm		S-PBGA-B516		Not Qualified			e0	24
STPCE1HDBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	133 rpm		e0	16
STPCC0366BTI3	STMicroelectronics		COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32			GRID ARRAY		3 V	70 Cel	0 Cel		BOTTOM	2.38 mm			35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	66 MHz			35 mm		CMOS		3.3 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCE1EDBI	STMicroelectronics			BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.75 V			32			GRID ARRAY		2.25 V				BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V				PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified
STPCI0180BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0	8
STPCE1EEBC	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL EXTENDED	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	100 rpm		e0	16
STA2065A	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	372	TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V						GRID ARRAY, THIN PROFILE, FINE PITCH	BGA372,24X24,25	1.2 V	85 Cel	-40 Cel		BOTTOM	1.2 mm		32K	16 mm		YES					16 mm		CMOS		1.25 V				CAN, I2C, I2S, SPI, SSP, UART USB	.65 mm		S-PBGA-B372
STPCI0166BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	66 rpm		e0	8
STPCI0180BTI3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3 V	115 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	-40 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.3 V		Microprocessors		PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2	1.27 mm		S-PBGA-B388		Not Qualified	80 rpm		e0	8
STPCE1HDBI	STMicroelectronics	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32	32	2.5,3.3	GRID ARRAY	BGA388,26X26,50	2.45 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	-40 TO 115 C OPERATING CASE TEMPERATURE	YES	32	14.318 MHz			35 mm		CMOS		2.5 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	133 rpm		e0	16
STPCC0390BTC3	STMicroelectronics	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.75 V			32	32	3.3	GRID ARRAY	BGA388,26X26,50	3.15 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm	0 TO 100 OPERATING CASE TEMPERATURE	NO	32	14.318 MHz			35 mm		CMOS		3.45 V		Microprocessors		PCI; ISA	1.27 mm		S-PBGA-B388		Not Qualified	90 rpm		e0	0
STPCI2GEYC	STMicroelectronics		OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	2.7 V			32			GRID ARRAY		2.45 V	85 Cel	0 Cel		BOTTOM	2.38 mm			35 mm		YES	32	14.31818 MHz			35 mm		CMOS		2.5 V				USB; PCI; ISA; PCMCIA	1.27 mm		S-PBGA-B516		Not Qualified				24
STPCV1KEBI	STMicroelectronics		INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32		1.8,3.3	GRID ARRAY	BGA388,26X26,50	3 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	2.38 mm			35 mm		YES	32	14.318 MHz			35 mm		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			1.27 mm		S-PBGA-B388		Not Qualified			e0

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.